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MYPro Create
MYPro Create Mycronic PCB Assembly Solutions, MYPro Create Contact Multi-machine programming for electronics manufacturers A single interface and workflow MYPro Create makes multi-machine
A9L
A9L A9L Flying Probe PCB Test System Description Specification Brochures Services Contact The A9L is based on our A9 test head technology with a new powerful drive technology and granite base to
MRSI-LEAP High-Speed Die Bonders
For detailed Data Sheets please contact Sales. The MRSI-LEAP 1µm high-speed die bonder boasts a range of innovative features that make it an essential tool for high-volume manufacturing.
MYPro A40SX
MYPro A40SX pick-and-place Agilis™ - The most efficient feeding system Brochures Contact Mycronic’s modular Agilis™ component feeding system is designed for accuracy, ease of use and convenience.
MYPro A40LX
MYPro A40LX pick-and-place Agilis™ - The most efficient feeding system Brochures Contact Mycronic’s modular Agilis™ component feeding system is designed for accuracy, ease of use and convenience.
MY700JP
Millions of high-precision dots. The MY700 Jet Printer makes it possible to handle the most challenging boards and components with micrometer accuracy, maximum speed and perfect quality solder
MY700JX
The all-in-one solder paste and assembly fluid solution. MY700JX allows you to combine operator-independent solder paste jet printing with high-speed jet dispensing of adhesives, UV materials,
MYD50
MYD50 in-line dispenser Brochure Contact us Brochure MYD Linear motor drive in-line dispensers For higher-precision applications such as complex chip packaging, the powerful MYD50 platform
MRSI-HVM
For detailed Data Sheets please contact Sales. The MRSI-HVM product family has proved to be the best-in-class die bonder with leading speed, zero-time tool change between dies, and <1.5 micron
MY700JP
One versatile platform. Twice the possibilities. MYPro series MY700TM Jet Printer and Dispenser MYPro series MY700TM Jet Printer and Dispenser Specifications March 2022 Millions of
MY300HX
MY300HX pick-and-place Agilis™ - The most efficient feeding system Brochures Contact Mycronic’s modular Agilis™ component feeding system is designed for accuracy, ease of use and convenience. It
MYCenter Analysis
The MYCenter Analysis dashboard software provides actionable data to increase utilization, reduce reject rates and improve line balancing in real time.
A5 Neo
A5 Neo Flying Probe Test System For Rigid and Flexible Boards.
Display mask writer
The new Prexision series setting the global standards for displays.
MYPro I91
All the power of the MYPro I series 3D AOI for heavyweight board inspection.
MYPro I81
All the power of the MYPro I series 3D AOI in dual lane configuration.
MY300LX
MY300LX pick-and-place Agilis™ - The most efficient feeding system Brochures Contact Mycronic’s modular Agilis™ component feeding system is designed for accuracy, ease of use and convenience. It
PI Pico - 3D SPI
PI Pico - 3D SPI Brochures Contact PI series 3D SPI brochure and specifications High accuracy and repeatability 3D SPI with auto-programming Clear and simple inspection control Clarity and
PI Primo - 3D SPI
PI Primo - 3D SPI Brochures Contact PI series 3D SPI brochure and specifications Clear and simple inspection control Clarity and simplicity are words rarely associated with the complex process of
A7-16 Pro
A7-16 Pro A7-16 Pro Description Brochures Specification Services Contact The A7 Pro is also available with 16 test heads and with a large test area of 24" x 39.4". Teh A7-16 Pro benefitting
MRSI-705
For detailed Data Sheets please contact Sales. The MRSI-705 5-Micron Flip-Chip Die Bonder sets the mark for high-precision, high-speed component assembly within a flexible, configurable platform.
S3
S3 S3 Description Specification Brochures Services The S3 is able to test 10 µm structures while achieving 100 measurements per second. The machine, therefore, provides the customer with an
A9a plus
A9a plus A9a plus Description Specification Brochures Services Contact The A9a plus is utilizing the same technology as the A9a and is in addition equipped with a temperature control unit and 4
Submicron Die Bonders
For detailed Data Sheets please contact Sales. The MRSI-S-HVM submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging
MYPro I50
High flexibility 3D AOI for high-mix production with AI-assisted programming.
MYTower 7+
The MYTower 7+ is Mycronic’s tallest component storage system, measuring at 3.03 m, with a capacity of 1,148 reels.
Financing
Mycronic can offer long-term financing of 3 to 5 years, at less than market rates. With very competitive fixed interest rates, your investment in quality PCB assembly equipment can be realized
Multi-purpose mask writer
Built for world-class photomasks.
MY700JD
One versatile platform. Twice the possibilities. MYPro series MY700TM Jet Printer and Dispenser MYPro series MY700TM Jet Printer and Dispenser Specifications March 2022 Precision printing.
MY700JD
Precision printing. High-speed jet printer and solder paste PCB printing, surface mount soldering dispenser for a wide range of assembly fluids.