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atg Luther & Maelzer, part of Mycronic Inc.
atg Luther & Maelzer, part of Mycronic Inc. Mycronic, USA, Tewksbury atg Luther & Maelzer USA, a Mycronic Inc. company 554 Clark Road 01876 Tewksbury, MA USA +1 909 374 1302 Mycronic, 554
Wafer Level Packaging
Explore the transformative potential of wafer-level packaging in microelectronics and learn how this cost-effective solution enhances performance, reliability, and versatility across industries.
MRSI Mycronic introduces next generation high precision epoxy dispenser for advanced packaging
MRSI Mycronic a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding, active alignment, and epoxy dispensing systems, proudly introduces the next generation
MRSI Mycronic to Showcase Advanced Assembly Solutions for High Volume Photonics Manufacturing at CIOE 2024
MRSI Mycronic, a part of the Mycronic Group, will be exhibiting and presenting innovative advanced assembly solutions at the 24th China International Optoelectronic Exposition (CIOE) from
MRSI to present at IFOC and attend CIOE in September in Shenzhen including live product demos
MRSI Systems will present at the 19th Infostone Optical Communications (IFOC) Conference, organized by Infostone Communication Consultant. The event will take place in Shenzhen, China from
MRSI receives Laser Focus World Silver Award for MRSI-H-HPLD Die Bonder
die-bonding MRSI receives Laser Focus World Silver Award for MRSI-H-HPLD Die Bonder MRSI receives Laser Focus World Silver Award for MRSI-H-HPLD Die Bonder MRSI Systems (Mycronic Group), a
MRSI-M3 Three Micron Die Bonder with One Micron Option
BILLERICA, MA — February 2, 2015 — MRSI Systems, a developer and manufacturer of turnkey die bonding and dispensing systems, announced today the introduction of their most advanced system with
MRSI Systems offers In-Line Eutectic for Direct Eutectic or Solder Reflow for GaAs & GaN
BILLERICA, MA — August 12, 2015 — MRSI Systems, a developer and manufacturer of turnkey die bonding and dispensing systems, announced today the introduction of a new automated in-line material
MRSI Systems Will Demonstrate New Product MRSI-HVM3 and Sponsor the 1st Laser Executive Forum at CIOE in Shenzhen, China, September 6-9, 2017
North Billerica, MA, August 25, 2017 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems will be exhibiting at the 19th
MRSI钱毅博士:5G时代自动化贴片系统的发展趋势
5G时代的到来势不可挡,而这一趋势也不断对芯片的贴片、封装工艺提出新的要求。在此背景下, 作为全球光电器件自动化贴片封装设备的领军企业, MRSI Systems也适时推出了新产品、新技术。在今年9月的深圳光博会上,MRSI的产品管理和市场营销副总裁钱毅博士向OFweek光通讯网介绍了MRSI的产品、研发优势及未来的市场趋势。
MRSI-705HF High Force Die Bonder for power devices and advanced chip packaging
MRSI has recently launched the 705HF die bonder, which is designed to cater to the requirements of power devices and advanced chip packaging. The machine is equipped with a heated bond head that
MRSI to present at the 21st Infostone Optical Communication Market and Technology Conference
MRSI will be presenting at the Infostone Optical Communication Market and Technology Conference which will be held at the Hyatt Regency Shenzhen Airport Hotel in Shenzhen, China from September
An update on our free software training video program
Our launch of our free software training outlined the cadence of how 1 training video would be released a week. Since then, we are proud to announce we have released five new videos with more to
Epoxy Die Bonding of Ultra Small Ceramic Capacitors
As consumers expect more power and more bandwidth from their devices, we see the Advanced Electronic Packaging industry under continuing pressure to cram more technology into smaller spaces. One
How to Choose a Die Bonding System
Leading optoelectronic and semiconductor packaging companies require fully automated, ultra-precision die bonding systems
Multiple Die Eutectic Bonding
Eutectic bonding is used as an alternative to epoxy bonding. The choice of eutectic bonding is determined by the application and the technical requirements.
Dr. Limin Zhou to present at the 22nd Infostone Optical Communication and Market Technology Conference (IFOC 2024)
Mark your calendars for September 9-10, 2024, at the InterContinental Hotel of the Shenzhen World Exhibition and Convention Center in Shenzhen, China, which hosts the highly anticipated Infostone
MRSI presented “Assembly Challenges and Solutions for Photonics Devices in Automotive LIDAR” at Automotive LIDAR 2022
Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic Group) and General Manager of MRSI Automation (Shenzhen) Co., Ltd., presented “Assembly Challenges and Solutions
MRSI to exhibit with live demonstrations and present at the China International Optoelectronic Conference (CIOE) in Shenzhen
We are proud to announce that MRSI will be exhibiting at this year’s 24th China International Optoelectronic Exposition. This event will be held from September 7-9th (Postponed to September 6-8,
Come visit us at the International Microwave Symposium
Join us in our booth at the Denver, Colorado IMS event this month to talk with us and build connections! We will be more than happy to discuss the current products our company has to offer.
Visit MRSI at ECTC in San Diego
MRSI Systems is exhibiting at the IEEE 72nd Electronics Components and Technology Conference from June 1-3, 2022 in San Diego, CA. Stop by the MRSI Booth #613 to learn how we can help solve your
MRSI is exhibiting at the Optical Fiber Conference
OFC will be held at the San Diego Conference Center from March 6-10th, 2022 in San Diego, CA, USA. OFC is the largest global conference and exposition for optical communications.
Visit MRSI at SPIE Photonics West 2022
Meet with MRSI Systems in San Francisco
MRSI Systems – CIOE 2020 & IFOC 2020 Highlights
die-bonding IFOC 2020 MRSI Systems – CIOE 2020 & IFOC 2020 Highlights IFOC 2020 is one of the most influential events in the optical communication industry in China. Over 800 professionals
MRSI is Exhibiting at the Optical Fiber Conference in San Diego
The Optical Fiber Conference (OFC) will be held at the San Diego Conference Center in San Diego, CA, USA from March 8-12, 2020.
Thank You for Visiting MRSI at the International Microwave Symposium in Boston
The International Microwave Symposium was held at the Boston Convention Center last month. The event had over 9,000 attendees including exhibitors and guests, which represents a 14% increase over
Visit MRSI Systems at the Optical Fiber Conference in San Diego
The Optical Fiber Conference (OFC) will be held at the San Diego Conference Center in San Diego, CA, USA from March 3-7, 2019. The exhibition is from March 5-7. Visit the MRSI Systems’ Booth #4541
MRSI Systems Integrates In Situ Light Measurement for AOC into Die Bonder
BILLERICA, MA — April 22, 2015 — MRSI Systems, a developer and manufacturer of turnkey chip placement and dispensing systems, has integrated in situ light measurement for Active Optical Cable
MRSI Systems Announces “One Stop Shop” Die Bonding Solutions & Participation at CIOE and ECOC
MRSI Systems will be demonstrating our “One Stop Shop” capabilities at the 20th China International Optoelectronic Exposition (CIOE) at the Shenzhen Convention and Exhibition Center with our
International Microelectronics Assembly and Packaging Society New England 45th Symposium & Expo
IMAPS New England Chapter’s Symposium will be held at the Boxborough Regency Hotel in Boxborough, MA, May 1st, 2018.