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BILLERICA, MA — February 2, 2015 — MRSI Systems, a developer and manufacturer of turnkey die bonding and dispensing systems, announced today the introduction of their most advanced system with

die-bonding MRSI receives Laser Focus World Silver Award for MRSI-H-HPLD Die Bonder MRSI receives Laser Focus World Silver Award for MRSI-H-HPLD Die Bonder MRSI Systems (Mycronic Group), a

Eutectic bonding is used as an alternative to epoxy bonding. The choice of eutectic bonding is determined by the application and the technical requirements.

Leading optoelectronic and semiconductor packaging companies require fully automated, ultra-precision die bonding systems

As consumers expect more power and more bandwidth from their devices, we see the Advanced Electronic Packaging industry under continuing pressure to cram more technology into smaller spaces. One

Mark your calendars for September 9-10, 2024, at the InterContinental Hotel of the Shenzhen World Exhibition and Convention Center in Shenzhen, China, which hosts the highly anticipated Infostone

MRSI will be presenting at the Infostone Optical Communication Market and Technology Conference which will be held at the Hyatt Regency Shenzhen Airport Hotel in Shenzhen, China from September

MRSI has recently launched the 705HF die bonder, which is designed to cater to the requirements of power devices and advanced chip packaging. The machine is equipped with a heated bond head that

Our launch of our free software training outlined the cadence of how 1 training video would be released a week. Since then, we are proud to announce we have released five new videos with more to

The Optical Fiber Conference (OFC) will be held at the San Diego Conference Center in San Diego, CA, USA from March 3-7, 2019. The exhibition is from March 5-7. Visit the MRSI Systems’ Booth #4541

The Optical Fiber Conference (OFC) will be held at the San Diego Conference Center in San Diego, CA, USA from March 8-12, 2020.

OFC will be held at the San Diego Conference Center from March 6-10th, 2022 in San Diego, CA, USA. OFC is the largest global conference and exposition for optical communications.

We are proud to announce that MRSI will be exhibiting at this year’s 24th China International Optoelectronic Exposition. This event will be held from September 7-9th (Postponed to September 6-8,

die-bonding IFOC 2020 MRSI Systems – CIOE 2020 & IFOC 2020 Highlights IFOC 2020 is one of the most influential events in the optical communication industry in China. Over 800 professionals

Join us in our booth at the Denver, Colorado IMS event this month to talk with us and build connections! We will be more than happy to discuss the current products our company has to offer.

Meet with MRSI Systems in San Francisco

The International Microwave Symposium was held at the Boston Convention Center last month. The event had over 9,000 attendees including exhibitors and guests, which represents a 14% increase over

Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic Group) and General Manager of MRSI Automation (Shenzhen) Co., Ltd., presented “Assembly Challenges and Solutions

MRSI Systems is exhibiting at the IEEE 72nd Electronics Components and Technology Conference from June 1-3, 2022 in San Diego, CA. Stop by the MRSI Booth #613 to learn how we can help solve your

MRSI is now offering an extensive library of software training videos for your MRSI die bonding and epoxy dispense systems.

die-bonding High-Volume Manufacturing (HVM) of Photonics Devices – Success Requires Expertise in Eutectic Bonding of Chip on Submount (CoS) In this post we examine the critical manufacturing

MRSI Systems will be demonstrating our “One Stop Shop” capabilities at the 20th China International Optoelectronic Exposition (CIOE) at the Shenzhen Convention and Exhibition Center with our

BILLERICA, MA — April 22, 2015 — MRSI Systems, a developer and manufacturer of turnkey chip placement and dispensing systems, has integrated in situ light measurement for Active Optical Cable

Customers appreciate the extensive product knowledge that the team has and that they are able to talk to a person that knows them and their machine.

die-bonding IMS 2019 Boston The International Microwave Symposium was held at the Pennsylvania Convention Center in Philadelphia last month. The event was well attended with over 8,400

Download articles from MRSI systems and read about how we are changing the die bonding industry.

Remuneration Remuneration to the CEO and other senior executives The principles for remuneration to the CEO and other senior executives are approved by the Annual General Meeting. The proposed

Mycronic AB (publ) has received an order for two SLX mask writers from an existing customer in the US. The order value is in the range of USD 14-16 million. Delivery of the first system is

Mycronic AB (publ) has received an order for an SLX mask writer from an existing customer in Asia. The order value is in the range of USD 6-8 million. Delivery of the system is planned for the

Analysts, investors and media are invited to the presentation of Mycronic’s Q2 2024. The presentation will be held on July 12, 2024, at 10:00 a.m. CEST. The report is published on July 12, 2024, at