Search

Mycronic Fukuoka Mycronic Assembly Solutions Co. Ltd. 1-9-25, Enokida, Hakata-ku 812-0004 Fukuoka Japan +81 92 260 7009 +81 92 260 7019 Mycronic, Fukuoka, Japan

Customers require an application-specific specialized die bonder for HVM of CoS that is able to deliver high speeds while maintaining flexibility.

When it comes to epoxy dispensing your vendor system must offer the ultimate flexible platform for demanding environments. The epoxy dispenser should meet the highest standards of reliability and

The 21st China International Optoelectronic Expo (CIOE) was held at the Shenzhen Convention and Exhibition Center from September 4-7th, 2019. As the world leader in optoelectronic device

摘要：（第三届）激光雷达前瞻技术展示交流会于2021年12月14日-12月15日在江苏苏州举办。MRSI Systems战略市场高级总监，周利民博士出席2021（第三届）激光雷达前瞻技术展示交流会并发表“车载激光雷达光器件封装的挑战与解决方案”的演讲。

摘要：由中国国际光电博览会(CIOE)提议设立的”中国光电博览奖“，MRSI Systems携最新的MRSI-HVM 1.5微米系列产品参评，成功入围“中国光电博览奖”。MRSI-HVM-P项目属于高端光电子封装自动化技术领域，广泛用应于当下高密度高速率的数据中心光互联和骨干网络传输用的400G +光电器件，以及5G无线应用的复杂DFB / WDM / EML TO-can TOSA /

MRSI Systems is exhibiting at the 52nd International Symposium on Microelectronics from September 30-October 2, 2019 in Boston, MA at the Hynes Convention Center. Schedule a meeting with MRSI

On January 11, 2022, the Infostone 2022 Annual meeting and the 8th Heroes List awards ceremony were held. Infostone announced the 8th heroes company list, which is classified into four

This excerpt from MRSI Systems featured article in Laser Focus World highlights the HPLD industry manufacturing challenges and a die bonding solution to address these challenges:

MRSI Mycronic is exhibiting at the 57th International Symposium on Microelectronics from October 1-2, 2024, in Boston, MA. The event will take place at the Encore Boston Harbor from October 1-3,

MRSI will be exhibiting at the 48th exhibition of ECOC in Basel, Switzerland from September 19-21st.

ID: 80388 | Version: 1 | Published: 2023-02-06 Whistleblower policy Mycronic AB provides a special reporting channel where employees within the Mycronic Group may report serious wrongdoing within

Innovation and new market factors are driving advanced packaging. In this post, we highlight some of the trending topics propelling advanced packaging.

In March 2017, MRSI Systems participated in The MIT Microphotonics Center and AIM Photonics Spring Meeting for Integrated Photonics Manufacturing Meeting.

die-bonding Hybrid Electronics Technology for Printed Lighting Several members of the MRSI Systems’ team attended the February iMAPS New England-SMTA Boston Technical presentation by Dr. Adam

die-bonding 2017 Optical Fiber Communication Conference and Exhibition (OFC) Highlights MRSI Systems is a frequent participant at OFC. OFC gave us an opportunity to meet with our customers and

How our insider information is structured. Know about insiders, ownership and transactions

Key ratios

MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3 micrometer high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used in advanced

On December 28, 2023, MRSI (Mycronic Group) received the “Infostone 2023 Optical Communication Most Competitive Equipment” award for the MRSI-705HF 5 micron high force die bonder at the First

The MRSI-705 features an innovative design with a versatile thirteen-position tool bank for quick, automatic tool changes. Enhanced functionality is achieved with additional tool change banks,

The International Microwave Symposium (IMS) is an annual conference that brings together the brightest minds in the microwave and RF industry. This year's event will take place in San Diego, CA,

Experience MRSI Systems at the IMAPS device packaging conference in Fountain Hills, Arizona. MRSI excitedly sponsors the 19th Annual Device Packaging Conference that will be held March 13th-16th

Achieving precise and reliable die bonding is crucial in numerous industries, especially when demanding a high degree of parallelism between bonding surfaces.

The MRSI-705 5-micron flip-chip die bonder has the largest installed base in photonics packaging, microwave modules, RF power amplifiers, infrared sensors, and medical devices.

MRSI Systems has been a leading supplier to manufacturers of advanced optical packaging assembly for over 30 years. This has enabled MRSI to build unmatched expertise in the assembly technologies

LiDAR is an integrated optical detection and measurement system. Compared with typical radar, LiDAR can provide high-resolution distance, velocity, and geometric images, which were originally used

This excerpt from MRSI Systems featured article in Laser Focus World highlights the photonics industry challenges of data center applications and how the photonics industry can respond:

There are many challenges that photonic device suppliers are facing in the current market. As part of IEEE’s Tech Insider Webinar Series, MRSI Systems recently delivered a presentation on high

On November 2, 2016, MRSI Systems participated in the Commercial and Business Opportunities panel discussions at Massachusetts (MA) Integrated Photonics Manufacturing Supply Chain Meeting at MIT.