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Join MRSI at SPIE Photonics West in San Francisco
die-bonding Join MRSI at SPIE Photonics West in San Francisco Join MRSI at SPIE Photonics West in San Francisco Meet with MRSI Systems, Mycronic Group in San Francisco Booth #5405 MRSI will be
MRSI to present at the 21st Infostone Optical Communication Market and Technology Conference
MRSI will be presenting at the Infostone Optical Communication Market and Technology Conference which will be held at the Hyatt Regency Shenzhen Airport Hotel in Shenzhen, China from September
Visit MRSI at the Compound Semiconductor Advanced Technology & Application Conference
Visit us at the CSC Conference in Suzhou, China from August 3-4th to discuss the current and future states of compound semiconductor device technology with us and other industry experts.]
Join MRSI at SEMICON West 2022
We are excited to announce that MRSI Systems will be exhibiting at SEMICON West from July 12-14th at the Moscone Center in San Francisco! Visit us at booth #2355 to talk with us about topics such
MRSI to present at Automotive LIDAR 2021
MRSI (Mycronic Group) is exhibiting, sponsoring, and presenting at the Automotive LIDAR 2021 Virtual Conference and Exhibition from September 21-23rd, 2021. MRSI is presenting on Wednesday,
SEMICON West 2020 Virtual Event
MRSI Systems invites you to SEMICON West 2020 Virtual Event from July 20-23, 2020.
MRSI Named in the 2019 Infostone Top Honors List in China, with the MRSI-HVM Series Receiving the Award for the Most Competitive Product for Optical Communications
MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding and dispensing systems, has been recognized in the list of 2019 Infostone top
MRSI is Presenting at ICCSZ OC Market and Technology Seminar and Offering Die Bonder Demonstrations at CIOE
MRSI Systems and CYCAD Century Science and Technology will partner at the 21st China International Optoelectronic Exposition (CIOE). Product demos will be offered at Cycad’s booth #1C86. The show
International Microwave Symposium 2019
die-bonding International Microwave Symposium 2019 MRSI Systems is exhibiting at IMS (Booth #686). The world’s largest Microwave and RF industry event is being held in Boston, MA this year at the
MRSI Systems – “One Stop Shop” Fully Automated Die Bonding Solutions
Our die bonders are historically regarded the leaders in flexibility, and during the last two years, we have expanded our die bonding families. These high speed die bonders deliver
Challenges in Die Bonding of Gallium Nitride High Power Devices
Gallium Nitride (GaN) materials have long been regarded as great alternatives and enhancements to GaAs and silicon-based counterparts for applications...
Automotive LIDAR Conference 2018: AI & Autonomous Vehicles
MRSI Systems exhibited at the Automotive LIDAR 2018 Expo and Conference in Detroit, Michigan last month. The conference focused not only on hardware solutions but software as well. The use of AI
MRSI Systems—New Process Pages
These Die Bonding process pages explain the central role that die bonding continues to play in the photonics, sensors and semiconductor industries.
Visit MRSI Systems at the European Conference on Optical Communications (ECOC) 2017 — New Die Bonder for High Volume Manufacturing
Over three decades, MRSI Systems has developed a family of high precision eutectic die bonders for high volume manufacturing of optoelectronics.
Technology Students Experience Local Advanced Technology Manufacturer Up Close
Middlesex Community College technology students recently visited our factory in Billerica, MA.
MRSI Systems Automated Microwave Hybrid Manufacturing at TESAT-Spacecom (TESAT)
Learn more about how VPT Components and MRSI Systems jointly address manufacturing challenges.
Meet with MRSI
Always one micrometer ahead
Always one micrometer ahead In a world of rapid technological change, anticipating our customers’ needs is the foundation for our purposeful innovation process. Demanding customers keep us sharp
Key facts about Mycronic
Mycronic are the inventors of jet printing technology. Laser-based masked writers used for billions of screens. The company has more than 500 patents. Join our us on journey!
Information about the share
Information about the share Analysts Analysts that follow Mycronic. Investment bank Analysts DNB Carnegie Mikael Laséen Handelsbanken Fredrik Lithell Daniel Djurberg Nordea Anders Åkerblom
Shareholders
Who are the largest shareholders at Mycronic? How does the ownership structure and geographic distribution looks like?
Financial & sustainability targets
We will double net sales, double profit, reduce CO2 emissions by half. Follow our aims to transite toward a more sustainable electronics industry.
Financial calendar
Find out all about our financial events and subscribe to our investor events.
Framework for corporate governance
Framework for corporate governance Corporate governance is based on external governing instruments such as the Swedish Companies Act, the Annual Accounts Act, Nasdaq Nordic’s Main Market Rule
Executive management team
Executive management team About executive management Contact Investor Relations Mycronic executive management team consists of seven persons including the CEO. Executive management team Anders
Did you know that Mycronic can assemble electronic components as tiny as a grain of sand?
Did you know that Mycronic can assemble electronic components as tiny as a grain of sand? Our MYPro A40 pick-and-place is at the heart of this incredible precision. These advanced machines are
Cars are smart phones on wheels – are you ready?
Learn how Mycronic’s solutions enable electronics manufacturers to capitalize on the growing demand for electric vehicles and their infotainment systems.
East and West: two ecosystems emerge
Mycronic is adapting to the changing global landscape of electronics production and leveraging its local presence in key markets across Asia, Europe, and the Americas.
Why technological growth leads to more cybercrime
Cybercrime will cost companies worldwide $10.5 trillion annually by 2025. Read about how Mycronic contributes to cyber security and data protection in the electronics industry.
Decreasing the environmental impact of the SLX mask writer
Multibeams to camera - through product life cycle analysis Decreasing the environmental impact of the SLX mask writer When a product is manufactured, it goes through a life cycle that starts with