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Standard Terms and Conditions for Sale of Equipment and Services - confidential - Page 1 of 5 Standard Terms and Conditions for Sale of Equipment and Services 01. January

Microresonator photonic wire bond integration for Kerr-microcomb generation Alain Yuji Takabayashi1,7, Nikolay Pavlov1,7, Victoria Rosborough2,7, Galen Hoffman3,7, Lou Kanger1, Farzad Mokhtari

A powerful solution for photonic packaging and system assembly Universal hardware with software-defined functionality, designed for scalable manufacturing Freeform waveguides and

功能强大的光子芯片封装和系统组装解决方案 可由软件定义功能的通用硬件，专为可扩展生产而设计 自由曲面光波导和微光学元件将彻底改变光子封装和组装。vanguard REPRISE1000 系列可提供3D打印微光学元件 的全自动化后处理，包括光刻胶的去除和晶圆级别上的适应性局部封装。 vanguard SYMPHONY 混合多芯片光子封装和集成的全自动化解决方案 Ve rs .

Latest Generation in advanced technology 8 ultra light carbon fiber test heads High performance linear motion Granit base for high accuracy and repeatability A9 Flying Probe Test System

MRSI-705HF 5 MICRON HIGH FORCE DIE BONDER Assembly Processes • Thermal Compression Bonding • Sintering • Eutectic Bonding • Epoxy Die Attach • In-situ UV Bonding • Flip Chip Assembly All-In-One

Latest Generation in advanced technology 8 ultra light carbon fiber test heads High performance linear motion Granit base for high accuracy and repeatability A9 plus Flying Probe Test

Latest Generation in advanced technology 8 ultra light carbon fiber test heads Fully Automatic “Lights-out” operation High performance linear motion Granit base for high accuracy and

Certificate of Registration 质量管理体系 - ISO 9001:2015 兹证明： 深圳市轴心自控技术有限公司 91440300682020147E 中国 广东省 深圳市 龙华区 观澜街道大富社区桂月路334号 硅谷动力汽车电子创业园A15栋101、201及 A14栋整栋 邮编：518040 Shenzhen Axxon Automation Co.,

Certificate of Registration 环境管理体系 - ISO 14001:2015 兹证明： 深圳市轴心自控技术有限公司 91440300682020147E 中国 广东省 深圳市 龙华区 观澜街道大富社区桂月路334号 硅谷动力汽车电子创业园A15栋101、201及 A14栋整栋 邮编：518040 Shenzhen Axxon Automation Co.,

Certificate Standard ISO 9001:2015 Certificate Registr. No. 01 100 1900070 Certificate Holder: modus high-tech electronics GmbH

Latest Generation in advanced technology 8 ultra light carbon fiber test heads High performance linear motion Granit base for high accuracy and repeatability A9 plus Flying Probe Test

Latest Generation in advanced technology 8 ultra light carbon fiber test heads High performance linear motion Granit base for high accuracy and repeatability A9 Flying Probe Test System

Latest Generation in advanced technology 8 ultra light carbon fiber test heads High performance linear motion Granit base for high accuracy and repeatability A9XL Flying Probe Test System

MRSI-LEAP ULTRA HIGH SPEED DIE BONDER • Very high throughput • Exceptionally stable, up to ±1μm @ 3σ placement accuracy • Supports multiple wafers and multiple automated tool changes MRSI

MRSI-A-L ACTIVE ALIGNER MRSI Mycronic has been serving optoelectronic customers for the past 40+ years and understands their requirement to scale efficiently in today’s fast-paced marketplace.

MRSI-M3 3 MICRON DIE BONDER MRSI Systems (a part of Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision, and flexible eutectic and epoxy die bonding

MRSI-705 5 MICRON DIE BONDER About MRSI Systems MRSI Systems (a part of Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision, and flexible eutectic and epoxy

Policy Mycronic Group i2 - internal ID: 80381 Version: 6 Published: May 15, 2025 1 (11) Mycronic Group Code of Conduct Approved at statutory board meeting 2025-05-07

Policy Mycronic Group i2 - internal ID: 80566 Version: 3 Published: May 08, 2025 1 (7) Mycronic Group Supplier Code of Conduct for Service Providers and non-critical

Policy Mycronic Group i2 - internal ID: 80214 Version: 4 Published: May 08, 2025 1 (6) Mycronic Group Anti-Corruption Policy Introduction and Purpose The purpose of this

Policy Mycronic Group i2 - internal ID: 80370 Version: 4 Published: May 08, 2025 1 (10) Mycronic Group Supplier Code of Conduct Introduction The purpose of this Supplier

Bringing tomorrow's electronics to life MRSI Systems (Mycronic Group), is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding

Latest Generation in advanced technology 8 ultra light carbon fiber test heads High performance linear motion Granit base for high accuracy and repeatability A9 plus Flying Probe Test

Enabling the future of electronics VD-anförande, av Lena Olving 1 Länk till film: Mycronic – The Journey 2016 – Ett rekordår för Mycronic Rekordstark efterfrågan

i DENTOR SUM VENDIT Års- och hållbarhetsredovisning 2021 ÖVERSIKT / SYFTE OCH UPPDRAG Bringing tomorrow’s electronics to life Översikt Syfte & uppdrag

Place and date: For the issuing office: Solna, 24 February 2023 DNV - Business Assurance Elektrogatan 10, 171 54, Solna, Sweden Ann-Louise Pått Management Representative Lack of fulfilment