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The Speed of Light and the Future of Photonic Wire Bonding
The Speed of Light and the Future of Photonic Wire Bonding Light, traveling at an astonishing speed of nearly 300,000 kilometers per second in a vacuum, can circumnavigate the Earth about seven and
Mycronic receives order for an SLX mask writer
Mycronic AB (publ) has received an order for an SLX mask writer from an existing customer in Asia. The order value is in the range of USD 6-8 million. Delivery of the system is planned for the
The false call killer
pcb-assembly — a Q & A with Romain Roux and Nicolas Guillot on DeepReview and the power of AI-driven inspection The false call killer Some call it the “false call killer”: a new Automatic
User-driven design S series
pcb-assembly — how the new MYPro S series brings high-volume performance to high-flex manufacturing User-driven design “Our customers are growing. But they should never outgrow their investment,”
Versatile package handling capabilities: dewar and beyond
die-bonding MRSI-705 with wafer, conveyor Versatile package handling capabilities: dewar and beyond In today's fast-paced production environments, efficiency and versatility are key. The MRSI-705
The power of one - MYPro Create
pcb-assembly — empowering multi-machine programming with one dataset, one program and one workflow The power of one For years, Mycronic inspection customers have benefitted from a single
Wafer Level Packaging
Explore the transformative potential of wafer-level packaging in microelectronics and learn how this cost-effective solution enhances performance, reliability, and versatility across industries.
The Next Generation MRSI-175Ag Epoxy Dispenser is now available
die-bonding Epoxy Dispenser The Next Generation MRSI-175Ag Epoxy Dispenser is now available In the fast-paced world of advanced packaging and semiconductor manufacturing, precision and efficiency
Innovation Continues on MRSI-705HF
Last year, MRSI Systems launched the MRSI-705HF high force die bonder, a new version of the trusted MRSI-705 that is perfect for sintering and thermocompression bonding applications.
Advanced Vision Systems
Increasing demand for data and bandwidth requires high-volume manufacturing of photonics and RF electronics at a level we have never seen before.
IMAPS Boston 2019 – Highlights
die-bonding IMAPS Boston 2019 – Highlights MRSI Systems has been a member and proud supporter of IMAPS for more than 30 years and was pleased to sponsor the exhibition at the 2019 IMAPS
MRSI Systems’ Dr. Yi Qian: The Latest Solution for Automated Manufacturing of Optoelectronic Devices in the 5G Era
The 21st China International Optoelectronic Expo (CIOE) was held at the Shenzhen Convention and Exhibition Center from September 4-7th, 2019. As the world leader in optoelectronic device
2017 Optical Fiber Communication Conference and Exhibition (OFC) Highlights
die-bonding 2017 Optical Fiber Communication Conference and Exhibition (OFC) Highlights MRSI Systems is a frequent participant at OFC. OFC gave us an opportunity to meet with our customers and
"The success of SLX is about people and technology along with the trust of our customers."
"The success of SLX is about people and technology along with the trust of our customers." What is the success behind the SLX series, and.. what is a mask writer? Charlott Samuelsson, Senior
Challenges in High-Volume Manufacturing for Die Attach Systems
Increasing demand for high-volume manufacturing accelerates the continuing adaptation of full automation in advanced eutectic packaging.
MRSI Mycronic to Present at the 7th Annual Automotive LIDAR Conference
MRSI Mycronic is proud to sponsor the 7th Annual Automotive LIDAR Conference, taking place online from November 20-21, 2024.
50 years in the mix
Simplifying high-mix manufacturing for more than 50 years 50 years in the mix If there’s one constant in PCB assembly, it’s change itself. Whether it’s fast-changing product mixes, components or
Mycronic receives order for two SLX mask writers
Mycronic AB (publ) has received an order for two SLX mask writers from a new customer in Asia. The order value is in the range of USD 13-15 million. Delivery of the first system is planned for
Case Study – The Latest Die Bonding Solutions for Photonics Manufacturing
This case study explains how MRSI achieved high throughput for high volume high mix production with flexible high volume high precision using their latest die bonding systems.
Enter the control center
pcb-assembly REMOTE AWARENESS AND STRATEGIC PLANNING RAPID JOB INTERVENTION AND RESOLUTION REDUCED COMPONENT WASTE MYCenter Analysis elevates production performance to your dashboard Enter the
From ping-pong to perfection
pcb-assembly Some examples of real defects stored in the system used by Escape Tracker to control the efficiency of a new program: Escape tracker Enhancing the art of inspection programming with
News and press releases
News Press releases Our most recent news articles. Keep up to date with our most recent press releases. Our most recent news articles and press releases.
News
pcb-assembly Our most recent news articles.
Mycronic
Find how Mycronic is bringing tomorrow´s electronics to life. We supply high precision production solutions to the electronics industry.
Product areas
Product areas PCB assembly Photomask equipment Dispensing and coating Bare board testing Die bonding Photonic Interconnects PCB assembly by Mycronic Photomask equipment Soft touch blade probe The
The perfect solder joint
Each component gets the right amount of solder paste with jet printing technology instead of stencil printing.
Mycronic Japan Yokohama
Mycronic Japan Mycronic Tokyo Mycronic Assembly Solutions Co., Ltd. 1st floor Yokohama Nishiguchi KN Bldg. 2-8-4 Kitasaiwai Nishi-ku, 220-0004 Yokohama-City Kanagawa Prefecture Japan +81 45 320
Student opportunities
Student and early careers opportunities Your ideas will grow with us Student and early careers opportunities There are different ways for us to cooperate if you are a student. Thesis work We are
Excellent Partner Award from SCC
bare-board-testning Excellent Partner Award from SCC atg Luther & Maelzer's Chinese unit, Test Solutions (Suzhou) Co (TSL), was invited to the supplier meeting in Guangzhou by its customer
Exhibit at IPC Apex 2024
bare-board-testning atg Luther & Maelzer exhibit at IPC Apex 2024 atg Luther Maelzer (a Mycronic company) will showcase their latest technology, the A9 with Automation (A9aL), at the upcoming