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MRSI Systems Provides MRSI-M3 Die Bonding Assembly Work Cell to Fabrinet in Silicon Valley for Fast Prototyping and New Product Introduction

North Billerica, MA, USA, May 24, 2016 — MRSI Systems, a leading provider of fully automated, ultra-precision die bonding and epoxy dispensing systems, today announces supply of its flagship

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MRSI Systems’ New Product MRSI-HVM3 Die Bonder Has Entered Volume Production Driven by Fast and Wide Customer Adoptions

NORTH BILLERICA, Mass., March 6, 2018 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems is pleased to announce that our

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MRSI Systems Receives Funding from State of Massachusetts for Advanced Manufacturing Initiative

Billerica, Mass., Oct, 6, 2017 – MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, has been awarded new funding by the

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MRSI Systems 热烈欢迎贺尉宗出任中国区销售总监

MRSI Systems(Mycronic Group)很高兴地宣布贺尉宗(Hendry He)担任我们的中国区销售总监。他将与现有的销售团队及销售代表一起工作,并作为中国区销售代表服务市场,工作地点为上海。Hendry在半导体设备方面拥有丰富的技术知识以及销售经验。结合Hendry对中国市场的庞大网络的掌握Hendry的加入将进一步提高我们对客户需求的响应能力。

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MRSI Systems welcomes Hendry He as China Country Sales Director

MRSI Systems (Mycronic Group) is pleased to announce our new China Country Sales Director, Hendry He. He will be working alongside the existing sales team and representatives in the region and is

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MRSI receives Laser Focus World Innovators Award for HVM die bonder

MRSI Systems (Mycronic Group) a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2019 Silver Honoree for

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MRSI Systems wins Silver Honoree for Laser Focus World Innovators Award 2023

die-bonding Laser Focus World Innovators Award 2023 MRSI Systems wins Silver Honoree for Laser Focus World Innovators Award 2023 MRSI Systems, a part of Mycronic Group, a leading manufacturer of

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MRSI Mycronic Opens New Demo Center in Shenzhen, China

MRSI Systems (Mycronic Group) has opened the doors to their new “Product Demo Center” in Shenzhen, China. The new demo center is in the Huahan Innovation Office Park in the Nanshan District of

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The new MX7 mounthead

Highlights of the new mounthead technology include Engineering a new generation of high-speed assembly Flexibility. Turbocharged. The new MX7 mounthead Higher throughput The MX7 enables top

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Mycronic 4.0

Mycronic 4.0 is a complete, agile manufacturing solution that masters the complexity of modern electronics production – a highly automated, intelligent factory for just-in-time production, with

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Services

Mycronic service network spans the globe, with service engineers present in more than 50 countries who are specially trained and certified.

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Mycronic South Korea

Mycronic South Korea Mycronic South Korea Mycronic Co. Ltd. 3rd Floor, Jung-San, Bldg. 1026-8, Sanbon-Dong, Gunpo-Si 15808 Gyeonggi-Do South Korea +82 31 387 5111 +82 31 388 0087 Mycronic,

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Mycronic Japan Fukuoka

Mycronic Japan Fukuoka Mycronic Assembly Solutions Co.,Ltd 1-9-25, Enokida, Hakata-ku 812-0004 Fukuoka Japan +81 92 260 7009 +81 92 260 7019 Mycronic, Fukuoka, Japan

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Manual flying probe for PCB test

Manual flying probe for PCB test A5 Neo A7 Pro A7-16 Pro A7XW Pro A9 A9 plus A9L A5 Neo A7 Pro The A5 Neo Flying Probe PCB tester combines affordable technology with all of the enhanced

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Why work at Mycronic?

5 reasons to join Mycronic Why work at Mycronic? In our open and collaborative workplace, you’ll give and get inspiration in equal measure. 1. Bring tomorrow’s electronics to life For over 40

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Mycronic receives order for an FPS Evo

Mycronic AB (publ) has received an order for an FPS Evo from an existing customer in Asia. The order value is in the range of USD 11-13 million. Delivery of the system is planned for the first

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Large area measurement

Meet the world's most accurate metrology system Large area measurement Challenge The crucial component in today’s high-quality displays is their set of photomasks, which must match each other

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Contact us

Contact us Visit our contact page for contact details for our sales and support departments.

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Service solutions Bareboard testing

Service solutions Bareboard testing With regular inspections and maintenance, you ensure an optimal operating condition of your test system over its entire lifetime.  We support you with many

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News

photomask-equipment Read our latest news here.

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MRSI Systems Training Services

Learn more about MRSI's training services including on-site training and software training videos. Contact Us.

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atg Luther & Maelzer Asia, Ltd.

atg Luther & Maelzer Asia Ltd. Mycronic, Taiwan, Taoyuan City atg Luther & Maelzer Asia Ltd. 4F., No. 136, Changchun 2nd Rd., Zhongli Dist., Taoyuan City 320, Taiwan (R.O.C.) Taiwan +886 3

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Optoelectronics Packaging

MRSI Systems has been a leading supplier to manufacturers of advanced optical packaging assembly for over 30 years. This has enabled MRSI to build unmatched expertise in the assembly technologies

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MRSI Launches New MRSI-H3LD Die Bonder Targeted at the High Power Diode Laser Market

MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3 micrometer high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used in advanced

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MRSI-705HF 5 micron high force die bonder won the award for “Infostone 2023 Optical Communication Most Competitive Equipment

On December 28, 2023, MRSI (Mycronic Group) received the “Infostone 2023 Optical Communication Most Competitive Equipment” award for the MRSI-705HF 5 micron high force die bonder at the First

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MRSI Support for Application Specific Pickup Tip Designs

The MRSI-705 features an innovative design with a versatile thirteen-position tool bank for quick, automatic tool changes. Enhanced functionality is achieved with additional tool change banks,

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Join MRSI at IMS in San Diego

The International Microwave Symposium (IMS) is an annual conference that brings together the brightest minds in the microwave and RF industry. This year's event will take place in San Diego, CA,

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Join MRSI Systems at IMAPS Device Packaging Conference this spring!

Experience MRSI Systems at the IMAPS device packaging conference in Fountain Hills, Arizona. MRSI excitedly sponsors the 19th Annual Device Packaging Conference that will be held March 13th-16th

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Optimizing Die Bonding with Planarity Control: Ensuring Precision in Device Attachment Across Industries

Achieving precise and reliable die bonding is crucial in numerous industries, especially when demanding a high degree of parallelism between bonding surfaces.

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Learn why the MRSI-705 is an industry leader in flexibility and reliability

The MRSI-705 5-micron flip-chip die bonder has the largest installed base in photonics packaging, microwave modules, RF power amplifiers, infrared sensors, and medical devices.