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点胶和涂覆
点胶和涂覆 桌面点胶 MYSmart在线点胶 防护涂覆 工业点胶 Inspection 对于小批量制造商,MYSmart提供了一系列具有多种功能的桌面点胶机器人 该系列产品已在最先进的生产环境中得到验证,提供广泛的在线点胶解决方案以及丰富的阀体技术组合 用于保护和加固电子产品。高性能、高精度的防护涂覆设备和阀体技术 即工业点胶系统,在一系列工业应用中,自动点涂结构性、导热、密封、粘合流体
The perfect solder joint
我们的承诺 全面的体积控制 实现完美的焊点 钢网印刷在贴装行业发挥了很好的作用,并为制造商提供了几乎无限的大批量生产速度。但这背后并非没有取舍。 挑战 对于频繁的换线,钢网的清洁和存储反而会增加成本,并且成为错误的来源。用昨天的解决方案来解决今天的生产挑战几乎不可能实现卓越的结果。 事实上,绝大多数PCB缺陷都可以追溯到钢网印刷过程。与此同时,世界各地的制造商不得不采取行动,
流程软件
流程软件 MYCenter Analysis MYPro Connect MYPro Link MYPro Create MYPro Create makes multi-machine programming a lot smoother and paves the way for future full-line programming. 您的生产控制中心。
解决方案
解决方案 PCB贴装解决方案 客户案例 Mycronic提供先进的PCB贴装解决方案,以帮助简化制造过程。我们的解决方案在设计之初便将精度和准确性作为重要考量,旨在确保您的PCB贴装过程具有最高的效率和质量。 我们收集了很多客户的使用评价,这些评价反映了客户如何从我们的PCB贴装解决方案中获益。这些案例彰显了Mycronic PCB贴装解决方案的优势。希望能给您带来借鉴和启发。
新闻
pcb-assembly Our most recent news articles.
元件存储
元件存储 MYTower 5 MYTower 6 MYTower 6+ MYTower 7+ MYTower 5x MYTower 6x MYTower产品手册 Mycronic最紧凑的元件存储系统。 适合储存大量4-13英寸和15英寸卷带。 设计用于储存大量15英寸卷带。 Mycronic最高的存储系统,可在SMT生产线旁边储存大量卷带。 拥有高度受限空间的最大卷带存储容量。
High-speed solder paste dispensing
Unser Versprechen Ohne Kompromisse Jetprinting in Höchstgeschwindigkeit Sie waren davon überzeugt, alles im Griff zu haben. Aber die kontinuierliche Miniaturisierung macht den Betrieb
Versandmitarbeitender (m/w/d)
Erstellen der Versandpapiere im System und Anmeldung der Lieferungen bei den Paketdienstleistern Versandmitarbeitender (m/w/d) Das Aufgabengebiet: • Warenannahme, Auspacken und Verräumen der
Turn up the volume
pcb-assembly The MYPro A40 in brief Two ambitious goals. One powerful mounthead technology. 48% faster throughput Six times larger components All-new graphical user interface A united force of
Mycronic to showcase more versatile, high-productivity assembly solutions at Productronica 2023
Mycronic, the leading Sweden-based electronics assembly solutions provider, will continue to respond to growing customer demand for high-flexibility, high-productivity solutions for zero-defect
Printing without limits
pcb-assembly Available in the beginning of 2024 Mycronic’s stencil printing and jet printing platforms combine to produce any board at any speed. Printing without limits Business is growing for
Putting performance data to work
As an innovative European contract manufacturer, DF Elettronica is determined to continually push the limits of automation. Whether it’s inspection, traceability, material transport or process
Programming just got simpler
pcb-assembly With the new MYPro I™ series 3D AOI Programming just got simpler Faster programming. Smarter guidance. Zero false calls. When it comes to advanced 3D AOI, demands are high and
Empowering people through automation
pcb-assembly How smarter human–machine collaboration is making your people more valuable than ever Empowering people through automation Even with all your resources running at full capacity,
The connectivity continues
pcb-assembly And this time, it’s vertical The connectivity continues Over the past year, Hermes compatibility has been added to a number of Mycronic’s SMT solutions. The next step is to extend
Analysis made easy
For a savvy production manager, it’s always possible to get the right troubleshooting data from your pick-and-place machine – if you have plenty of time and effort to spare. Thanks to MYCenter
More virtual interactions, and the rise of a metaverse
photomask-equipment City overnight view Connectivity’s role in making everyday life manageable during Covid-19 More virtual interactions, and the rise of a metaverse The pandemic is still
Mycronic receives order for three mask writers
Mycronic AB (publ) has received an order for three mask writers from an existing customer in Asia: one Prexision 8 Evo, one SLX and one FPS6100. The order value is in the range of USD 36-40
Mycronic receives order for an SLX mask writer
Mycronic AB (publ) has received an order for an SLX mask writer from an existing customer in Asia. The order value is in the range of USD 4-6 million. Delivery of the system is planned for the
Mycronic receives order for an SLX mask writer
Mycronic AB (publ) has received an order for an SLX mask writer from an existing customer in Asia. The order value is in the range of USD 4-6 million. Delivery of the system is planned for the
Material handling
When it comes to material tracking and stock accuracy, Mycronic’s solutions offer the industry’s most precise and error-free systems. From barcode feeder loading and instructions on electronic
Mycronic Singapore
Mycronic Singapore Mycronic Singapore Mycronic Pte Ltd. 9 Tagore Lane, #02-08/09, 9@Tagore 787472 Singapore Singapore +65 6281 7997 +65 6281 7667 Mycronic, Tagore, Singapore Yes, please contact
Products
The leading supplier of bare board test systems PCB and substrate test systems Manual flying probe for PCB test Flying probe for substrate test Automated flying probe for PCB test Fixture based
History
Bare board testing and Mycronic History Mycronic timeline from 1989 Bare board testing timeline June 2021 atg Luther & Maelzer is acquired by Mycronic. Oct 2018 Xcerra Corporation is acquired
Berufsinformationstag 2024
bare-board-testning Berufsinformationstag in Wertheim-Bestenheid am 29.06.2024 Auch dieses Jahr ist die atg Luther & Maelzer GmbH mit einem Stand am Wertheimer Berufsinformationstag vertreten.
Services
Service solutions Bareboard testing Bareboard spare parts, consumables & accessories We support you with our many years of experience and solutions that are tailored to your system and
Die bonding
Die bonding is as old as the semiconductor industry itself. From the onset, integrated circuits or ICs were developed using four levels of interconnections.
Products
Learn more about MRSI systems products including the MRSI-S-HVM, MRSI-HVM, MRSI-H, MRSI-M3, MRSI-705 die bonders, high precision epoxy dispensing systems & active alignment & die bonding
Eutectic die bonding
Eutectic die bonding, sometimes referred to as eutectic die attach, is a die bonding technique used for devices that require enhanced heat dissipation.
Epoxy die bonding
Epoxy die bonding, sometimes referred to as epoxy die attach, is the most widely used die bonding technique in semiconductor assembly.