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Meet your new colleagues
Taking a proactive, customer-centric approach with your new colleages Taking a proactive, customer-centric approach Meet your new colleagues We always go to great lengths to ensure each customer
Exhibit at CPCA 2024
bare-board-testning atg Luther & Maelzer exhibit at CPCA 2024 This year's CPCA trade fair took place from 13 to 15 May 2024 at the National Exhibition Center in Shanghai. More than 700
About us at Bareboard testing
What we offer to our team members About us at Bareboard testing Flexible working time models with flextime accounts Additional social benefits: anniversary bonuses, commuting expenses, group
5 Micron Die Bonders
Learn more about MRSI's 5 micron die bonders.
Career
Career Available jobs About us Apprenticeship program See your future opportunities here See your future opportunities here. What we offer. Education for future industrial clerks, technical
Video gallery
MRSI Systems Video Gallery - See the latest eutectic bonding, die bonding, epoxy stamping, and epoxy die attach videos.
1 Micron Die Bonders
Learn more about MRSI's 1 micron die bonders.
Apprenticeship program
Apprenticeship program Are you interested in an apprenticeship in an international company? At atg Luther & Maelzer in Wertheim, we offer apprenticeship programs for future industrial clerks,
Stencil printing
High-Speed Stencil Printing for PCB Assembly Lines. Learn more!
MRSI中国新产品演示中心开业,将出席讯石研讨会,参加CIOE展会并提供现场演示
die-bonding MRSI中国新产品演示中心开业,将出席讯石研讨会,参加CIOE展会并提供现场演示 摘要:第23届中国国际光电博览会(CIOE)将于2021年9月16-18日在深圳国际会展中心举办。MRSI Systems (Mycronic Group)届时将携最新的MRSI-HVM带轨道双机头固晶机参展,MRSI将在展位#4B79进行现场演示。MRSI
MRSI introduces innovative MRSI-A-L Active Aligner for optical packaging solutions
MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, proudly introduces the MRSI-A-L
News & events
News & events Events News Press releases Cases Technical articles archive Webinars Gallery Video gallery MRSI events Our future events & webinars. Our most recent news articles. Keep up to
MRSI introduces 705HF High Force Die Bonder for power devices and advanced chip packaging
MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, has launched the MRSI-705HF high
MRSI launches MRSI-705 high-volume configuration
At IMAPS 2020 MRSI Systems will introduce a new 5 micrometer die bonder product, MRSI-705 high-volume configuration. The MRSI-705 was first introduced in 2012 and has enjoyed a dominant position
MRSI to exhibit with live demonstrations and present at the China International Optoelectronic Expo
die-bonding MRSI to exhibit with live demonstrations and present at the China International Optoelectronic Expo We are proud to announce that MRSI, Mycronic Group will be exhibiting at the 24th
MRSI Systems推出用于新应用的MRSI-HVM3P新产品
die-bonding MRSI Systems推出用于新应用的MRSI-HVM3P新产品 MRSI Systems(Mycronic集团)8月20日在美国马萨诸塞州扩展其业界领先的MRSI-HVM3高速贴片机机平台,推出MRSI-HVM3P新款机型,为有源光缆(AOC)、管盒(Gold-box)封装 以及 基板芯片(CoC)之外 的其他应用提供优化配置。
MRSI宣布在中国深圳建立HVM3芯片贴装演示能力
MRSI Systems(Mycronic集团)宣布在其位于深圳龙华的姐妹公司,深圳市轴心自控技术有限公司工厂建立一项新的演示能力。我们将根据客户的样品材料,安排并提供我们市场领先的MRSI-HVM3产品的本地演示以及芯片贴装应用。
MRSI to present at 18th ICCSZ OC Market and Technology Seminar and offer die bonder demonstrations at CIOE
MRSI Systems and CYCAD Century Science and Technology will partner together at the 21st China International Optoelectronic Exposition (CIOE). Product demos will be offered at Cycad’s booth #1C86.
MRSI HVM系列贴片机荣获Laser Focus World创新者奖
ICCSZ讯 近期,全自动,高精度,高速贴贴片与点胶系统的领先制造商MRSI Systems(Mycronic Group)被授予2019年Laser Focus World 创新者奖的光电子器件制造设备类银奖。
MRSI to present at Automotive LIDAR 2021
MRSI (Mycronic Group) is exhibiting, sponsoring, and presenting at the Automotive LIDAR 2021 Virtual Conference and Exhibition from September 21-23rd, 2021, a leading event in the
MRSI to offer die bonding demonstrations at Productronica
MRSI Systems (Mycronic Group) will be exhibiting with Mycronic at Productronica. Product demos will be offered at the Mycronic Booth #341 in Hall A3 (SMT Cluster). The exhibition will be held at
MRSI-H1: Comprehensive High-Precision Die Bonding Solutions
In the fast-paced world of photonics manufacturing, having the right tools can make all the difference. The MRSI-H1 is designed to meet the demands of high-volume production with its
The Next Generation MRSI-175Ag Epoxy Dispenser is now available
die-bonding Epoxy Dispenser The Next Generation MRSI-175Ag Epoxy Dispenser is now available In the fast-paced world of advanced packaging and semiconductor manufacturing, precision and efficiency
Join MRSI at the International Microwave Symposium in San Francisco
The International Microwave Symposium (IMS) is an annual conference for professionals in the microwave and RF industry.
Die Bonding Solutions
Having a proven ultra-accurate die bonding system platform that is mechanically and thermally stable, with no cantilevered parts, are essential elements to achieve accurate device placement.
MRSI Systems 推出用于大批量生产光电子器件的高速贴片机
美国马萨诸塞州, August 14, 2017 – 全球领先的全自动、高精度、高速贴片和点胶系统制造商,MRSI Systems推出一款新型产品, MRSI-HVM3 高速贴片机,以支持光电子客户的大批量生产需求。目前,MRSI-HVM3 正在全面投产并发货至世界各地的客户。
Die Bonding Process Pages – Highlights
Various die bonding approaches have been, and still are, developed to meet the ever-evolving product requirements.
MRSI-H-HPLD 1.5 micron Die Bonder Won the Award for “Infostone 2022 Outstanding Technology”
MRSI Systems wins 2022 Infostone award for outstanding technology for their world-renowned die bonder!
MRSI shines at May events: showcased and featured
In the bustling world of technology, May was a month marked by significant events, and MRSI was at the forefront. With appearances at IMAPS New England in Boxborough, MA, and the 2024
Learn more about MRSI’s Training Programs
die-bonding Learn more about MRSI’s Training Programs MRSI is currently offering training programs at our Tewksbury, MA facility. These courses are taught by dedicated trainers who are MRSI