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MRSI Mycronic to Showcase Advanced Assembly Solutions for High Volume Photonics Manufacturing at CIOE 2024

MRSI Mycronic, a part of the Mycronic Group, will be exhibiting and presenting innovative advanced assembly solutions at the 24th China International Optoelectronic Exposition (CIOE) from

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MRSI to present at IFOC and attend CIOE in September in Shenzhen including live product demos

MRSI Systems will present at the 19th Infostone Optical Communications (IFOC) Conference, organized by Infostone Communication Consultant. The event will take place in Shenzhen, China from

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MRSI Mycronic introduces next generation high precision epoxy dispenser for advanced packaging

MRSI Mycronic a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding, active alignment, and epoxy dispensing systems, proudly introduces the next generation

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MRSI Systems offers In-Line Eutectic for Direct Eutectic or Solder Reflow for GaAs & GaN

BILLERICA, MA — August 12, 2015 — MRSI Systems, a developer and manufacturer of turnkey die bonding and dispensing systems, announced today the introduction of a new automated in-line material

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MRSI-M3 Three Micron Die Bonder with One Micron Option

BILLERICA, MA — February 2, 2015 — MRSI Systems, a developer and manufacturer of turnkey die bonding and dispensing systems, announced today the introduction of their most advanced system with

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MRSI receives Laser Focus World Silver Award for MRSI-H-HPLD Die Bonder

die-bonding MRSI receives Laser Focus World Silver Award for MRSI-H-HPLD Die Bonder MRSI receives Laser Focus World Silver Award for MRSI-H-HPLD Die Bonder MRSI Systems (Mycronic Group), a

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Technical articles archive

Download articles from MRSI systems and read about how we are changing the die bonding industry.

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Case Study – The Latest Die Bonding Solutions for Photonics Manufacturing

This case study explains how MRSI achieved high throughput for high volume high mix production with flexible high volume high precision using their latest die bonding systems.

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Key area: Future engineers through diversity

We promote diversity in a broader sense for younger generations to choose engineering careers. Key area: Future engineers through diversity A diverse and inclusive workplace, where everyone feels

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IMS 2019 Boston

die-bonding IMS 2019 Boston The International Microwave Symposium was held at the Pennsylvania Convention Center in Philadelphia last month. The event was well attended with over 8,400

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WEEE

WEEE-Marking Mycronic AB supplies products Business to Business. All qualifying products are marked with the crossed-out wheelie bin to encourage proper recycling of our products.   Recycling

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MRSI Automation (Shenzhen) Co., Ltd.

MRSI Automation (Shenzhen) Co., Ltd. 101, Block A, Huahan Innovation Park Langshan Road 518057 Shenzhen China +86 755 26414155 MRSI Automation 101 Huahan Innovation Park, Langshan Road, Shenzhen,

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Applications

Learn more about MRSI Systems Applications including Microelectronics, Microwave & RF as well as Photonics and Sensors.

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LIDAR, AR/VR/MR

Learn more about LiDAR, AR/VR/MR from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.

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Wafer Level Packaging

Explore the transformative potential of wafer-level packaging in microelectronics and learn how this cost-effective solution enhances performance, reliability, and versatility across industries.

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Sensors

The photonics sensor and detectors market is growing rapidly, which encourages application of photonics sensor technology into several industries areas such as manufacturing, defense &

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How to Choose a Die Bonding System

Leading optoelectronic and semiconductor packaging companies require fully automated, ultra-precision die bonding systems

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Epoxy Die Bonding of Ultra Small Ceramic Capacitors

As consumers expect more power and more bandwidth from their devices, we see the Advanced Electronic Packaging industry under continuing pressure to cram more technology into smaller spaces. One

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MRSI-A-L Active Aligner Wins Infostone 2024 Award for "Most Competitive Optical Communication Product"

On December 6, 2024, Infostone successfully held its 2024 Annual Summary and the 11th Heroes List Award live conference. Awards presented included "The Most Competitive Products of Optical

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MRSI to present at the 21st Infostone Optical Communication Market and Technology Conference

MRSI will be presenting at the Infostone Optical Communication Market and Technology Conference which will be held at the Hyatt Regency Shenzhen Airport Hotel in Shenzhen, China from September

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MRSI-705HF High Force Die Bonder for power devices and advanced chip packaging

MRSI has recently launched the 705HF die bonder, which is designed to cater to the requirements of power devices and advanced chip packaging. The machine is equipped with a heated bond head that

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An update on our free software training video program

Our launch of our free software training outlined the cadence of how 1 training video would be released a week. Since then, we are proud to announce we have released five new videos with more to

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Remuneration to the CEO

Remuneration Remuneration to the CEO and other senior executives The principles for remuneration to the CEO and other senior executives are approved by the Annual General Meeting. The proposed

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Supplier Code of Conduct

ID: 80370 | Version: 4 | Published: May 08, 2025 Mycronic group Supplier Code of Conduct The purpose of this Supplier Code of Conduct (“SCoC”) is to outline the minimum ethical standards and

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Quality & environmental policy

ID: 80018 | Version: 2 | Published: 2024-05-02 Mycronic group quality and environmental policy Mycronic’s vision is to be the most trusted partner to the creators of tomorrow’s electronics. We

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Anti-corruption policy

ID: 80214 | Version: 5 | Published May 08, 2025 Mycronic group anti-corruption policy The purpose of this Anti-Corruption Policy (the “Policy”) is to clarify the rules applied by Mycronic AB and

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Multiple Die Eutectic Bonding

Eutectic bonding is used as an alternative to epoxy bonding. The choice of eutectic bonding is determined by the application and the technical requirements.

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MRSI is Exhibiting at the Optical Fiber Conference in San Diego

The Optical Fiber Conference (OFC) will be held at the San Diego Conference Center in San Diego, CA, USA from March 8-12, 2020.

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Dr. Limin Zhou to present at the 22nd Infostone Optical Communication and Market Technology Conference (IFOC 2024)

Mark your calendars for September 9-10, 2024, at the InterContinental Hotel of the Shenzhen World Exhibition and Convention Center in Shenzhen, China, which hosts the highly anticipated Infostone

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MRSI is exhibiting at the Optical Fiber Conference

OFC will be held at the San Diego Conference Center from March 6-10th, 2022 in San Diego, CA, USA. OFC is the largest global conference and exposition for optical communications.