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Press releases

20 OCT 2021, 07:41

MRSI Systems 荣获“2021 Laser Focus World创新大奖”
20 SEP 2021, 15:00

MRSI to present at Automotive LIDAR 2021
13 SEP 2021, 15:00

MRSI Systems 宣布“DIE PLACEMENT HEAD WITH TURRET” (集成水平转塔之芯片贴装头)已获得中国专利授权
13 SEP 2021, 15:00

MRSI Systems Announces Chinese Patent Issued Covering Die Placement Head with Turret
14 AUG 2021, 21:42

MRSI中国新产品演示中心开业，将出席讯石研讨会，参加CIOE展会并提供现场演示
10 AUG 2021, 21:42

MRSI opens a new Product Demo Center in China, will present at the Infostone Conference and attend CIOE with live demos
8 JUL 2021, 16:59

MRSI,Mycronic中国深圳新的产品演示中心正式成立
8 JUL 2021, 15:00

MRSI Mycronic Opens New Demo Center in Shenzhen, China
16 MAR 2021, 14:00

MRSI to Offer Live Die Bonding Demos at Laser World of Photonics, March 17-19, 2021
9 FEB 2021, 15:00

MRSI-S-HVM Submicron Die Bonder won the award for “Infostone 2020 The Most Competitive Optical Communications Product”