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MYPro I91z

All the power of the MYPro I series 3D AOI for heavyweight board inspection.

Product

MYPro I51z

High-performance 3D AOI for high-productivity production.

Product

MYPro A41SX

Big board pick and place machines for large printed circuit board assembly

Product

MYPro A41DX

Big printed circuit boards

Product

GenI - Generative AOI Programming

GenI - Generative AOI Programming With Gen I™ your team gains: The industry’s fastest programming — eliminate specialized AOI programming for every new product. Faster NPIs — accelerate

Product

MYPro I50Xz

High-performance 3D AOI for high-productivity production.

Product

Semiconductor mask metrology system

Tailor-made quality measurement

Product

A9aL

A9aL A9aL Description Specification Brochures Services Contact The fully automated A9aL, 8-head, double-sided, high-speed, high-accuracy, granite based flying probe test system features

Product

A9XL

A9XL A9XL Flying Probe PCB Test System Description Specification Brochures Services Contact The A9XL is the latest model of our A9 product family based on our A9 test head technology with a new

Product

A9

A9 A9 Flying Probe PCB Test System Description Specification Brochures Services Contact The A9 is our fastest PCB test system with a new powerful drive technology and granite base to ensure high

Product

A9L

A9L A9L Flying Probe PCB Test System Description Specification Brochures Services Contact The A9L is based on our A9 test head technology with a new powerful drive technology and granite base to

Product

A5 Neo

A5 Neo Flying Probe Test System For Rigid and Flexible Boards. 

Product

MYTower 5x

The MYTower 5x is perfect for customers with height restrictions, looking to store as many reels as possible, whilst utilizing as little floorspace as possible.

Product

MYCenter Analysis

The MYCenter Analysis dashboard software provides actionable data to increase utilization, reduce reject rates and improve line balancing in real time.

Product

MYTower 7+

The MYTower 7+ is Mycronic’s tallest component storage system, measuring at 3.03 m, with a capacity of 1,148 reels.

Product

Financing

Mycronic can offer long-term financing of 3 to 5 years, at less than market rates. With very competitive fixed interest rates, your investment in quality PCB assembly equipment can be realized

Product

MYPro S30

MYPro S30 - stencil printer Intelligent vision and 2D inspection Brochure Contact MYPro S series brochure MYPro S series specifications Repeatable precision for higher throughput   Robust,

Product

MYPro S20

MYPro S20 - stencil printer Intelligent vision and 2D inspection Brochure Contact MYPro S series brochure MYPro S series specifications High accuracy meets high flexibility In the MYPro S series,

Product

MY700JP

One versatile platform. Twice the possibilities. MYPro series MY700TM Jet Printer and Dispenser MYPro series MY700TM  Jet Printer and Dispenser Specifications March 2022 Millions of

Product

MY700JX

One versatile platform. Twice the possibilities. MYPro series MY700TM Jet Printer and Dispenser MYPro series MY700TM  Jet Printer and Dispenser Specifications March 2022 The all-in-one solder

Product

MY300HX

MY300HX pick-and-place Agilis™ - The most efficient feeding system Brochures Contact Mycronic’s modular Agilis™ component feeding system is designed for accuracy, ease of use and convenience. It

Product

DeepReview for 3D AO

DeepReview™ for 3D AOI Give review operators the focus they deserve If a task is tedious but necessary, it may be a good candidate for AI. This is particularly true when it comes to reviewing

Product

MRSI-H

For detailed Data Sheets please contact Sales. The MRSI-H family provides proven superior flexibility for true multi-die, multi-process, multi-product high volume high mix production.

Product

MRSI-HVM

For detailed Data Sheets please contact Sales. The MRSI-HVM product family has proved to be the best-in-class die bonder with leading speed, zero-time tool change between dies, and <1.5 micron

Product

MRSI-HVM1

For detailed Data Sheets please contact Sales. The MRSI-HVM1 product has proved to be the best-in-class die bonder with leading speed, zero-time tool change between dies, and 1 micron accuracy.

Product

Active Aligners - MRSI-A-L

For detailed Data Sheets please contact Sales.

Product

MRSI-705HF

For detailed Data Sheets please contact Sales. The MRSI-705HF is equipped with a heated bond head that can apply up to 500N of force during the bonding process, while providing heating up to

Product

3 Micron Die Bonders

For detailed Data Sheets please contact Sales. The MRSI-M3 3-Micron flip-chip Die Bonder sets the industry standard for ultra-precision, high-complexity die attach in high volume production

Product

MY300EX

MY300EX pick-and-place Agilis™ - The most efficient feeding system Brochures Contact Mycronic’s modular Agilis™ component feeding system is designed for accuracy, ease of use and convenience. It

Product

MYTower 6

The MYTower 6 has a capacity of 980 reels, suited for storing large quantity of 4–13′′ reels as well as 15′′ reels.