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新机发布|MRSI(Mycronic集团)发布创新MRSI-A-L耦合设备,引领精密光学组件封装新纪元

MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, proudly introduces the MRSI-A-L

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MRSI Systems’ New Product MRSI-HVM3 Die Bonder Has Entered Volume Production Driven by Fast and Wide Customer Adoptions

NORTH BILLERICA, Mass., March 6, 2018 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems is pleased to announce that our

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MRSI Systems Receives Funding from State of Massachusetts for Advanced Manufacturing Initiative

Billerica, Mass., Oct, 6, 2017 – MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, has been awarded new funding by the

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MRSI Systems 热烈欢迎贺尉宗出任中国区销售总监

MRSI Systems(Mycronic Group)很高兴地宣布贺尉宗(Hendry He)担任我们的中国区销售总监。他将与现有的销售团队及销售代表一起工作,并作为中国区销售代表服务市场,工作地点为上海。Hendry在半导体设备方面拥有丰富的技术知识以及销售经验。结合Hendry对中国市场的庞大网络的掌握Hendry的加入将进一步提高我们对客户需求的响应能力。

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MRSI Systems welcomes Hendry He as China Country Sales Director

MRSI Systems (Mycronic Group) is pleased to announce our new China Country Sales Director, Hendry He. He will be working alongside the existing sales team and representatives in the region and is

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MRSI receives Laser Focus World Innovators Award for HVM die bonder

MRSI Systems (Mycronic Group) a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2019 Silver Honoree for

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MRSI Systems wins Silver Honoree for Laser Focus World Innovators Award 2023

die-bonding Laser Focus World Innovators Award 2023 MRSI Systems wins Silver Honoree for Laser Focus World Innovators Award 2023 MRSI Systems, a part of Mycronic Group, a leading manufacturer of

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MRSI Mycronic Opens New Demo Center in Shenzhen, China

MRSI Systems (Mycronic Group) has opened the doors to their new “Product Demo Center” in Shenzhen, China. The new demo center is in the Huahan Innovation Office Park in the Nanshan District of

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MRSI Launches New MRSI-H3LD Die Bonder Targeted at the High Power Diode Laser Market

MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3 micrometer high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used in advanced

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MRSI-705HF 5 micron high force die bonder won the award for “Infostone 2023 Optical Communication Most Competitive Equipment

On December 28, 2023, MRSI (Mycronic Group) received the “Infostone 2023 Optical Communication Most Competitive Equipment” award for the MRSI-705HF 5 micron high force die bonder at the First

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MRSI Support for Application Specific Pickup Tip Designs

The MRSI-705 features an innovative design with a versatile thirteen-position tool bank for quick, automatic tool changes. Enhanced functionality is achieved with additional tool change banks,

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MRSI Mycronic to Sponsor and Exhibit at the 2025 Chiplet Summit

In January 2025, MRSI Mycronic will sponsor and exhibit at the prestigious Chiplet Summit. This event gathers global leaders in semiconductor technology to discuss innovations in chiplet design

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Join MRSI at IMS in San Diego

The International Microwave Symposium (IMS) is an annual conference that brings together the brightest minds in the microwave and RF industry. This year's event will take place in San Diego, CA,

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Join MRSI Systems at IMAPS Device Packaging Conference this spring!

Experience MRSI Systems at the IMAPS device packaging conference in Fountain Hills, Arizona. MRSI excitedly sponsors the 19th Annual Device Packaging Conference that will be held March 13th-16th

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Optimizing Die Bonding with Planarity Control: Ensuring Precision in Device Attachment Across Industries

Achieving precise and reliable die bonding is crucial in numerous industries, especially when demanding a high degree of parallelism between bonding surfaces.

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Learn why the MRSI-705 is an industry leader in flexibility and reliability

The MRSI-705 5-micron flip-chip die bonder has the largest installed base in photonics packaging, microwave modules, RF power amplifiers, infrared sensors, and medical devices.

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Solutions

Photomask solutions Large area measurement meet the world's most accurate metrology system New increasing demands on LCD displays Making every pixel count in smartphone display Large area

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Stretching the limits of wearable electronics

pcb-assembly Stretching the limits of wearable electronics Deep in the snow-capped mountains of Sweden, the national cross-country ski team will soon not only be pushing their limits in the

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Stretchable electronics for quantified body functions

pcb-assembly SINTEC - Soft Intelligence Epidermal Communication Platform Stretchable electronics for quantified body functions In the visionary project European Horizon 2020 research project

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Feather-light band-aid sensor

pcb-assembly - that can monitor your heart rate Feather-light band-aid sensor SINTEC, AN EU-FINANCED PROJECT FOCUSED ON DEVELOPING SOFT STRETCHABLE ELECTRONICS, CAN NOW PRESENT ITS LATEST

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Mycronic South Korea

Mycronic South Korea Mycronic South Korea Mycronic Co. Ltd. 3rd Floor, Jung-San, Bldg. 1026-8, Sanbon-Dong, Gunpo-Si 15808 Gyeonggi-Do South Korea +82 31 387 5111 +82 31 388 0087 Mycronic,

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Mycronic Japan Fukuoka

Mycronic Japan Fukuoka Mycronic Assembly Solutions Co.,Ltd 1-9-25, Enokida, Hakata-ku 812-0004 Fukuoka Japan +81 92 260 7009 +81 92 260 7019 Mycronic, Fukuoka, Japan

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New advances in machine learning

pcb-assembly Frequently asked questions about AI is raising the bar in inspection technology New advances in machine learning In the SMT industry, we’re seeing how AI and machine learning are

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MRSI Systems Training Services

Learn more about MRSI's training services including on-site training and software training videos. Contact Us.

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atg Luther & Maelzer Asia, Ltd.

atg Luther & Maelzer Asia Ltd. Mycronic, Taiwan, Taoyuan City atg Luther & Maelzer Asia Ltd. 4F., No. 136, Changchun 2nd Rd., Zhongli Dist., Taoyuan City 320, China Taiwan Taiwan +886 3

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Optoelectronics Packaging

MRSI Systems has been a leading supplier to manufacturers of advanced optical packaging assembly for over 30 years. This has enabled MRSI to build unmatched expertise in the assembly technologies

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Epoxy Deposition – Requirement for High-Volume Manufacturing (HVM) of Chip-on-Submount (CoS)

Customers require an application-specific specialized die bonder for HVM of CoS that is able to deliver high speeds while maintaining flexibility.

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How to Choose an Epoxy Dispenser

When it comes to epoxy dispensing your vendor system must offer the ultimate flexible platform for demanding environments. The epoxy dispenser should meet the highest standards of reliability and

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MRSI Systems’ Dr. Yi Qian: The Latest Solution for Automated Manufacturing of Optoelectronic Devices in the 5G Era

The 21st China International Optoelectronic Expo (CIOE) was held at the Shenzhen Convention and Exhibition Center from September 4-7th, 2019. As the world leader in optoelectronic device

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MRSI Systems (Mycronic Group) 应邀出席2021(第三届)激光雷达前瞻技术展示交流会并发表“车载激光雷达光器件封装的挑战与解决方案”的演讲

摘要:(第三届)激光雷达前瞻技术展示交流会于2021年12月14日-12月15日在江苏苏州举办。MRSI Systems战略市场高级总监,周利民博士出席2021(第三届)激光雷达前瞻技术展示交流会并发表“车载激光雷达光器件封装的挑战与解决方案”的演讲。