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20 APR 2022, 21:00
NEWS
DIE BONDING SOLUTIONS

The iMAPS New England Symposium and Expo will be held in Boxborough, MA on May 3rd, 2022 at the Boxboro Regency Hotel.

Technical sessions include Advanced Packaging, RF& Microwave – 5G Innovations and Microwave Emerging Technology, Interconnect Technology, Thermal Management, Photonics & Optoelectronics Packaging, MEMs, and University Innovations in Technology. Read the iMAPS New England Symposium program for more details.

MRSI to present

MRSI is a Platinum Sponsor of iMAPS New England this year. Dr. Yi Qian, MRSI’s VP & GM, has been co-chairing the Photonics & Optoelectronics Packaging session for four years. Peter Cronin, Director of Applications and Service, MRSI Systems will be presenting: “Challenges and Solutions in the Automated Assembly of Photonics and RF Devices for 5G Wireless Network.”

MRSI’s die bonding solutions for photonics packaging

Please visit the MRSI booth to learn more about our die bonding and epoxy dispensing solutions for a wide range of applications.

Contact MRSI Systems to learn about our assembly solutions. Visit MRSI at iMAPS New England on May 3rd. We hope to see you there.

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