Search
MYPro I91z
All the power of the MYPro I series 3D AOI for heavyweight board inspection.
MYPro I51z
High-performance 3D AOI for high-productivity production.
MYPro A41SX
Big board pick and place machines for large printed circuit board assembly
MYPro A41DX
Big printed circuit boards
GenI - Generative AOI Programming
GenI - Generative AOI Programming With Gen I™ your team gains: The industry’s fastest programming — eliminate specialized AOI programming for every new product. Faster NPIs — accelerate
MYPro I50Xz
High-performance 3D AOI for high-productivity production.
Semiconductor mask metrology system
Tailor-made quality measurement
A9aL
A9aL A9aL Description Specification Brochures Services Contact The fully automated A9aL, 8-head, double-sided, high-speed, high-accuracy, granite based flying probe test system features
A9XL
A9XL A9XL Flying Probe PCB Test System Description Specification Brochures Services Contact The A9XL is the latest model of our A9 product family based on our A9 test head technology with a new
A9
A9 A9 Flying Probe PCB Test System Description Specification Brochures Services Contact The A9 is our fastest PCB test system with a new powerful drive technology and granite base to ensure high
A9L
A9L A9L Flying Probe PCB Test System Description Specification Brochures Services Contact The A9L is based on our A9 test head technology with a new powerful drive technology and granite base to
A5 Neo
A5 Neo Flying Probe Test System For Rigid and Flexible Boards.
MYTower 5x
The MYTower 5x is perfect for customers with height restrictions, looking to store as many reels as possible, whilst utilizing as little floorspace as possible.
MYCenter Analysis
The MYCenter Analysis dashboard software provides actionable data to increase utilization, reduce reject rates and improve line balancing in real time.
MYTower 7+
The MYTower 7+ is Mycronic’s tallest component storage system, measuring at 3.03 m, with a capacity of 1,148 reels.
Financing
Mycronic can offer long-term financing of 3 to 5 years, at less than market rates. With very competitive fixed interest rates, your investment in quality PCB assembly equipment can be realized
MYPro S30
MYPro S30 - stencil printer Intelligent vision and 2D inspection Brochure Contact MYPro S series brochure MYPro S series specifications Repeatable precision for higher throughput Robust,
MYPro S20
MYPro S20 - stencil printer Intelligent vision and 2D inspection Brochure Contact MYPro S series brochure MYPro S series specifications High accuracy meets high flexibility In the MYPro S series,
MY700JP
One versatile platform. Twice the possibilities. MYPro series MY700TM Jet Printer and Dispenser MYPro series MY700TM Jet Printer and Dispenser Specifications March 2022 Millions of
MY700JX
One versatile platform. Twice the possibilities. MYPro series MY700TM Jet Printer and Dispenser MYPro series MY700TM Jet Printer and Dispenser Specifications March 2022 The all-in-one solder
MY300HX
MY300HX pick-and-place Agilis™ - The most efficient feeding system Brochures Contact Mycronic’s modular Agilis™ component feeding system is designed for accuracy, ease of use and convenience. It
DeepReview for 3D AO
DeepReview™ for 3D AOI Give review operators the focus they deserve If a task is tedious but necessary, it may be a good candidate for AI. This is particularly true when it comes to reviewing
MRSI-H
For detailed Data Sheets please contact Sales. The MRSI-H family provides proven superior flexibility for true multi-die, multi-process, multi-product high volume high mix production.
MRSI-HVM
For detailed Data Sheets please contact Sales. The MRSI-HVM product family has proved to be the best-in-class die bonder with leading speed, zero-time tool change between dies, and <1.5 micron
MRSI-HVM1
For detailed Data Sheets please contact Sales. The MRSI-HVM1 product has proved to be the best-in-class die bonder with leading speed, zero-time tool change between dies, and 1 micron accuracy.
Active Aligners - MRSI-A-L
For detailed Data Sheets please contact Sales.
MRSI-705HF
For detailed Data Sheets please contact Sales. The MRSI-705HF is equipped with a heated bond head that can apply up to 500N of force during the bonding process, while providing heating up to
3 Micron Die Bonders
For detailed Data Sheets please contact Sales. The MRSI-M3 3-Micron flip-chip Die Bonder sets the industry standard for ultra-precision, high-complexity die attach in high volume production
MY300EX
MY300EX pick-and-place Agilis™ - The most efficient feeding system Brochures Contact Mycronic’s modular Agilis™ component feeding system is designed for accuracy, ease of use and convenience. It
MYTower 6
The MYTower 6 has a capacity of 980 reels, suited for storing large quantity of 4–13′′ reels as well as 15′′ reels.