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Über den Tellerrand hinausschauen
pcb-assembly Ein Innovator im Überblick Wie Wuxi Good Electronics die Grenzen der flexiblen Fertigung verschiebt Über den Tellerrand hinausschauen Das Unternehmen: Wuxi Good Electronics
PCB assembly solutions
SMT Bestückungsanlagen Deep Review for 3D AOI Flexibility. Turbocharged. User-driven design Schneller. Genauer. Intelligenter. Verbesserung der Inspektionsprogrammierung Mycronic 4.0 Der
The perfect solder joint
Unser Versprechen Mit kompletter Volumensteuerung Der perfekte Lötpunk Der Siebdruck hat der Branche eindeutig gut getan und den Herstellern nahezu unbegrenzte Durchlaufgeschwindigkeiten
Wer wir sind
Was wir unseren Teammitgliedern bieten Initiativbewerbung Wer wir sind Flexible Arbeitszeitmodelle mit Gleitzeitkonten Zusätzliche Sozialleistungen wie z.B. Jubiläumsprämien,
Überraschende Erkenntnisse
pcb-assembly MYCenter Analysis zeigt neue Verbesserungsmöglichkeiten auf. Überraschende Erkenntnisse Für Allelektronik in Südschweden war das neue MYCenter Analysis Dashboard ein
Ausbildung
Ausbildung Du hast Lust auf eine Ausbildung in einem internationalen Unternehmen? Bei atg Luther & Maelzer in Wertheim bilden wir aktuell Industriekaufleute, Technische Produktdesigner und
Flying probe for substrate test
Flying probe for substrate test S2-8 / S2-8 plus S2-16 / S2-16 plus S3 S3-8 S2-8 / S2-8 plus S3-8 The Substrate product line is characterized by an outstanding test head technology. Linear motor
MyCare Barebord testing
Press releases
photomask-equipment
Partners
See MRSI Systems strategic partner companies from all over the world that help MRSI Systems provide unsurpassed products for our customers.
Testimonials
See what real MRSI Systems customers are saying about our Die Bonding and Epoxy Dispensing systems and how they have helped them succeed.
Why do customer's choose MRSI?
Learn about MRSI Systems capabilities and what helps MRSI stand apart from the competition in die bonder and epoxy dispensing system manufacturing.
Events
Events bare-board-testning
Mycronic Sweden HQ
Mycronic Sweden HQ Mycronic headquarter in the winter Mycronic AB Nytorpsvägen 9 Box 3141 183 03 Täby Sweden +46 8 638 52 00 +46 8 638 52 90 Mycronic Täby Yes, please contact me
Optical Components & Transceivers
Learn more about Optical Components and Transceivers from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.
On-site training
MRSI offers a comprehensive set of training programs covering our family of products. Contact MRSI Systems to learn more about On-Site Training.
Prototyping and Training Services
We provide prototyping and small batch die bonding services for our customers to shorten your time to market.
MRSI-S-HVM Submicron Die Bonder won the award for “Infostone 2020 The Most Competitive Optical Communications Product”
MRSI Systems (Mycronic Group), submicron die bonder MRSI-S-HVM won the award for "The Most Competitive Optical Communications Product in 2020." The MRSI-S-HVM submicron die bonder was recognized
MRSI将出席第18届ICCSZ OC市场与技术研讨会,并在CIOE提供贴片演示
MRSI Systems(Mycronic Group)赞助由ICCSZ举办的第18届光纤通讯市场暨技术专题研讨会,研讨会将于9月2日至3日在中国深圳举行。同期,中国国际光电博览会(CIOE)于2019年9月4日至7日在中国深圳隆重召开。
MRSI发布为硅光器件、协同封装和晶圆级封装提供亚微米级贴片解决方案
ICC讯 在CIOE 2020,MRSI SYSTEMS将推出一款新产品,高速、灵活的0.5微米 MRSI-S-HVM 贴片机,为硅光器件,协同封装的电子和光子芯片,以及晶圆级封装应用提供解决方案。
MRSI Systems Delivered 3-Micron Die Bonder MRSI-M3 to AIM Photonics Academy’s Education and Practice Factory at MIT in Cambridge for Research and Education
North Billerica, MA, USA, March 20, 2017 — MRSI Systems, a leading provider of fully automated, high-speed, high-precision die bonding and epoxy dispensing systems, today announces the
MRSI launches submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging
At CIOE 2020 MRSI Systems will introduce a new product, MRSI-S-HVM high-speed, flexible 0.5 micrometer die bonder for silicon photonics, co-packaging.
MRSI宣布MRSI-H / HVM系列贴片机精度提升至1.5微米
MRSI Systems(Mycronic Group)很高兴宣布公司MRSI-H / HVM系列产品线的最新进展。MRSI使用行业标准玻璃芯片参考样品测试放置精度,测试结果显示,产品精度从3Sigma的±3微米增强至±1.5微米。该产品从2019年10月1日发货开始,产品名称改为MRSI-H和MRSI-HVM(之前称为MRSI-H3和MRSI-HVM3)。
MRSI Systems Welcomes Dr. Limin Zhou as Senior Director of Strategic Marketing
MRSI Systems, part of the Mycronic Group is pleased to announce the appointment of Dr. Limin Zhou as the Senior Director of Strategic Marketing to expand MRSI’s market presence in China. He will
MRSI launches new Die Bonder with improved throughput for high power laser manufacturers
MRSI Systems (Mycronic Group) is pleased to announce the introduction of MRSI-H-HPLD+, the latest advancement in the MRSI-H/HVM-series product line. This new variant of the successful
MRSI Systems Acquires Die Bonding Business
BILLERICA, MA — January 31, 2014 — MRSI Systems, a developer and manufacturer of turnkey chip placement and dispensing systems, announced today it has completed a leveraged buyout of assets from
The High-Performance and Flexible MRSI A-L for Optical Assembly
The optical components industry demands highly precise and customized equipment for complex optical assembly processes. We have answered this need with our new active aligner - a high-performance
PCB assembly
Our PCB assembly solutions are well known for their flexibility and versatility. A perfect match for low to med volume high-mix manufacturers of electronics.
User-driven design
Introducing the all-new pick-and-place graphical user interface User-driven design An all-new pick-and-place graphical user interface (GUI) raises the visibility of vital process data while
Jet printing
Mycronic jet printing technology makes it possible to dispense solder paste for the most challenging circuit boards and components. Learn more!