Go to main content

Die bonding
Contact us
Mycronic Global Log in

Press releases

1 JUN 2018, 18:00

Mycronic acquires MRSI Systems, LLC
6 MAR 2018, 17:30

MRSI Systems’ New Product MRSI-HVM3 Die Bonder Has Entered Volume Production Driven by Fast and Wide Customer Adoptions
6 OCT 2017, 19:30

MRSI Systems Receives Funding from State of Massachusetts for Advanced Manufacturing Initiative
25 AUG 2017, 23:00

MRSI Systems Will Demonstrate New Product MRSI-HVM3 and Sponsor the 1st Laser Executive Forum at CIOE in Shenzhen, China, September 6-9, 2017
25 AUG 2017, 23:00

MRSI Systems将在深圳中国国际光电博览会(CIOE)上展示新产品 MRSI-HVM3 并赞助第一届国际激光技术高端论坛
14 AUG 2017, 21:00

MRSI Systems Launches High Speed Die Bonder for Photonics High Volume Manufacturing
14 AUG 2017, 21:00

MRSI Systems 推出用于大批量生产光电子器件的高速贴片机
20 MAR 2017, 18:00

MRSI Systems Delivered 3-Micron Die Bonder MRSI-M3 to AIM Photonics Academy’s Education and Practice Factory at MIT in Cambridge for Research and Education
24 MAY 2016, 15:00

MRSI Systems Provides MRSI-M3 Die Bonding Assembly Work Cell to Fabrinet in Silicon Valley for Fast Prototyping and New Product Introduction
12 AUG 2015, 15:00

In-Line Eutectic for Direct Eutectic or Solder Reflow for GaAs & GaN