News

Driving the Future: Dr. Limin Zhou to Present on AI-Driven Optical Module Packaging at the Innovation Conference on CPO (Co-Packaged Optics) and Heterogeneous Integration Technology

The Innovation Conference on CPO and Heterogeneous Integration Technology will take place September 4-6, 2025, in Wuxi, China. During the conference, Dr. Limin Zhou will discuss recent and upcoming advancements in high-speed optical module packaging.

MRSI Mycronic | MRSI-LEAP High-Speed Die Bonder Receives "Optical Communication Innovation Product Award" at CFCF2025

MRSI Mycronic received the "Optical Communication Innovation Product Award" at the CFCF2025 Optical Connectivity Conference. Our MRSI-LEAP High-Speed die bonder was recognized for its precision and stability, excelling in multi-die eutectic bonding without multiple reflow processes and high accuracy epoxy bonding processes.

Join Us at IMAPS CHIPcon 2025: Shaping the Future of Chip Technology

We are excited to participate in IMAPS CHIPcon, the premier event for Chiplet and Heterogeneous Integration Packaging (CHIP) technology, from July 7–10, 2025, in San Jose, CA. This conference addresses key challenges and opportunities in advancing chiplet architectures for broader adoption.

MRSI-LEAP Ultra-High-Speed Die Bonders: Revolutionizing High-Volume Manufacturing

Ultra-high-speed die bonding technology is pivotal in modern manufacturing, particularly for optical modules production. The MRSI-LEAP Ultra-High-Speed Die Bonders exemplify this advancement, offering unmatched efficiency, precision and flexibility.

MRSI to Exhibit at NEPCON Thailand

We are pleased to announce we are exhibiting with our distributor PREM at NEPCON Thailand, scheduled from June 18-21, 2025, at BITEC in Bangkok.

What is the significance of co-planarity in die bonding?

At the recent IMAPS Conference in Arizona, co-planarity in die bonding was a key topic due to its importance in 2.5 and 3D chip stacking. Ensuring co-planar surfaces is crucial for the performance of vertically integrated devices, as it affects pad/pillar contact. Optimizing planarity involves specific variables, especially in die stacking and copper pillar processes where bonding surfaces must be co-planar.

Join MRSI at the International Microwave Symposium in San Francisco

The International Microwave Symposium (IMS) is an annual conference for professionals in the microwave and RF industry. This year's event will be held in San Francisco, CA, USA, from June 15-20th, 2025. The week will include various technical sessions, keynote speakers, and networking events.

Learn more about our active alignment solutions

The MRSI-A-L machine is a versatile optical active alignment platform suitable for a wide range of applications.

Dr. Limin Zhou to present at the Semiconductor Advanced Technology Innovation Development and Opportunities Conference

Join MRSI Mycronic at IMAPS New England in May!

MRSI Mycronic will be exhibiting, sponsoring, and presenting at the IMAPS New England event on May 6th, 2025. This event is known for gathering industry leaders, innovators, and enthusiasts in the field of microelectronics and packaging, providing a platform for networking, showcasing new technologies, and discussing the latest trends.

MRSI-H1: Comprehensive High-Precision Die Bonding Solutions

In the fast-paced world of photonics manufacturing, having the right tools can make all the difference. The MRSI-H1 is designed to meet the demands of high-volume production with its ultra-precision 1-micron flip-chip die bonders. These machines are not only flexible and fast, but also ideal for a wide range of applications.

Join us at OFC!

Join us at the upcoming events!

MRSI Mycronic will be participating in several optical and device packaging exhibitions. We invite you to attend these upcoming events. We look forward to discussing our latest product innovations with you. Discover how MRSI is advancing the future of electronics.

MRSI-A-L Active Aligner Wins Infostone 2024 Award for "Most Competitive Optical Communication Product"

On December 6, 2024, Infostone successfully held its 2024 Annual Summary and the 11th Heroes List Award live conference. Awards presented included "The Most Competitive Products of Optical Communication," "Excellent Quality Award," "Outstanding Technology Award," and "Brand Recommended Award." MRSI Mycronic's MRSI-A-L Active Aligner received the "The Most Competitive Products of Optical Communication" award from Infostone China.

Explore Innovations in Optics and Photonics at SPIE Photonics West 2025

MRSI Mycronic to Sponsor and Exhibit at the 2025 Chiplet Summit

Versatile package handling capabilities: dewar and beyond

The Next Generation MRSI-175Ag Epoxy Dispenser is now available

In the fast-paced world of advanced packaging and semiconductor manufacturing, precision and efficiency are paramount.

Innovation Continues on MRSI-705HF

MRSI Mycronic to Present at the 7th Annual Automotive LIDAR Conference

Meet the MRSI-705: Your Essential Tool for Precision and Reliability in Critical Applications

The MRSI-705 has established itself as a reliable tool in the aerospace, defense, and medical industries, playing a crucial role in mission-critical tasks due to its performance, adaptability, and dependability.

MRSI Support for Application Specific Pickup Tip Designs

The MRSI-705 features an innovative design with a versatile thirteen-position tool bank for quick, automatic tool changes. Enhanced functionality is achieved with additional tool change banks, expanding the number of tools that are stored on the machine at one time. 

Advanced Patented Tool Change Turret from MRSI: Revolutionizing Precision Technology

MRSI’s die bonding systems are designed to address the challenges of chip packaging with a focus on efficiency, precision, and productivity. These systems feature an advanced, patented tool-changing turret that enhances operational efficiency.

Register for the Laser Focus World Webinar: Gen AI: Catalyst for Optical Module Innovation

Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Mycronic and General Manager of MRSI Automation (Shenzhen) Co., Ltd., Shenzhen, China will present “Gen AI: Catalyst for Optical Module Innovation” on Thursday, September 26th.

Join us at IMAPS in Boston!

MRSI Mycronic is exhibiting at the 57th International Symposium on Microelectronics from October 1-2, 2024, in Boston, MA. The event will take place at the Encore Boston Harbor from October 1-3, 2024, and will feature 5 technical tracks and an Interactive Poster Session.

Join MRSI at the 50th European Conference on Optical Communication

We are pleased to be exhibiting again this year at the 50th ECOC in Frankfurt am Main, Germany.

Dr. Limin Zhou to present at the 22nd Infostone Optical Communication and Market Technology Conference (IFOC 2024)

Mark your calendars for September 9-10, 2024, at the InterContinental Hotel of the Shenzhen World Exhibition and Convention Center in Shenzhen, China, which hosts the highly anticipated Infostone Optical Communication and Market Technology Conference. This year’s conference promises to be a hub of innovation and insight, focusing on cutting-edge trends and technologies shaping the future of the industry.

Join MRSI Mycronic at the China International Optoelectronic Exposition (CIOE)

MRSI is proud to be exhibiting and presenting at the 25th China International Optoelectronic Exposition this year in Shenzhen. Stop by our booth #10B79 to learn more about how MRSI products meet all optical transceiver bonding and attach needs. We will showcase our latest die bonding, active alignment, and dispensing solutions.

Mastering the Art of Handling Delicate High Aspect Ratio Dies: Challenges and Solutions

Handling delicate, large aspect ratio, and thin dies is essential across various applications, including RF Power, Optical, and MEMS. These devices have aspect ratios exceeding 45 to 1, presenting unique challenges.

The High-Performance and Flexible MRSI A-L for Optical Assembly

The optical components industry demands highly precise and customized equipment for complex optical assembly processes. We have answered this need with our new active aligner – a high-performance and flexible solution for manufacturing transceivers, AWGs, LiDAR, silicon photonics, integrated optics, and more.