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MRSI is exhibiting at the Optical Fiber Conference

OFC will be held at the San Diego Conference Center from March 6-10th, 2022 in San Diego, CA, USA. OFC is the largest global conference and exposition for optical communications.

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MRSI to exhibit with live demonstrations and present at the China International Optoelectronic Conference (CIOE) in Shenzhen

We are proud to announce that MRSI will be exhibiting at this year’s 24th China International Optoelectronic Exposition. This event will be held from September 7-9th (Postponed to September 6-8,

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MRSI Systems – CIOE 2020 & IFOC 2020 Highlights

die-bonding IFOC 2020 MRSI Systems – CIOE 2020 & IFOC 2020 Highlights IFOC 2020 is one of the most influential events in the optical communication industry in China. Over 800 professionals

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Come visit us at the International Microwave Symposium

Join us in our booth at the Denver, Colorado IMS event this month to talk with us and build connections! We will be more than happy to discuss the current products our company has to offer.

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Visit MRSI at SPIE Photonics West 2022

Meet with MRSI Systems in San Francisco

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Thank You for Visiting MRSI at the International Microwave Symposium in Boston

The International Microwave Symposium was held at the Boston Convention Center last month. The event had over 9,000 attendees including exhibitors and guests, which represents a 14% increase over

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MRSI presented “Assembly Challenges and Solutions for Photonics Devices in Automotive LIDAR” at Automotive LIDAR 2022

Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic Group) and General Manager of MRSI Automation (Shenzhen) Co., Ltd., presented “Assembly Challenges and Solutions

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Visit MRSI at ECTC in San Diego

MRSI Systems is exhibiting at the IEEE 72nd Electronics Components and Technology Conference from June 1-3, 2022 in San Diego, CA. Stop by the MRSI Booth #613 to learn how we can help solve your

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MRSI Systems Launches New Software Video Training Programs

MRSI is now offering an extensive library of software training videos for your MRSI die bonding and epoxy dispense systems.

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High-Volume Manufacturing (HVM) of Photonics Devices – Success Requires Expertise in Eutectic Bonding of Chip on Submount (CoS)

die-bonding High-Volume Manufacturing (HVM) of Photonics Devices – Success Requires Expertise in Eutectic Bonding of Chip on Submount (CoS) In this post we examine the critical manufacturing

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MRSI Systems Announces “One Stop Shop” Die Bonding Solutions & Participation at CIOE and ECOC

MRSI Systems will be demonstrating our “One Stop Shop” capabilities at the 20th China International Optoelectronic Exposition (CIOE) at the Shenzhen Convention and Exhibition Center with our

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MRSI Systems Integrates In Situ Light Measurement for AOC into Die Bonder

BILLERICA, MA — April 22, 2015 — MRSI Systems, a developer and manufacturer of turnkey chip placement and dispensing systems, has integrated in situ light measurement for Active Optical Cable

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MRSI Systems’ Customer Support – Peter Cronin

Customers appreciate the extensive product knowledge that the team has and that they are able to talk to a person that knows them and their machine.

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IMS 2019 Boston

die-bonding IMS 2019 Boston The International Microwave Symposium was held at the Pennsylvania Convention Center in Philadelphia last month. The event was well attended with over 8,400

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International Microelectronics Assembly and Packaging Society (IMAPS) Symposium 2017

The 50th Annual International Symposium on Microelectronics will be held October 9-12, 2017, in Raleigh, North Carolina. MRSI Systems will be exhibiting.

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International Microelectronics Assembly and Packaging Society New England 45th Symposium & Expo

IMAPS New England Chapter’s Symposium will be held at the Boxborough Regency Hotel in Boxborough, MA, May 1st, 2018.

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MRSI钱毅博士:5G时代自动化贴片系统的发展趋势

5G时代的到来势不可挡,而这一趋势也不断对芯片的贴片、封装工艺提出新的要求。在此背景下, 作为全球光电器件自动化贴片封装设备的领军企业, MRSI Systems也适时推出了新产品、新技术。在今年9月的深圳光博会上,MRSI的产品管理和市场营销副总裁钱毅博士向OFweek光通讯网介绍了MRSI的产品、研发优势及未来的市场趋势。

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Multiple Die Eutectic Bonding

Eutectic bonding is used as an alternative to epoxy bonding. The choice of eutectic bonding is determined by the application and the technical requirements.

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How to Choose a Die Bonding System

Leading optoelectronic and semiconductor packaging companies require fully automated, ultra-precision die bonding systems

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Epoxy Die Bonding of Ultra Small Ceramic Capacitors

As consumers expect more power and more bandwidth from their devices, we see the Advanced Electronic Packaging industry under continuing pressure to cram more technology into smaller spaces. One

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Dr. Limin Zhou to present at the 22nd Infostone Optical Communication and Market Technology Conference (IFOC 2024)

Mark your calendars for September 9-10, 2024, at the InterContinental Hotel of the Shenzhen World Exhibition and Convention Center in Shenzhen, China, which hosts the highly anticipated Infostone

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MRSI to present at the 21st Infostone Optical Communication Market and Technology Conference

MRSI will be presenting at the Infostone Optical Communication Market and Technology Conference which will be held at the Hyatt Regency Shenzhen Airport Hotel in Shenzhen, China from September

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MRSI-705HF High Force Die Bonder for power devices and advanced chip packaging

MRSI has recently launched the 705HF die bonder, which is designed to cater to the requirements of power devices and advanced chip packaging. The machine is equipped with a heated bond head that

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An update on our free software training video program

Our launch of our free software training outlined the cadence of how 1 training video would be released a week. Since then, we are proud to announce we have released five new videos with more to

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Remuneration to the CEO

Remuneration Remuneration to the CEO and other senior executives The principles for remuneration to the CEO and other senior executives are approved by the Annual General Meeting. The proposed

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Quality & environmental policy

ID: 80018 | Version: 2 | Published: 2024-05-02 Mycronic group quality and environmental policy Mycronic’s vision is to be the most trusted partner to the creators of tomorrow’s electronics. We

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Anti-corruption policy

ID: 80214 | Version: 5 | Published May 08, 2025 Mycronic group anti-corruption policy The purpose of this Anti-Corruption Policy (the “Policy”) is to clarify the rules applied by Mycronic AB and

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Applications

Learn more about MRSI Systems Applications including Microelectronics, Microwave & RF as well as Photonics and Sensors.

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Contact

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Bareboard spare parts, consumables & accessories

Bareboard spare parts, consumables & accessories Original spare parts, consumables or accessories - the guarantee for absolute reliability. No matter for which of our machines, we always try to