MRSI Mycronic | MRSI-LEAP High-Speed Die Bonder Receives "Optical Communication Innovation Product Award" at CFCF2025
MRSI Mycronic received the "Optical Communication Innovation Product Award" at the CFCF2025 Optical Connectivity Conference. Our MRSI-LEAP High-Speed die bonder was recognized for its precision and stability, excelling in multi-die eutectic bonding without multiple reflow processes and high accuracy epoxy bonding processes.
Continuous Innovation
The MRSI-LEAP High-Speed die bonder is specifically engineered to meet the rigorous demands of high-volume optical module manufacturing. It accommodates various packaging configurations, including Chip-on-Carrier (CoC), Chip-on-Submount (CoS), and Chip-on-Board (CoB). With exceptional efficiency and precision, it delivers continuous, high-accuracy die-attach performance, making it ideally suited for the mass production requirements of AI-driven high-speed optical modules.
Functional Integration
The MRSI-LEAP is a China-designed, high-precision, high-speed, and highly reliable automatic die bonder designed for advanced optoelectronic packaging. It supports various chip input formats, including wafers, waffle packs, Gel-Pak®, and custom fixtures. Its automatic tool-switching capability handles chips of different sizes. The high-throughput design includes a conveyor system compatible with single or multiple magazine inputs, effectively transporting carriers such as AOCs, CoB, gold-box, and CoC components. It also provides advanced process options like epoxy bonding, eutectic bonding, flip-chip bonding, and wafer-level packaging. This innovative system achieves high placement accuracy in high-speed, high-volume, multi-process optoelectronic packaging.
Technical Highlights
✔ High Precision & High Efficiency:
The MRSI-LEAP die bonder maintains MRSI’s stability while increasing speed, positioning it as a highly efficient machine. It aims to improve productivity and lower manufacturing costs.
✔ High Speed Epoxy Bonding Technology:
Designed for high speed optical transceivers production, MRSI-LEAP excels at Chip-on-Carrier (CoC), Chip-on-Submount (CoS), and Chip-on-Board (CoB) assemblies utilizing epoxy processes. Advanced process options such as flip-chip bonding, UV epoxy dispensing, in-situ UV curing, and wafer-level packaging are also available.
✔ Synchronized Multi-Die Eutectic Assembly Technology:
The MRSI-LEAP, with its ultra-fast heating/cooling eutectic station and multi-die pickup heads, allows simultaneous bonding of multiple dies with independent force control. This improves yield, reduces cycle time, and eliminates the need for multiple reflows.
✔ 100% Indigenous Technology:
Developed and manufactured entirely in China, the MRSI-LEAP avoids technology embargo risks and import tariffs, ensuring a more reliable supply chain for customers.
Empowering the Industry
With the global surge in demand for AI high-speed optical modules, the MRSI-LEAP has emerged as a new benchmark in high-end packaging equipment, driving industry-wide advancements with its cutting-edge specifications and localized support.
Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems and General Manager of MRSI Automation (Shenzhen), stated:
"We sincerely appreciate the industry’s recognition of the MRSI-LEAP. We firmly believe that a great equipment provider must also be a trusted process partner. Over the years, we’ve leveraged hands-on process expertise to solve real-world challenges, demonstrated performance through prototyping, and met unique needs via joint development. This award validates our approach and honors our partners. Moving forward, we remain committed to advancing the industry through innovation and collaboration."