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The new MX7 mounthead
Highlights of the new mounthead technology include Engineering a new generation of high-speed assembly Flexibility. Turbocharged. The new MX7 mounthead Higher throughput The MX7 enables top
A showcase stockroom
How intelligent material handling can win customers and grow your business
Feather-light band-aid sensor
pcb-assembly - that can monitor your heart rate Feather-light band-aid sensor SINTEC, AN EU-FINANCED PROJECT FOCUSED ON DEVELOPING SOFT STRETCHABLE ELECTRONICS, CAN NOW PRESENT ITS LATEST
Mycronic South Korea
Mycronic South Korea Mycronic South Korea Mycronic Co. Ltd. 3rd Floor, Jung-San, Bldg. 1026-8, Sanbon-Dong, Gunpo-Si 15808 Gyeonggi-Do South Korea +82 31 387 5111 +82 31 388 0087 Mycronic,
Mycronic Japan Fukuoka
Mycronic Japan Fukuoka Mycronic Assembly Solutions Co.,Ltd 1-9-25, Enokida, Hakata-ku 812-0004 Fukuoka Japan +81 92 260 7009 +81 92 260 7019 Mycronic, Fukuoka, Japan
New advances in machine learning
pcb-assembly Frequently asked questions about AI is raising the bar in inspection technology New advances in machine learning In the SMT industry, we’re seeing how AI and machine learning are
Why work at Mycronic?
5 reasons to join Mycronic Why work at Mycronic? In our open and collaborative workplace, you’ll give and get inspiration in equal measure. 1. Bring tomorrow’s electronics to life For over 40
Solutions
Photomask solutions Large area measurement meet the world's most accurate metrology system New increasing demands on LCD displays Making every pixel count in smartphone display Large area
Stretching the limits of wearable electronics
pcb-assembly Stretching the limits of wearable electronics Deep in the snow-capped mountains of Sweden, the national cross-country ski team will soon not only be pushing their limits in the
Stretchable electronics for quantified body functions
pcb-assembly SINTEC - Soft Intelligence Epidermal Communication Platform Stretchable electronics for quantified body functions In the visionary project European Horizon 2020 research project
Large area measurement
Meet the world's most accurate metrology system Large area measurement Challenge The crucial component in today’s high-quality displays is their set of photomasks, which must match each other
News
photomask-equipment Read our latest news here.
新机发布|MRSI(Mycronic集团)发布创新MRSI-A-L耦合设备,引领精密光学组件封装新纪元
MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, proudly introduces the MRSI-A-L
MRSI Systems 热烈欢迎贺尉宗出任中国区销售总监
MRSI Systems(Mycronic Group)很高兴地宣布贺尉宗(Hendry He)担任我们的中国区销售总监。他将与现有的销售团队及销售代表一起工作,并作为中国区销售代表服务市场,工作地点为上海。Hendry在半导体设备方面拥有丰富的技术知识以及销售经验。结合Hendry对中国市场的庞大网络的掌握Hendry的加入将进一步提高我们对客户需求的响应能力。
MRSI Systems welcomes Hendry He as China Country Sales Director
MRSI Systems (Mycronic Group) is pleased to announce our new China Country Sales Director, Hendry He. He will be working alongside the existing sales team and representatives in the region and is
MRSI receives Laser Focus World Innovators Award for HVM die bonder
MRSI Systems (Mycronic Group) a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2019 Silver Honoree for
MRSI Mycronic Opens New Demo Center in Shenzhen, China
MRSI Systems (Mycronic Group) has opened the doors to their new “Product Demo Center” in Shenzhen, China. The new demo center is in the Huahan Innovation Office Park in the Nanshan District of
Processes
Processes Die bonding Epoxy die bonding Eutectic die bonding
Events
die-bonding
MRSI Systems Provides MRSI-M3 Die Bonding Assembly Work Cell to Fabrinet in Silicon Valley for Fast Prototyping and New Product Introduction
North Billerica, MA, USA, May 24, 2016 — MRSI Systems, a leading provider of fully automated, ultra-precision die bonding and epoxy dispensing systems, today announces supply of its flagship
MRSI Systems’ New Product MRSI-HVM3 Die Bonder Has Entered Volume Production Driven by Fast and Wide Customer Adoptions
NORTH BILLERICA, Mass., March 6, 2018 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems is pleased to announce that our
MRSI Systems Receives Funding from State of Massachusetts for Advanced Manufacturing Initiative
Billerica, Mass., Oct, 6, 2017 – MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, has been awarded new funding by the
MRSI Systems wins Silver Honoree for Laser Focus World Innovators Award 2023
die-bonding Laser Focus World Innovators Award 2023 MRSI Systems wins Silver Honoree for Laser Focus World Innovators Award 2023 MRSI Systems, a part of Mycronic Group, a leading manufacturer of
MRSI Launches New MRSI-H3LD Die Bonder Targeted at the High Power Diode Laser Market
MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3 micrometer high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used in advanced
Manual flying probe for PCB test
Manual flying probe for PCB test A5 Neo A7 Pro A7-16 Pro A7XW Pro A9 A9 plus A9L A9XL A5 Neo A7 Pro The A5 Neo Flying Probe PCB tester combines affordable technology with all of the enhanced
Contact us
Contact us Visit our contact page for contact details for our sales and support departments.
Service solutions Bareboard testing
Service solutions Bareboard testing With regular inspections and maintenance, you ensure an optimal operating condition of your test system over its entire lifetime. We support you with many
Microelectronics
MRSI Systems has been a leading supplier to assembly houses and OEMs involved with hybrid assembly die bonding systems for more than 40 years.
MRSI Systems Training Services
Learn more about MRSI's training services including on-site training and software training videos. Contact Us.
High Power Laser Diodes
Learn more about High Power Laser Diodes from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.