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On December 6, 2024, Infostone successfully held its 2024 Annual Summary and the 11th Heroes List Award live conference. Awards presented included "The Most Competitive Products of Optical

MRSI Mycronic is proud to announce the launch of the MRSI-LEAP high-speed 1µm die bonder. This innovative equipment is designed for ultra-high-volume manufacturing of optical modules,

Kristina Svanteson and Sara Mårtenson in a meeting about sustainbility Innovating with solid-state lasers: Mycronic's commitment to climate change Mycronic is committed to do its part to

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About us Axxon Automation Co., Ltd. Axxon, founded in 2008, is a Chinese manufacturer in the field of fluid automation, focusing on providing precision dispensing, coating, industrial dispensing

Discover Mycronic's high-precision dispensing and coating solutions designed for various industrial applications. Enhance your production with our innovative MYSmart series featuring

Mycronic Yokohama Mycronic Yokohama Mycronic Assembly Solutions Co., Ltd. 1st floor Yokohama Nishiguchi KN Bldg. 2-8-4 Kitasaiwai Nishi-ku, 220-0004 Yokohama-City Kanagawa Prefecture Japan +81 45

bare-board-testning atg Luther & Maelzer GmbH won the "Best Technology Award" of Founder PCB in 2024 On January 10, 2025, the 2024 Founder PCB Supplier Conference was held in Zhuhai.

Did you know Mycronic die bonders aid in creating medical sensors as part of the treatment for sleep apnea? Mycronic die bonders are utilized in the production of medical sensors for treating

Plan now to visit our booth #5407 at SPIE Photonics West, January 28–30, 2025 in San Francisco, CA. Discover our latest technologies, including newly released active alignment solutions and the

Did you know that Mycronic can assemble electronic components as tiny as a grain of sand? Our MYPro A40 pick-and-place is at the heart of this incredible precision. These advanced machines are

In January 2025, MRSI Mycronic will sponsor and exhibit at the prestigious Chiplet Summit. This event gathers global leaders in semiconductor technology to discuss innovations in chiplet design

One out of every two smartphones use dispensing technology from Mycronic's High Volume division Axxon, the core of Mycronic's High Volume division, is the leading supplier in the field of

The Speed of Light and the Future of Photonic Wire Bonding Light, traveling at an astonishing speed of nearly 300,000 kilometers per second in a vacuum, can circumnavigate the Earth about seven and

pcb-assembly — a Q & A with Romain Roux and Nicolas Guillot on DeepReview and the power of AI-driven inspection The false call killer Some call it the “false call killer”: a new Automatic

pcb-assembly — how the new MYPro S series brings high-volume performance to high-flex manufacturing User-driven design “Our customers are growing. But they should never outgrow their investment,”

die-bonding MRSI-705 with wafer, conveyor Versatile package handling capabilities: dewar and beyond In today's fast-paced production environments, efficiency and versatility are key. The MRSI-705

pcb-assembly — empowering multi-machine programming with one dataset, one program and one workflow The power of one For years, Mycronic inspection customers have benefitted from a single

Explore the transformative potential of wafer-level packaging in microelectronics and learn how this cost-effective solution enhances performance, reliability, and versatility across industries.

die-bonding Epoxy Dispenser The Next Generation MRSI-175Ag Epoxy Dispenser is now available In the fast-paced world of advanced packaging and semiconductor manufacturing, precision and efficiency

Last year, MRSI Systems launched the MRSI-705HF high force die bonder, a new version of the trusted MRSI-705 that is perfect for sintering and thermocompression bonding applications.

Increasing demand for data and bandwidth requires high-volume manufacturing of photonics and RF electronics at a level we have never seen before.

Increasing demand for high-volume manufacturing accelerates the continuing adaptation of full automation in advanced eutectic packaging.

This case study explains how MRSI achieved high throughput for high volume high mix production with flexible high volume high precision using their latest die bonding systems.

die-bonding IMAPS Boston 2019 – Highlights MRSI Systems has been a member and proud supporter of IMAPS for more than 30 years and was pleased to sponsor the exhibition at the 2019 IMAPS

The 21st China International Optoelectronic Expo (CIOE) was held at the Shenzhen Convention and Exhibition Center from September 4-7th, 2019. As the world leader in optoelectronic device

Innovation and new market factors are driving advanced packaging. In this post, we highlight some of the trending topics propelling advanced packaging.

In March 2017, MRSI Systems participated in The MIT Microphotonics Center and AIM Photonics Spring Meeting for Integrated Photonics Manufacturing Meeting.