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The Speed of Light and the Future of Photonic Wire Bonding

The Speed of Light and the Future of Photonic Wire Bonding Light, traveling at an astonishing speed of nearly 300,000 kilometers per second in a vacuum, can circumnavigate the Earth about seven and

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Mycronic receives order for an SLX mask writer

Mycronic AB (publ) has received an order for an SLX mask writer from an existing customer in Asia. The order value is in the range of USD 6-8 million. Delivery of the system is planned for the

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The false call killer

pcb-assembly — a Q & A with Romain Roux and Nicolas Guillot on DeepReview and the power of AI-driven inspection The false call killer Some call it the “false call killer”: a new Automatic

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User-driven design S series

pcb-assembly — how the new MYPro S series brings high-volume performance to high-flex manufacturing User-driven design “Our customers are growing. But they should never outgrow their investment,”

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Versatile package handling capabilities: dewar and beyond

die-bonding MRSI-705 with wafer, conveyor Versatile package handling capabilities: dewar and beyond In today's fast-paced production environments, efficiency and versatility are key. The MRSI-705

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The power of one - MYPro Create

pcb-assembly — empowering multi-machine programming with one dataset, one program and one workflow The power of one For years, Mycronic inspection customers have benefitted from a single

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Wafer Level Packaging

Explore the transformative potential of wafer-level packaging in microelectronics and learn how this cost-effective solution enhances performance, reliability, and versatility across industries.

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The Next Generation MRSI-175Ag Epoxy Dispenser is now available

die-bonding Epoxy Dispenser The Next Generation MRSI-175Ag Epoxy Dispenser is now available In the fast-paced world of advanced packaging and semiconductor manufacturing, precision and efficiency

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Innovation Continues on MRSI-705HF

Last year, MRSI Systems launched the MRSI-705HF high force die bonder, a new version of the trusted MRSI-705 that is perfect for sintering and thermocompression bonding applications.

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Advanced Vision Systems

Increasing demand for data and bandwidth requires high-volume manufacturing of photonics and RF electronics at a level we have never seen before.

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IMAPS Boston 2019 – Highlights

die-bonding IMAPS Boston 2019 – Highlights MRSI Systems has been a member and proud supporter of IMAPS for more than 30 years and was pleased to sponsor the exhibition at the 2019 IMAPS

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MRSI Systems’ Dr. Yi Qian: The Latest Solution for Automated Manufacturing of Optoelectronic Devices in the 5G Era

The 21st China International Optoelectronic Expo (CIOE) was held at the Shenzhen Convention and Exhibition Center from September 4-7th, 2019. As the world leader in optoelectronic device

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2017 Optical Fiber Communication Conference and Exhibition (OFC) Highlights

die-bonding 2017 Optical Fiber Communication Conference and Exhibition (OFC) Highlights MRSI Systems is a frequent participant at OFC. OFC gave us an opportunity to meet with our customers and

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"The success of SLX is about people and technology along with the trust of our customers."

"The success of SLX is about people and technology along with the trust of our customers." What is the success behind the SLX series, and.. what is a mask writer? Charlott Samuelsson, Senior

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Challenges in High-Volume Manufacturing for Die Attach Systems

Increasing demand for high-volume manufacturing accelerates the continuing adaptation of full automation in advanced eutectic packaging.

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MRSI Mycronic to Present at the 7th Annual Automotive LIDAR Conference

MRSI Mycronic is proud to sponsor the 7th Annual Automotive LIDAR Conference, taking place online from November 20-21, 2024.

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50 years in the mix

Simplifying high-mix manufacturing for more than 50 years 50 years in the mix If there’s one constant in PCB assembly, it’s change itself. Whether it’s fast-changing product mixes, components or

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Mycronic receives order for two SLX mask writers

Mycronic AB (publ) has received an order for two SLX mask writers from a new customer in Asia. The order value is in the range of USD 13-15 million. Delivery of the first system is planned for

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Case Study – The Latest Die Bonding Solutions for Photonics Manufacturing

This case study explains how MRSI achieved high throughput for high volume high mix production with flexible high volume high precision using their latest die bonding systems.

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Enter the control center

pcb-assembly REMOTE AWARENESS AND STRATEGIC PLANNING RAPID JOB INTERVENTION AND RESOLUTION REDUCED COMPONENT WASTE MYCenter Analysis elevates production performance to your dashboard Enter the

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From ping-pong to perfection

pcb-assembly Some examples of real defects stored in the system used by Escape Tracker to control the efficiency of a new program: Escape tracker Enhancing the art of inspection programming with

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News and press releases

News Press releases Our most recent news articles. Keep up to date with our most recent press releases. Our most recent news articles and press releases.

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News

pcb-assembly Our most recent news articles.

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Mycronic

Find how Mycronic is bringing tomorrow´s electronics to life. We supply high precision production solutions to the electronics industry.

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Product areas

Product areas PCB assembly Photomask equipment Dispensing and coating Bare board testing Die bonding Photonic Interconnects PCB assembly by Mycronic Photomask equipment Soft touch blade probe The

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The perfect solder joint

Each component gets the right amount of solder paste with jet printing technology instead of stencil printing.

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Mycronic Japan Yokohama

Mycronic Japan Mycronic Tokyo Mycronic Assembly Solutions Co., Ltd. 1st floor Yokohama Nishiguchi KN Bldg. 2-8-4 Kitasaiwai Nishi-ku, 220-0004 Yokohama-City Kanagawa Prefecture Japan +81 45 320

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Student opportunities

Student and early careers opportunities Your ideas will grow with us Student and early careers opportunities There are different ways for us to cooperate if you are a student. Thesis work We are

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Excellent Partner Award from SCC

bare-board-testning Excellent Partner Award from SCC atg Luther & Maelzer's Chinese unit, Test Solutions (Suzhou) Co (TSL), was invited to the supplier meeting in Guangzhou by its customer

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Exhibit at IPC Apex 2024

bare-board-testning atg Luther & Maelzer exhibit at IPC Apex 2024 atg Luther Maelzer (a Mycronic company) will showcase their latest technology, the A9 with Automation (A9aL), at the upcoming