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28 AUG 2024, 20:00
NEWS
DIE BONDING SOLUTIONS

MRSI is proud to be exhibiting and presenting at the 25th China International Optoelectronic Exposition this year in Shenzhen. Stop by our booth #10B79 to learn more about how MRSI products meet all optical transceiver bonding and attach needs. We will showcase our latest die bonding, active alignment, and dispensing solutions.

Contact us to schedule a meeting at CIOE.

MRSI to Exhibit at CIOE 2024

Register for CIOE MRSI, Mycronic Group (cioe.cn)

EPIC TechWatch at CIOE

On September 11th, Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI Mycronic, and General Manager of MRSI Automation (Shenzhen) Co., Ltd will present “AI-Driven Innovation in Optoelectrical Packaging” at the EPIC (European Photonics Industry Consortium) TechWatch at CIOE.

Register here.

 

Dr. Limin Zhou will present at the China International Optoelectronic Conference

Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Mycronic and General Manager of MRSI Automation (Shenzhen) Co., Ltd will present “The evolution of optoelectronic integrated packaging in the AI era” during the Optoelectronic Chip Design, Manufacturing, and Packaging Technology Forum on September 12, 2024. He will provide insights into the challenges and opportunities of optoelectronic integrated chip assembly within the context of artificial intelligence.

Learn more about the conference