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MRSI Mycronic | MRSI-LEAP High-Speed Die Bonder Receives "Optical Communication Innovation Product Award" at CFCF2025

MRSI Mycronic received the "Optical Communication Innovation Product Award" at the CFCF2025 Optical Connectivity Conference. Our MRSI-LEAP High-Speed die bonder was recognized for its precision

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Mycronic Interim Report January-June 2025 - CEO and CFO comments

Watch our brief video summary of the Interim Report Q2 2025 Mycronic Interim Report January-June 2025 - CEO and CFO comments Today we published our Interim Report January-June 2025. "Net

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MRSI Systems, LLC Files Patent Infringement Lawsuit Against Suzhou LieQi in China

MRSI Systems, LLC (a part of Mycronic Group), a global high-tech company that provides high precision production solution in electronics industry, filed a patent infringement lawsuit against

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Mechaniker Kopfmontage (m/w/d)

in Vollzeit (40 Wochenstunden) Mechaniker Kopfmontage (m/w/d) Ihre Aufgaben: Montieren von Baugruppen nach Anweisungen, Stücklisten und Zeichnungen Endabnahme nach Spezifikation und internen

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MYWizard Convert service package

Nahtloses Upgrade von Vision3D auf MYWizard mit MYWizard Convert. Bewahren Sie Ihre Inspektionsdaten auf, erhöhen Sie die Zuverlässigkeit und nutzen Sie KI-gestützte Automatisierung

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MYWizard Convert service package

Nahtloses Upgrade von Vision3D auf MYWizard mit MYWizard Convert. Bewahren Sie Ihre Inspektionsdaten auf, erhöhen Sie die Zuverlässigkeit und nutzen Sie KI-gestützte Automatisierung

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Mycronic Surfx

Mycronic Surfx Aerial shot of a in Los Angeles, California Surfx Technologies, LLC. 2631 Manhattan Beach Blvd. Redondo Beach, 90278 Los Angeles California USA 2631 Manhattan Beach Blvd. Redondo

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Behind the scenes: SMT logistics solutions in action

Step inside SMT logistics and meet the experts who keep machines running. Discover the passion, precision, and people driving service success.

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Join Us at IMAPS CHIPcon 2025: Shaping the Future of Chip Technology

We are excited to participate in IMAPS CHIPcon, the premier event for Chiplet and Heterogeneous Integration Packaging (CHIP) technology, from July 7–10, 2025, in San Jose, CA. This conference

Product

MYPro Create

MYPro Create Multi-machine programming for electronics manufacturers A single interface and workflow MYPro Create makes multi-machine programming a lot smoother and paves the way for future

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Manager Compliance/Arbeitssicherheit/Datenschutz (m/w/d)

in Vollzeit (40 Wochenstunden) Manager Compliance/Arbeitssicherheit/Datenschutz (m/w/d) Als Manager Compliance/Arbeitssicherheit/Datenschutz (m/w/d) übernehmen Sie eine Schlüsselrolle als

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MRSI-LEAP Ultra-High-Speed Die Bonders: Revolutionizing High-Volume Manufacturing

Ultra-high-speed die bonding technology is pivotal in modern manufacturing, particularly for optical modules production. The MRSI-LEAP Ultra-High-Speed Die Bonders exemplify this advancement,

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Mycronic Hprobe

Mycronic Hprobe Mycronic Hprobe SAS Hprobe SAS 4 rue Irène Joliot-Curie 38320 Eybens France +33 476 63 07 52 4 rue Irène Joliot-Curie 38320 Eybens

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Magnetic Test

Enabling the next generation of spintronic devices Magnetic Automated Test Equipment for Memory and Sensors Hprobe, part of Mycronic’s Global Technologies division, delivers advanced Magnetic

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Press-fit component inspection

Press-fit component inspection with Mycronic 3D AOI

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How two Mycronic R&D leaders are defying stereotypes and aiming for the stars

How two Mycronic R&D leaders are defying stereotypes and aiming for the stars Anything is possible Hunched over the instrument panel of a Saab fighter jet, Jenny Svahn learned early in her

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MRSI to Exhibit at NEPCON Thailand

We are pleased to announce we are exhibiting with our distributor PREM at NEPCON Thailand, scheduled from June 18-21, 2025, at BITEC in Bangkok.

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What is the significance of co-planarity in die bonding?

At the recent IMAPS Conference in Arizona, co-planarity in die bonding was a key topic due to its importance in 2.5 and 3D chip stacking.

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New facility in Wertheim opens successfully

atg L&M - part of Mycronic Group celebrates New facility in Wertheim opens successfully In January 2025 atg Luther & Maelzer GmbH - part of Mycronic Group moved to our newly completed facility

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Best Support Award from Bomin

bare-board-testning "Shaping the Future, Igniting New Journeys" atg Luther & Mealzer GmbH Awarded Bomin’s 2025 "Best Support Award" On May 24, 2025, the grand opening ceremony

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Join MRSI at the International Microwave Symposium in San Francisco

The International Microwave Symposium (IMS) is an annual conference for professionals in the microwave and RF industry.

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Gallery

Gallery Video gallery Image gallery MRSI Die Bonding Video MRSI Patented Turret MRSI Die Bonding Gallery

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Learn more about our active alignment solutions

The MRSI-A-L machine is a versatile optical active alignment platform suitable for a wide range of applications, including lens, fiber and other optical components active alignment.

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Dr. Limin Zhou to present at the Semiconductor Advanced Technology Innovation Development and Opportunities Conference

The rapid adoption of artificial intelligence is driving advancements in optical interconnect technology, resulting in notable improvements in speed, power efficiency, and cost reduction. This

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Making progress on our climate targets

Making progress on our climate targets We are happy to announce good progress on our science-based climate targets! We have reached one target and are on track to meet the other - but there is

MYPro Create illustration_700.psd

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Video: Mycronic Interim Report January-March 2025 - CEO and CFO comments

Watch our brief video summary of the Interim Report Q1 2025 Mycronic Interim Report January-March 2025 - CEO and CFO comments Today we published our Interim Report January-March 2025. "We

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MRSI为5G无线网络光电器件推出新型MRSI-H3TO贴片机产品

MRSI系统公司(Mycronic集团)推出MRSI-H3TO新型3微米高速贴片机,这是业界第一款可以真正满足多晶片和多流程的要求,可实现行业领先的贴片速度、卓越的灵活性以及为未来产品准备的3微米贴片精度。 MRSI-H3TO专为WDM与EML-TO或其他多晶片多流程TO-can光电器件量身打造,以支持即将普及的5G无线网络。

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MRSI Systems推出新型MRSI-H3LD高速贴片机

MRSI系统公司(Mycronic集团)推出MRSI-H3LD新型3微米高速贴片机,专用于大功率半导体激光器中的芯片贴片,广泛应用于工业激光器、光纤放大、光源和传感器等先进光电子应用。