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This excerpt from MRSI Systems featured article in Laser Focus World highlights the photonics industry challenges of data center applications and how the photonics industry can respond:

There are many challenges that photonic device suppliers are facing in the current market. As part of IEEE’s Tech Insider Webinar Series, MRSI Systems recently delivered a presentation on high

On November 2, 2016, MRSI Systems participated in the Commercial and Business Opportunities panel discussions at Massachusetts (MA) Integrated Photonics Manufacturing Supply Chain Meeting at MIT.

MRSI Systems is exhibiting at the 52nd International Symposium on Microelectronics from September 30-October 2, 2019 in Boston, MA at the Hynes Convention Center. Schedule a meeting with MRSI

Dr. Zhou joined MRSI Systems in 2019 as the Senior Director of Strategic Marketing. He is located in China to help develop new projects, customers, applications and markets. He also helps

SPIE Photonics West will be held at the Moscone Center in San Francisco, CA from Jan 27-Feb 1. This is the flagship event for companies in the photonics.

MRSI Systems has been a leading supplier to manufacturers of advanced optical packaging assembly for over 30 years. This has enabled MRSI to build unmatched expertise in the assembly technologies

MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3 micrometer high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used in advanced

On December 28, 2023, MRSI (Mycronic Group) received the “Infostone 2023 Optical Communication Most Competitive Equipment” award for the MRSI-705HF 5 micron high force die bonder at the First

The MRSI-705 features an innovative design with a versatile thirteen-position tool bank for quick, automatic tool changes. Enhanced functionality is achieved with additional tool change banks,

The International Microwave Symposium (IMS) is an annual conference that brings together the brightest minds in the microwave and RF industry. This year's event will take place in San Diego, CA,

Experience MRSI Systems at the IMAPS device packaging conference in Fountain Hills, Arizona. MRSI excitedly sponsors the 19th Annual Device Packaging Conference that will be held March 13th-16th

Achieving precise and reliable die bonding is crucial in numerous industries, especially when demanding a high degree of parallelism between bonding surfaces.

The MRSI-705 5-micron flip-chip die bonder has the largest installed base in photonics packaging, microwave modules, RF power amplifiers, infrared sensors, and medical devices.

Learn more about High Power Laser Diodes from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.

MRSI Systems (Mycronic Group) has opened the doors to their new “Product Demo Center” in Shenzhen, China. The new demo center is in the Huahan Innovation Office Park in the Nanshan District of

Processes Die bonding Epoxy die bonding Eutectic die bonding

atg Luther & Maelzer Asia Ltd. Mycronic, Taiwan, Taoyuan City atg Luther & Maelzer Asia Ltd. 4F., No. 136, Changchun 2nd Rd., Zhongli Dist., Taoyuan City 320, Taiwan (R.O.C.) Taiwan +886 3

Customers require an application-specific specialized die bonder for HVM of CoS that is able to deliver high speeds while maintaining flexibility.

When it comes to epoxy dispensing your vendor system must offer the ultimate flexible platform for demanding environments. The epoxy dispenser should meet the highest standards of reliability and

摘要：（第三届）激光雷达前瞻技术展示交流会于2021年12月14日-12月15日在江苏苏州举办。MRSI Systems战略市场高级总监，周利民博士出席2021（第三届）激光雷达前瞻技术展示交流会并发表“车载激光雷达光器件封装的挑战与解决方案”的演讲。

摘要：由中国国际光电博览会(CIOE)提议设立的”中国光电博览奖“，MRSI Systems携最新的MRSI-HVM 1.5微米系列产品参评，成功入围“中国光电博览奖”。MRSI-HVM-P项目属于高端光电子封装自动化技术领域，广泛用应于当下高密度高速率的数据中心光互联和骨干网络传输用的400G +光电器件，以及5G无线应用的复杂DFB / WDM / EML TO-can TOSA /

On January 11, 2022, the Infostone 2022 Annual meeting and the 8th Heroes List awards ceremony were held. Infostone announced the 8th heroes company list, which is classified into four

This excerpt from MRSI Systems featured article in Laser Focus World highlights the HPLD industry manufacturing challenges and a die bonding solution to address these challenges:

MRSI Mycronic is exhibiting at the 57th International Symposium on Microelectronics from October 1-2, 2024, in Boston, MA. The event will take place at the Encore Boston Harbor from October 1-3,

MRSI will be exhibiting at the 48th exhibition of ECOC in Basel, Switzerland from September 19-21st.

Discover how Carl Jacobsson, Group Production Manager at Mycronic in Täby, Sweden, revolutionizes production by implementing a ‘lean management’ approach. Learn about waste reduction,

Tekniksprånget 2020 Tekniksprånget 2020 An internship that takes the leap into technology The Swedish initiative Tekniksprånget (Technology Leap) is a four-month paid internship program

5G technology, with 100 times faster speeds than 4G, opens up new possibilities for consumers and businesses. And it’s already placing tough demands on manufacturers as well!

AI is not artificial - it’s real and powerful. Discover how Mycronic leverages AI to improve forecasting, inspection and maintenance in manufacturing.