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pcb-assembly Automating material handling through robotics Say hello to Leo the robot! Stock accuracy, traceability, and timely delivery of parts are key aspects of a material handling system.

pcb-assembly Reducing e-waste through innovation Global consumption of electrical and electronic equipment is on the rise. When these products enter an end-of-life state, a large amount of the

pcb-assembly Paperless productivity – changeover guidance with Agilis Smart Bin. Agilis Smart Bin MISSING COMPONENTS. Sticky notes falling off. Hunting for information. The list of reasons for

Solutions Flying ahead in Michigan with Calumet A9a Mycronic is providing its latest Flying Probe electrical testing system.

Fully automatic high accuracy die bonders that are capable of epoxy and eutectic die bonding are the lifeblood of the modern semiconductor industry.

Learn more about MRSI's 1.5 micron die bonders.

MRSI is now offering an extensive library of software training videos for your MRSI die bonding and epoxy dispensing systems. Contact MRSI to learn more.

Find and download archives of the MRSI Newsletter. Find great stories, articles and more or catch up on previous articles.

Taking action against what it asserts is pervasive and repeated infringement of four separate U.S. patents it owns, leading precision manufacturer MRSI Systems LLC has filed a patent infringement

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MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2022 Silver Honoree for the

2019年2月13日–全球领先的半导体系统设备制造商Mycronic集团的子公司，MRSI Systems今日荣幸宣布，光电子资深专家周利民博士将加入公司团队并担任战略营销高级总监，负责拓展MRSI Systems在中国的市场影响力。周博士在光电子行业拥有的丰富专业知识，以及他在中国市场的知名度将有助于推动MRSISystems市场战略布局，制定清晰的产品路线图，以及增强MRSI

MRSI Systems (Mycronic Group) will exhibit at the 23rd China International Optoelectronic Exposition (CIOE) at the Shenzhen World Exhibition & Convention Center from September 16-18, 2021. MRSI

MRSI Systems宣布“DIE PLACEMENT HEAD WITH TURRET”(集成水平转塔之芯片贴装头)已获得中国专利授权。迈康尼全球技术部的业务部门-MRSI Systems宣布，中华人民共和国国家知识产权局(CNIPA)已于2021年7月30日授权MRSI Systems 申请的“DIE PLACEMENT HEAD WITH

ICC讯 在IMAPS 2020上，MRSI Systems推出了新型5微米贴片机产品，面向量产配置的MRSI-705。MRSI-705于2012年首次推出，在贴片机行业中处于领先地位，可在一台机器上为客户提供多种应用解决方案。MRSI-705新的配置提供了创新的水平转塔功能，可以在不牺牲灵活性，准确性和可靠性的前提下，显著提高机器的速度和生产率。

die-bonding CIOE 2023 MRSI Booth MRSI Mycronic to showcase and present innovative die bonder solutions at CIOE 2023 MRSI, a part of Mycronic Group, will exhibit our family of die bonders and

About Die bonding Under the MRSI brand, we leverage over 40 years of industry expertise in high-accuracy die bonders, active aligners, and fluid dispensers to deliver unparalleled reliability and

Boston, MA – December 10, 2020 – MRSI Systems, LLC and Palomar Technologies, Inc. jointly announce they have reached a confidential agreement that settles all litigation currently pending between

ICCSZ讯 近日，全自动，高速，高精度，灵活多功能的贴片系统的领先制造商MRSI Systems在中国深圳南山绿创云谷大厦的Mycronic展示中心正式开放。在MRSI Systems战略营销高级总监周利民博士的带领下，讯石人员参观了演示中心全貌并了解MRSI Systems的现状及MRSI-HVM3贴片设备的应用。

摘要：9月16-18日，CIOE 2021期间，MRSI SYSTEMS携携最新的MRSI-HVM带轨道双机头固晶机精彩亮相。在4B79展台，讯石以现场视频直播方式走进MRSI SYSTEMS展台参观了正在进行演示的产品，MRSI SYSTEMS战略营销高级总监周利民博士向观众介绍本次参展的新产品。

Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic Group) and General Manager of MRSI Automation (Shenzhen) Co., Ltd., was invited to participate in the 2022 CFOL

Abstract: on March 17th, 2022, Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic group) and General Manager of MRSI Automation (Shenzhen) Co., Ltd., is invited to

MRSI Systems will present at the 19th Infostone Optical Communications Conference(IFOC), organized by Infostone Communication Consultant. The event will take place in Shenzhen, China from September

Jack was recently promoted to Customer Service Manager, reflecting a long and successful career with MRSI solving customer challenges. In his 10 year career with the company, Jack has accumulated

MRSI’s latest article in Laser Focus World’s August Issue Challenges for photonics manufacturing in the new data center era, discusses the high volume and high mix nature of photonics

Bruno Afonso has joined MRSI as the Sales Director, EMEA. He is located in Switzerland and earned his BA in Industrial Engineering and his Master Degree in Electrical Engineering from Universidade

The world’s largest Microwave and RF industry event is being held virtually this year. 

Choosing a die bonder is important, and we advise considering all options before making a purchase. With MRSI Systems, you can find exactly what you need.

MRSI Systems is exhibiting at IMS (Booth #448)—the world’s largest Microwave and RF industry event in Philadelphia, PA at the Pennsylvania Convention Center June 10-15, 2018.