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MRSI introduces 705HF High Force Die Bonder for power devices and advanced chip packaging
MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, has launched the MRSI-705HF high
MRSI launches MRSI-705 high-volume configuration
At IMAPS 2020 MRSI Systems will introduce a new 5 micrometer die bonder product, MRSI-705 high-volume configuration. The MRSI-705 was first introduced in 2012 and has enjoyed a dominant position
MRSI to exhibit with live demonstrations and present at the China International Optoelectronic Expo
die-bonding MRSI to exhibit with live demonstrations and present at the China International Optoelectronic Expo We are proud to announce that MRSI, Mycronic Group will be exhibiting at the 24th
MRSI宣布在中国深圳建立HVM3芯片贴装演示能力
MRSI Systems(Mycronic集团)宣布在其位于深圳龙华的姐妹公司,深圳市轴心自控技术有限公司工厂建立一项新的演示能力。我们将根据客户的样品材料,安排并提供我们市场领先的MRSI-HVM3产品的本地演示以及芯片贴装应用。
MRSI中国新产品演示中心开业,将出席讯石研讨会,参加CIOE展会并提供现场演示
die-bonding MRSI中国新产品演示中心开业,将出席讯石研讨会,参加CIOE展会并提供现场演示 摘要:第23届中国国际光电博览会(CIOE)将于2021年9月16-18日在深圳国际会展中心举办。MRSI Systems (Mycronic Group)届时将携最新的MRSI-HVM带轨道双机头固晶机参展,MRSI将在展位#4B79进行现场演示。MRSI
MRSI to present at 18th ICCSZ OC Market and Technology Seminar and offer die bonder demonstrations at CIOE
MRSI Systems and CYCAD Century Science and Technology will partner together at the 21st China International Optoelectronic Exposition (CIOE). Product demos will be offered at Cycad’s booth #1C86.
MRSI to present at Automotive LIDAR 2021
MRSI (Mycronic Group) is exhibiting, sponsoring, and presenting at the Automotive LIDAR 2021 Virtual Conference and Exhibition from September 21-23rd, 2021, a leading event in the
MRSI to offer die bonding demonstrations at Productronica
MRSI Systems (Mycronic Group) will be exhibiting with Mycronic at Productronica. Product demos will be offered at the Mycronic Booth #341 in Hall A3 (SMT Cluster). The exhibition will be held at
Die Bonding Solutions
Having a proven ultra-accurate die bonding system platform that is mechanically and thermally stable, with no cantilevered parts, are essential elements to achieve accurate device placement.
Mycronic technology essential in 5G development
die-bonding Mycronic technology essential in 5G development Die bonding systems are required for the groundbreaking digital transition Mycronic technology essential in 5G development 5G is
Die Bonding Process Pages – Highlights
Various die bonding approaches have been, and still are, developed to meet the ever-evolving product requirements.
MRSI-H-HPLD 1.5 micron Die Bonder Won the Award for “Infostone 2022 Outstanding Technology”
MRSI Systems wins 2022 Infostone award for outstanding technology for their world-renowned die bonder!
MRSI shines at May events: showcased and featured
In the bustling world of technology, May was a month marked by significant events, and MRSI was at the forefront. With appearances at IMAPS New England in Boxborough, MA, and the 2024
The Next Generation MRSI-175Ag Epoxy Dispenser is now available
die-bonding Epoxy Dispenser The Next Generation MRSI-175Ag Epoxy Dispenser is now available In the fast-paced world of advanced packaging and semiconductor manufacturing, precision and efficiency
Learn more about MRSI’s Training Programs
die-bonding Learn more about MRSI’s Training Programs MRSI is currently offering training programs at our Tewksbury, MA facility. These courses are taught by dedicated trainers who are MRSI
Advanced Patented Tool Change Turret from MRSI: Revolutionizing Precision Technology
MRSI’s die bonding systems are designed to address the challenges of chip packaging with a focus on efficiency, precision, and productivity. These systems feature an advanced, patented
Experience MRSI’s latest innovations at the OFC Exhibition
MRSI will be a featured exhibitor at the OFC Exhibition. The OFC Exhibition is a unique and premium opportunity to immerse yourself into the photonics industry.
Component storage
Automated, highly flexible and expandable component storage tower with a small footprint, designed for deployment near the production line.
Process software
The richest smt software suite in the industry. Provides fully integrated applications covering the entire chain Enhance your productivity of SMT assembly.
Stencil printing
High-Speed Stencil Printing for PCB Assembly Lines. Learn more!
Solutions
Solutions PCB assembly solutions Case stories Mycronic offers advanced PCB assembly solutions to help streamline the manufacturing process. Our solutions are designed with precision and accuracy
Innovation overdrive
Accelerating R&D cycles and expanding product mix in China
Conformal coating
Protecting electronics assemblies are growing in complexity. Capability, versatility and precision are key.
Service & support
MYCare Services Superior service for superior performance Service & support Our MYCare service offering for our advanced Pattern Generators is a key part of our commitment to our customers.
Meet your new colleagues
Taking a proactive, customer-centric approach with your new colleages Taking a proactive, customer-centric approach Meet your new colleagues We always go to great lengths to ensure each customer
MRSI Named in the 2019 Infostone Top Honors List in China, with the MRSI-HVM Series Receiving the Award for the Most Competitive Product for Optical Communications
MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding and dispensing systems, has been recognized in the list of 2019 Infostone top
MRSI to present at Automotive LIDAR 2021
MRSI (Mycronic Group) is exhibiting, sponsoring, and presenting at the Automotive LIDAR 2021 Virtual Conference and Exhibition from September 21-23rd, 2021. MRSI is presenting on Wednesday,
MRSI is Presenting at ICCSZ OC Market and Technology Seminar and Offering Die Bonder Demonstrations at CIOE
MRSI Systems and CYCAD Century Science and Technology will partner at the 21st China International Optoelectronic Exposition (CIOE). Product demos will be offered at Cycad’s booth #1C86. The show
MRSI to present at the 21st Infostone Optical Communication Market and Technology Conference
MRSI will be presenting at the Infostone Optical Communication Market and Technology Conference which will be held at the Hyatt Regency Shenzhen Airport Hotel in Shenzhen, China from September
Join MRSI at the 50th European Conference on Optical Communication
We are pleased to be exhibiting again this year at the 50th ECOC in Frankfurt am Main, Germany.