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The Versatile MRSI-HVM
2021 was a great year for our best-selling product, the MRSI-HVM 1.5 micron high-speed die bonder. This system meets the needs of many industries from telecom, datacom and medical devices
MRSI presented at the 20th Infostone Optical Communication Market and Technology Conference (IFOC)
Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI Systems presented “Integrated Photonics Devices Volume Manufacturing Challenges & Innovative Solutions” at the 20th Infostone
Two ways our MRSI Systems Machines offer efficiency and productivity to our customers
Jack Inocencio, the Sr. Manager of Applications and Service, extended some conducive knowledge on why MRSI System’s products will accelerate photonics manufacturers’ efficiency and
MRSI to exhibit at the European Microwave Week in Milan
MRSI Systems welcomes you to the European Microwave Exhibition! This event is the largest trade show that is dedicated to Microwave and RF in Europe. It will be held from September 27th-29th in
Visit MRSI at IMAPS Device Packaging in Arizona
MRSI is attending and sponsoring the 18th Annual IMAPS Device Packaging Conference and Exhibition.
Improve pick and place machine utilization by keeping dies in their places
die-bonding Improve pick and place machine utilization by keeping dies in their places A lot of dies are presented to die bonders in waffle packs and there is a common issue of component out of
IEEE Photonics Devices
The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications. Watch the Webinar Recording.
Die bonding
Die bonding is as old as the semiconductor industry itself. From the onset, integrated circuits or ICs were developed using four levels of interconnections.
Eutectic die bonding
Eutectic die bonding, sometimes referred to as eutectic die attach, is a die bonding technique used for devices that require enhanced heat dissipation.
Epoxy die bonding
Epoxy die bonding, sometimes referred to as epoxy die attach, is the most widely used die bonding technique in semiconductor assembly.
Interview with MRSI: Accuracy is improved to 1.5 microns to meet the 5G and 400G high-speed interconnection era of optical device automated placement solution system
During the summer, China Fiber Optics Online (CFOL), interviewed Dr. Limin Zhou, Senior Strategic Marketing Director of MRSI Mycronic to discuss MRSI’s latest product development and some of the
Building Complex Hybrid Circuits-Advanced Packaging
Complex Hybrid Circuits are used in a variety of high reliability applications including military, aerospace, medical, and photonics. MRSI offers dispense and die bonding solutions specifically
MRSI Systems – IEEE Tech Insider Webinar: The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications
die-bonding MRSI Systems – IEEE Tech Insider Webinar: The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications Internet traffic has been growing at an
MRSI Shenzhen Demo Center grand opening ceremony
On August 8, 2021, MRSI Systems(Mycronic Group) held the grand opening of its Product Demonstration Center in Shenzhen, China. The opening ceremony was accompanied with a speech by local
International Microelectronics Assembly and Packaging Society (IMAPS) Symposium 2018
MRSI Systems is exhibiting at the 51st International Symposium on Microelectronics from October 8-11, 2018 in Pasadena, California at the Pasadena Convention Center.
Optical Fiber Conference and Exposition (OFC) 2018 – San Diego
The exhibition is from March 13th-March 15th. Visit the MRSI Systems’ Booth #4444 at OFC 2018. Enjoy a free “Exhibits Plus Pass” Compliments of MRSI Systems.
High Volume Manufacturing of Photonic Components and Modules
Increasing demand for data and bandwidth requires high volume manufacturing (HVM) of photonics devices. This expansion with double-digit growth rates...
SMT-Bestückung
SMT-Bestückung PCB assembly Complete range of SMT manufacturing machines and solutions pcb-assembly Turn up the volume The MYPro A40: Agility accelerated Verbesserung der
Jet printing
Jetprinting MY700JP MY700JX MY700JD MY700-Broschüre Millionen von hochpräzisen Punkten. Jetzt mit doppelter Vielseitigkeit. Die All-in-One-Lösung für Lötpaste und SMD-Fluide.
The Power of One
Mehrerer Maschinen mit nur einem Datensatz, einem Programm und einem Workflow
Der False Call Killer
pcb-assembly Ein Q & A mit Romain Roux und Nicolas Guillot über DeepReview und die Leistungsfähigkeit der KI-gesteuerten Prüfung Der False Call Killer Manche nennen es den "False
5 Micron Die Bonders
Learn more about MRSI's 5 micron die bonders.
Video gallery
MRSI Systems Video Gallery - See the latest eutectic bonding, die bonding, epoxy stamping, and epoxy die attach videos.
1 Micron Die Bonders
Learn more about MRSI's 1 micron die bonders.
News & events
News & events Events News Press releases Cases Technical articles archive Webinars Gallery Video gallery Our future events & webinars. Our most recent news articles. Keep up to date with our
MRSI中国新产品演示中心开业，将出席讯石研讨会，参加CIOE展会并提供现场演示
die-bonding MRSI中国新产品演示中心开业，将出席讯石研讨会，参加CIOE展会并提供现场演示 摘要：第23届中国国际光电博览会(CIOE)将于2021年9月16-18日在深圳国际会展中心举办。MRSI Systems (Mycronic Group)届时将携最新的MRSI-HVM带轨道双机头固晶机参展，MRSI将在展位#4B79进行现场演示。MRSI
MRSI introduces innovative MRSI-A-L Active Aligner for optical packaging solutions
MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, proudly introduces the MRSI-A-L
MRSI introduces 705HF High Force Die Bonder for power devices and advanced chip packaging
MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, has launched the MRSI-705HF high
MRSI to present at 18th ICCSZ OC Market and Technology Seminar and offer die bonder demonstrations at CIOE
MRSI Systems and CYCAD Century Science and Technology will partner together at the 21st China International Optoelectronic Exposition (CIOE). Product demos will be offered at Cycad’s booth #1C86.
MRSI HVM系列贴片机荣获Laser Focus World创新者奖
ICCSZ讯 近期，全自动，高精度，高速贴贴片与点胶系统的领先制造商MRSI Systems（Mycronic Group）被授予2019年Laser Focus World 创新者奖的光电子器件制造设备类银奖。