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MRSI-H1 FAMILY

  • High speed
  • Advanced ultra precision solution for flexibility and speed
  • Ultra precision 1-micron flip-chip die bonders for high volume manufacturing

Benefits of MRSI-H1 Family 

The MRSI-H1 family provides proven superior flexibility for true multi-die, multi-process, multi-product, high-volume, high-mix production. These high-speed products deliver the industry-leading speed without sacrificing flexibility, precision or reliability. The MRSI-H1 family targets the manufacturing challenges driven by AI cluster expansion, wireless network rollout and LIDAR market for autonomous driving.

MRSI-H1

  • This standard system is widely used in advanced photonics such as lasers, receivers, transceivers, lighting, and sensors, etc.
  • Carries key technological building blocks from our field-proven, flexible and high-speed MRSI-HVM platform
  • Heated head option designed for the higher density eutectic packaging
  • “On-the-fly” patented auto tool changer has twelve vacuum tips/collets integrated on the bonding head for zero time tool change

Value to our Customers

  • Industry leading throughput, superior flexibility, and ultra-high-accuracy in high-volume, high-mix manufacturing
  • Easy to use icon-based interface running on a Windows™ platform for ease of programming, and low-cost machine maintenance.
  • Industry leading local technical support teams and application expertise
  • 40+ years of experiences in the industry with reliable 24/7 field operation

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MRSI-H1

For detailed Data Sheets please contact Sales.

MRSI-H1

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