Experience MRSI’s Advanced Photonics Assembly Solutions at CIOE 2026

At this year’s show, MRSI will showcase solutions designed to support the next generation of optical transceivers, silicon photonics, co-packaged optics, and other advanced photonic devices. Featured technologies will include the MRSI-LEAP Ultra-High-Speed Die Bonder and the MRSI-A-L Active Aligner, along with augmented reality experiences for the MRSI-705 and MRSI-H platforms.

Explore MRSI-705 and MRSI-H in Augmented Reality

Attendees will have the opportunity to experience MRSI systems in a new interactive way through augmented reality. The MRSI-705 AR experience brings the system to life in a 3D environment, highlighting key features, flexible configurations, and precision engineering that make it a trusted solution for advanced die bonding applications.

The MRSI-H augmented reality experience will also be available, giving visitors another way to explore MRSI’s high-precision die bonding technology and understand how these platforms support demanding photonics assembly requirements.

Featured Solutions at CIOE 2026

MRSI-LEAP Ultra-High-Speed Die Bonder: MRSI-LEAP is a true 1 micron die bonder, built for AI high-volume optical transceivers production, combining high precision, throughput, and stability in one platform. It supports eutectic, epoxy stamping, UV epoxy dispensing, in-situ UV curing, and flip-chip bonding. MRSI-LEAP has unique multi-die eutectic process capabilities, which can significantly improve the 1.6T transceiver multi die eutectic efficiency.

The system supports up to two 8-inch wafers and two 6-inch wafers, with a built-in conveyor, magazine design for improving efficiency and throughput.

MRSI-A-L Active Aligner: MRSI-A-L is a flexible active alignment platform that can be customized based on the application. With options such as single or dual 6-axis alignment stages, in-situ UV cure, traceability, epoxy stamping, dispensing, temperature-controlled baseplate, and material handling flexibility, the system is designed to support precise and repeatable optical assembly processes. It is a fully automated solution to support the lens and FAU alignment process in high-speed transceivers and CPO products.

MRSI-705 Die Bonder: Known for its flexibility, the MRSI-705 supports applications ranging from R&D prototyping to low- and medium-volume production, with optional patented turret technology for “on-the-fly” tool change to help increase output without sacrificing process flexibility.

Supporting the Growth of Optical Communications

As AI-driven demand continues to accelerate the need for advanced optical devices, manufacturers are seeking equipment that can deliver accuracy, throughput, repeatability, and process flexibility at scale. MRSI’s portfolio of die bonding and active alignment solutions is built to help customers meet these requirements across applications such as optical transceivers, silicon photonics, chip-on-carrier, chip-on-submount, chip-on-baseplate, PCB, and gold box assembly.

Visit MRSI at CIOE 2026

Join MRSI Mycronic at CIOE 2026 in Shenzhen, China, from September 9–11 at Booth #10B79. Meet with the MRSI team to learn more about our latest photonics assembly solutions, experience the MRSI-705 and MRSI-H in augmented reality, and see how the MRSI-LEAP and MRSI-A-L can support advanced optical manufacturing needs.

Register today to plan your visit and connect with the MRSI team at CIOE 2026.

Infostone Optical Communications Conference (IFOC 2026)

During the same week as CIOE 2026, MRSI Mycronic will also participate in the 24th Infostone Optical Communications Conference (IFOC 2026), held September 6–8, 2026, in Shenzhen, China. Dr. Limin Zhou will present “Packaging Leaps – Driving the AI Optical Modules Revolution” highlighting the packaging defines the optical module performance ceiling, and the process automation determines how fast we reach it; together, they will define leadership in the AI optical interconnect era.

The explosive growth of AI computing is redefining the landscape of optical module packaging. Traditional pluggable modules, NPO, and CPO are advancing in parallel, shaped by scenario-specific differentiation and synergistic evolution. In 2026, CPO is approaching a commercial tipping point toward mass adoption. Packaging technology is transitioning from a reactive enabler to a proactive driver—no longer dictated by module requirements, but actively redefining the performance ceiling of optical modules through packaging innovation. Packaging has become the decisive factor in unlocking AI computing power. The ability to deliver fully automated assembly solutions tailored to diverse packaging architectures is the critical foundation that turns this potential into industrial reality.