Go to main content

Search

Page

atg Luther & Maelzer GmbH (HQ)

atg Luther & Maelzer GmbH (HQ) atg Luther & Maelzer GmbH New Building atg Luther & Maelzer GmbH Karl-Carstens-Straße 19 97877 Wertheim Germany +49 9342 291 0 (Reception), +49 9342

Page

MRSI钱毅博士:5G时代自动化贴片系统的发展趋势

5G时代的到来势不可挡,而这一趋势也不断对芯片的贴片、封装工艺提出新的要求。在此背景下, 作为全球光电器件自动化贴片封装设备的领军企业, MRSI Systems也适时推出了新产品、新技术。在今年9月的深圳光博会上,MRSI的产品管理和市场营销副总裁钱毅博士向OFweek光通讯网介绍了MRSI的产品、研发优势及未来的市场趋势。

Page

Multiple Die Eutectic Bonding

Eutectic bonding is used as an alternative to epoxy bonding. The choice of eutectic bonding is determined by the application and the technical requirements.

Page

How to Choose a Die Bonding System

Leading optoelectronic and semiconductor packaging companies require fully automated, ultra-precision die bonding systems

Page

Epoxy Die Bonding of Ultra Small Ceramic Capacitors

As consumers expect more power and more bandwidth from their devices, we see the Advanced Electronic Packaging industry under continuing pressure to cram more technology into smaller spaces. One

Page

Dr. Limin Zhou to present at the 22nd Infostone Optical Communication and Market Technology Conference (IFOC 2024)

Mark your calendars for September 9-10, 2024, at the InterContinental Hotel of the Shenzhen World Exhibition and Convention Center in Shenzhen, China, which hosts the highly anticipated Infostone

Page

MRSI to present at the 21st Infostone Optical Communication Market and Technology Conference

MRSI will be presenting at the Infostone Optical Communication Market and Technology Conference which will be held at the Hyatt Regency Shenzhen Airport Hotel in Shenzhen, China from September

Page

MRSI to exhibit with live demonstrations and present at the China International Optoelectronic Conference (CIOE) in Shenzhen

We are proud to announce that MRSI will be exhibiting at this year’s 24th China International Optoelectronic Exposition. This event will be held from September 7-9th (Postponed to September 6-8,

Page

MRSI-705HF High Force Die Bonder for power devices and advanced chip packaging

MRSI has recently launched the 705HF die bonder, which is designed to cater to the requirements of power devices and advanced chip packaging. The machine is equipped with a heated bond head that

Page

MRSI presented “Assembly Challenges and Solutions for Photonics Devices in Automotive LIDAR” at Automotive LIDAR 2022

Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic Group) and General Manager of MRSI Automation (Shenzhen) Co., Ltd., presented “Assembly Challenges and Solutions

Page

An update on our free software training video program

Our launch of our free software training outlined the cadence of how 1 training video would be released a week. Since then, we are proud to announce we have released five new videos with more to

Page

MRSI Systems Announces “One Stop Shop” Die Bonding Solutions & Participation at CIOE and ECOC

MRSI Systems will be demonstrating our “One Stop Shop” capabilities at the 20th China International Optoelectronic Exposition (CIOE) at the Shenzhen Convention and Exhibition Center with our

Page

Visit MRSI Systems at the Optical Fiber Conference in San Diego

The Optical Fiber Conference (OFC) will be held at the San Diego Conference Center in San Diego, CA, USA from March 3-7, 2019. The exhibition is from March 5-7. Visit the MRSI Systems’ Booth #4541

Page

MRSI is Exhibiting at the Optical Fiber Conference in San Diego

The Optical Fiber Conference (OFC) will be held at the San Diego Conference Center in San Diego, CA, USA from March 8-12, 2020.

Page

MRSI is exhibiting at the Optical Fiber Conference

OFC will be held at the San Diego Conference Center from March 6-10th, 2022 in San Diego, CA, USA. OFC is the largest global conference and exposition for optical communications.

Page

MRSI Systems Integrates In Situ Light Measurement for AOC into Die Bonder

BILLERICA, MA — April 22, 2015 — MRSI Systems, a developer and manufacturer of turnkey chip placement and dispensing systems, has integrated in situ light measurement for Active Optical Cable

Page

MRSI Systems – CIOE 2020 & IFOC 2020 Highlights

die-bonding IFOC 2020 MRSI Systems – CIOE 2020 & IFOC 2020 Highlights IFOC 2020 is one of the most influential events in the optical communication industry in China. Over 800 professionals

Page

Come visit us at the International Microwave Symposium

Join us in our booth at the Denver, Colorado IMS event this month to talk with us and build connections! We will be more than happy to discuss the current products our company has to offer.

Page

Visit MRSI at SPIE Photonics West 2022

Meet with MRSI Systems in San Francisco

Page

Thank You for Visiting MRSI at the International Microwave Symposium in Boston

The International Microwave Symposium was held at the Boston Convention Center last month. The event had over 9,000 attendees including exhibitors and guests, which represents a 14% increase over

Page

Visit MRSI at ECTC in San Diego

MRSI Systems is exhibiting at the IEEE 72nd Electronics Components and Technology Conference from June 1-3, 2022 in San Diego, CA. Stop by the MRSI Booth #613 to learn how we can help solve your

Page

LIDAR, AR/VR/MR

Learn more about LiDAR, AR/VR/MR from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.

Page

Sensors

The photonics sensor and detectors market is growing rapidly, which encourages application of photonics sensor technology into several industries areas such as manufacturing, defense &

Page

atg Luther & Maelzer, part of Mycronic Inc.

atg Luther & Maelzer, part of Mycronic Inc. Mycronic, USA, Tewksbury atg Luther & Maelzer USA, a Mycronic Inc. company 554 Clark Road 01876 Tewksbury, MA USA +1 909 374 1302 Mycronic, 554

Page

Technical articles archive

Download articles from MRSI systems and read about how we are changing the die bonding industry.

Page

MRSI Systems Launches New Software Video Training Programs

MRSI is now offering an extensive library of software training videos for your MRSI die bonding and epoxy dispense systems.

Page

High-Volume Manufacturing (HVM) of Photonics Devices – Success Requires Expertise in Eutectic Bonding of Chip on Submount (CoS)

die-bonding High-Volume Manufacturing (HVM) of Photonics Devices – Success Requires Expertise in Eutectic Bonding of Chip on Submount (CoS) In this post we examine the critical manufacturing

Page

MRSI Systems’ Customer Support – Peter Cronin

Customers appreciate the extensive product knowledge that the team has and that they are able to talk to a person that knows them and their machine.

Page

IMS 2019 Boston

die-bonding IMS 2019 Boston The International Microwave Symposium was held at the Pennsylvania Convention Center in Philadelphia last month. The event was well attended with over 8,400

Page

International Microelectronics Assembly and Packaging Society (IMAPS) Symposium 2017

The 50th Annual International Symposium on Microelectronics will be held October 9-12, 2017, in Raleigh, North Carolina. MRSI Systems will be exhibiting.