Join Us at IMAPS CHIPcon 2025: Shaping the Future of Chip Technology
We are excited to participate in IMAPS CHIPcon, the premier event for Chiplet and Heterogeneous Integration Packaging (CHIP) technology, from July 7–10, 2025, in San Jose, CA. This conference addresses key challenges and opportunities in advancing chiplet architectures for broader adoption.
Event Highlights
- Conference: July 7–10, 2025
- Exhibition: July 8–9, 2025
The event features insightful keynotes, panel discussions, and workshops, along with an exhibition showcasing cutting-edge solutions.
Visit Us
Join us at table #5 to explore our latest innovations in flip-chip die bonding, active alignment, and fluid dispensing. Our team will be available to discuss how we are addressing critical challenges in microelectronics packaging.
Why Attend
- Connect with professionals and experts from AMD, Broadcom, Cadence, IBM, Intel, NVIDIA, Samsung, Siemens, Synopsys, and Teradyne.
- Discover advanced solutions shaping the future of chip technology.
- Network with global experts and peers in the field.
Mark your calendar—don’t miss this opportunity to experience the future of chip technology firsthand. We look forward to connecting with you in San Jose.
For more information and to register, visit: CHIPcon | IMAPS