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Flying probe for substrate test S2-8 / S2-8 plus S2-16 / S2-16 plus S3 S3-8 S2-8 / S2-8 plus S3-8 The Substrate product line is characterized by an outstanding test head technology. Linear motor

Events bare-board-testning

Mycronic Sweden HQ Mycronic headquarter in the winter Mycronic AB Nytorpsvägen 9 Box 3141 183 03 Täby Sweden +46 8 638 52 00 +46 8 638 52 90 Mycronic Täby Yes, please contact me

Learn about MRSI Systems capabilities and what helps MRSI stand apart from the competition in die bonder and epoxy dispensing system manufacturing.

See MRSI Systems strategic partner companies from all over the world that help MRSI Systems provide unsurpassed products for our customers.

See what real MRSI Systems customers are saying about our Die Bonding and Epoxy Dispensing systems and how they have helped them succeed.

We provide prototyping and small batch die bonding services for our customers to shorten your time to market.

MRSI offers a comprehensive set of training programs covering our family of products. Contact MRSI Systems to learn more about On-Site Training.

Learn more about Optical Components and Transceivers from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.

MRSI Systems (Mycronic Group), submicron die bonder MRSI-S-HVM won the award for "The Most Competitive Optical Communications Product in 2020." The MRSI-S-HVM submicron die bonder was recognized

ICC讯 在CIOE 2020，MRSI SYSTEMS将推出一款新产品，高速、灵活的0.5微米 MRSI-S-HVM 贴片机，为硅光器件，协同封装的电子和光子芯片，以及晶圆级封装应用提供解决方案。

MRSI Systems(Mycronic Group)赞助由ICCSZ举办的第18届光纤通讯市场暨技术专题研讨会，研讨会将于9月2日至3日在中国深圳举行。同期，中国国际光电博览会(CIOE)于2019年9月4日至7日在中国深圳隆重召开。

MRSI Systems（Mycronic Group）很高兴宣布公司MRSI-H / HVM系列产品线的最新进展。MRSI使用行业标准玻璃芯片参考样品测试放置精度，测试结果显示，产品精度从3Sigma的±3微米增强至±1.5微米。该产品从2019年10月1日发货开始，产品名称改为MRSI-H和MRSI-HVM（之前称为MRSI-H3和MRSI-HVM3）。

MRSI Systems, part of the Mycronic Group is pleased to announce the appointment of Dr. Limin Zhou as the Senior Director of Strategic Marketing to expand MRSI’s market presence in China. He will

MRSI Systems (Mycronic Group) is pleased to announce the introduction of MRSI-H-HPLD+, the latest advancement in the MRSI-H/HVM-series product line. This new variant of the successful

At CIOE 2020 MRSI Systems will introduce a new product, MRSI-S-HVM high-speed, flexible 0.5 micrometer die bonder for silicon photonics, co-packaging.

BILLERICA, MA — January 31, 2014 — MRSI Systems, a developer and manufacturer of turnkey chip placement and dispensing systems, announced today it has completed a leveraged buyout of assets from

North Billerica, MA, USA, March 20, 2017 — MRSI Systems, a leading provider of fully automated, high-speed, high-precision die bonding and epoxy dispensing systems, today announces the

The optical components industry demands highly precise and customized equipment for complex optical assembly processes. We have answered this need with our new active aligner - a high-performance

March will be a busy month for device packaging exhibitions. Please join MRSI Mycronic at these upcoming events. We hope to see you there to discuss our latest new product innovations. Learn more

die-bonding LASER World of PHOTONICS CHINA 2023 MRSI Booth MRSI to exhibit at LASER World of PHOTONICS CHINA 2023 with live demos MRSI will exhibit at LASER World of PHOTONICS CHINA from July

After over 40 years of a successful capital equipment sales career, Jon Medernach will be hanging up his hat and enjoying retirement at the end of the month. As we bid farewell to Jon, our North

Excerpt from MRSI’s recent article emphasizes the CoS die bonding process requirements including geometric placement accuracy & void free eutectic bonding.

die-bonding Register for the Laser Focus World Webinar: Gen AI: Catalyst for Optical Module Innovation Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Mycronic and General Manager

The iMAPS New England Symposium and Expo will be held in Boxborough, MA on May 3rd, 2022 at the Boxboro Regency Hotel. Technical sessions include Advanced Packaging, RF& Microwave – 5G

die-bonding MRSI to exhibit at LASER World of PHOTONICS Munich MRSI will be exhibiting at LASER World of PHOTONICS, held at Messe München from April 26-29th, 2022. This is the 25th year of

During 2021 CIOE in Shenzhen, China, Infostone, interviewed Dr. Limin Zhou, Senior Strategic Marketing Director of MRSI Systems (Mycronic Group) to discuss MRSI’s latest product developments and

5G infrastructure will require ultra-high bandwidth, latency up to 1 ms, and highly reliable connectivity. In addition, RF architectures need to be scalable, efficient, and extremely compact.

Designed for high-volume manufacturing of advanced photonics and RF / Microwave devices the MRSI-H-LD 1.5 micron die bonder delivers industry-leading speed without sacrificing ultra-high