Go to main content
Die bonding
Search
Contact us
Menu
Die bonding
Close
Search
About us
History
Service & support
Why do customer's choose MRSI?
Career
Partners
Testimonials
About us
Under the MRSI brand, we offer industry-leading die bonders, with superior flexibility, ultra-high-accuracy, and multiple process options. Our product’s' value is further illustrated by our 40+ years of experience in the industry in tandem with our 24/7 reliable field operations.
Visit page About us
History
Service & support
Why do customer's choose MRSI?
Career
Partners
Testimonials
Products
High Precision Flip-chip Die Bonders
Submicron Die Bonders
1 Micron Die Bonders
MRSI-LEAP High-Speed Die Bonders
1.5 Micron Die Bonders
3 Micron Die Bonders
5 Micron Die Bonders
High Precision Epoxy Dispensers - MRSI-175Ag
Active Aligners - MRSI-A-L
Prototyping and Training Services
Prototyping
MRSI Systems Training Services
Products
MRSI values our customers, and our top priority is meeting our customers needs down to the finest detail. We are proud that all of our products are industry-leading, with superior flexibility, ultra-high-accuracy, and multiple process options.
Visit page Products
High Precision Flip-chip Die Bonders
Submicron Die Bonders
1 Micron Die Bonders
MRSI-LEAP High-Speed Die Bonders
1.5 Micron Die Bonders
3 Micron Die Bonders
5 Micron Die Bonders
High Precision Epoxy Dispensers - MRSI-175Ag
Active Aligners - MRSI-A-L
Prototyping and Training Services
Prototyping
MRSI Systems Training Services
Applications
Photonics
AOC
High Power Laser Diodes
Optical Components & Transceivers
Silicon Photonics
TO-TOSA/ROSA
Microwave & RF
RF Power Amplifier & Microwave Device
Microelectronics
Sensors
LIDAR, AR/VR/MR
Wafer Level Packaging
Applications
Visit page Applications
Photonics
AOC
High Power Laser Diodes
Optical Components & Transceivers
Silicon Photonics
TO-TOSA/ROSA
Microwave & RF
RF Power Amplifier & Microwave Device
Microelectronics
Sensors
LIDAR, AR/VR/MR
Wafer Level Packaging
Processes
Die bonding
Eutectic die bonding
Epoxy die bonding
Processes
Visit page Processes
Die bonding
Eutectic die bonding
Epoxy die bonding
Gallery
Video gallery
Image gallery
Gallery
Visit page Gallery
Video gallery
Image gallery
News & events
Events
Webinars
Press releases
News
Cases
Technical articles archive
Newsletters archive
News & events
Visit page News & events
Events
Webinars
Press releases
News
Cases
Technical articles archive
Newsletters archive
Contact us
MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
Contact us
Visit our contact page for contact details for our sales and support departments.
Visit page Contact us
MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
Mycronic Global
Log in
Home
News & events
Press releases
Press releases
27 NOV 2019, 16:00
MRSI HVM系列贴片机荣获Laser Focus World创新者奖
25 NOV 2019, 16:00
MRSI receives Laser Focus World Innovators Award for HVM die bonder
22 OCT 2019, 14:00
MRSI to offer die bonding demonstrations at Productronica
29 AUG 2019, 19:00
MRSI Systems 热烈欢迎贺尉宗出任中国区销售总监
29 AUG 2019, 15:00
08/29/19 – MRSI Systems welcomes Hendry He as China Country Sales Director
23 AUG 2019, 15:15
MRSI to present at 18th ICCSZ OC Market and Technology Seminar and offer die bonder demonstrations at CIOE
23 AUG 2019, 15:15
MRSI将出席第18届ICCSZ OC市场与技术研讨会,并在CIOE提供贴片演示
20 AUG 2019, 15:00
MRSI宣布MRSI-H / HVM系列贴片机精度提升至1.5微米
20 AUG 2019, 15:00
MRSI improves accuracy to 1.5 micrometers for MRSI-H/HVM-Series die bonders
13 FEB 2019, 15:00
MRSI Systems欢迎资深光电子专家周利民博士出任战略营销高级总监
1
...
4
5
6
7
8
3/28/2026 10:11:26 PM