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Enabling Advanced MRAM Testing at NY CREATES with Hprobe’s IBEX Platform Overview NY CREATES is actively developing both STT-MRAM and SOT-MRAM technologies at the device R&D and

Latest Generation in advanced technology 8 ultra light carbon fiber test heads High performance linear motion Granite base for high accuracy and repeatability S9 Flying Probe Test System

Latest Generation in advanced technology 8 ultra light carbon fi ber test heads High performance linear motion Granite base for high accuracy and repeatability A9XL Flying Probe Test System

Latest Generation in advanced technology 8 ultra light carbon fiber test heads High performance linear motion Granite base for high accuracy and repeatability A9L Flying Probe Test System

Latest Generation in advanced technology 8 ultra light carbon fi ber test heads Fully Automatic “Lights-out” operation High performance linear motion Granite base for high accuracy and

Latest Generation in advanced technology 8 ultra light carbon fiber test heads Fully Automatic “Lights-out” operation High performance linear motion Granite base for high accuracy and

Latest Generation in advanced technology 8 ultra light carbon fi ber test heads Fully Automatic “Lights-out” operation High performance linear motion Granite base for high accuracy and

Latest Generation in advanced technology 8 ultra light carbon fiber test heads High performance linear motion Granite base for high accuracy and repeatability A9 Flying Probe Test System

Latest Generation in advanced technology 8 ultra light carbon fi ber test heads High performance linear motion Granite base for high accuracy and repeatability A9 plus Flying Probe Test

8 Test Heads High Speed Direct Linear Drives for X and Z motion Light weight Carbon Z-Axis Fully Automatic “Lights-out” Operation Tension Shuttle System for thin core product Fast 280 mA

8 Test Heads High Speed Direct Linear Drives for X and Z motion Light weight Carbon Z-Axis Fully Automatic “Lights-out” Operation Tension Shuttle System for thin core product Fast 280 mA

16 Test Heads 20 % higer mechanical speed than A7-16 Light weight Carbon Z-Axis Test System for oversized panels up to 1000 mm Fast 280 mA Kelvin Testing A7-16 Pro Flying Probe Test System For

8 Test Heads 20 % higher mechanical speed than A7 Light weight Carbon Z-Axis 4 High Resolution Color Cameras Fast 280 mA Kelvin Testing A7 Pro Flying Probe Test System For Rigid and Flexible

8 Test Heads Pneumatic Tension Shuttle for Flex and Inner Layer Handling Fast 280 mA Kelvin Testing A5 Neo Flying Probe Test System For Rigid and Flexible Boards A5 Neo Technical Specifi

With the new IQX, there is nowhere to hide The new IQX™ series Engineered to be as precise as it is fast Mycronic IQX series Accelerating photomask inspection without compromise IQX is a

Pierre Brorsson CFO and Sr VP Corporate Development, employed since 2021 Anders Lindqvist President and CEO, employed since 2019 Lena Båvegård Sr VP Global Functions, employed since

v a n -m y c -v 2 connect the world by lighting the way THE ESSENTIAL LINK IN NEXT-GENERATION OPTICAL CONNECTIVITY LEARN MORE Scalable production of Photonic Wire Bonds and

MRSI-705 5 MICRON DIE BONDER MRSI Systems (a part of Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision, and flexible eutectic and epoxy die bonding

MRSI-HVM 1.5 MICRON DIE BONDERBringing tomorrow's electronics to life Bringing tomorrow's electronics to life Patented turret for ”on-the-fly” tool change MRSI Systems (a part of Mycronic

MRSI-M3 3 MICRON DIE BONDER MRSI Systems (a part of Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision, and flexible eutectic and epoxy die bonding

MRSI-175Ag EPOXY DISPENSER MRSI Systems (a part of Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision, and flexible eutectic and epoxy die bonding systems.

MRSI-705HF 5 MICRON HIGH FORCE DIE BONDER Assembly Processes • Thermal Compression Bonding • Sintering • Eutectic Bonding • Epoxy Die Attach • In-situ UV Bonding • Flip Chip Assembly All-In-One

MRSI-H 1.5 MICRON DIE BONDERBringing tomorrow's electronics to life Bringing tomorrow's electronics to life Patented turret for ”on-the-fly” tool change MRSI Systems (a part of Mycronic

MRSI-H1 1 MICRON DIE BONDER MRSI Systems (a part of Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision, and flexible eutectic and epoxy die bonding

MRSI-HVM1 1 MICRON DIE BONDERBringing tomorrow's electronics to life Bringing tomorrow's electronics to life MRSI Systems (a part of Mycronic Group) is the leading manufacturer of fully

MRSI-LEAP ULTRA HIGH SPEED DIE BONDER • Very high throughput • Exceptionally stable, up to ±1μm @ 3σ placement accuracy • Supports multiple wafers and multiple automated tool changes MRSI

MRSI-A-L ACTIVE ALIGNER MRSI Mycronic has been serving optoelectronic customers for the past 40+ years and understands their requirement to scale efficiently in today’s fast-paced marketplace.