Powering the future of clean manufacturing
Surfx, a Mycronic Group company, develops advanced atmospheric plasma systems that redefine how industries prepare surfaces for bonding, coating, and assembly.
As part of the Applied Plasma business line (GT-AP) within Mycronic’s Global Technologies division, Surfx equips semiconductor, medical, and high-tech manufacturers with reliable solutions to eliminate contamination, improve adhesion, and boost product performance.
A different approach to plasma
Unlike traditional vacuum plasma tools, Surfx systems operate at atmospheric pressure using patented argon plasma technology. This innovation delivers fast, uniform, and damage-free cleaning and activation — without the cost and complexity of vacuum chambers. The result: production-ready plasma solutions that fit seamlessly into both benchtop labs and fully automated manufacturing lines.
Proven expertise, expanding possibilities
Founded in California over two decades ago, Surfx has partnered with leading innovators across semiconductors, medical devices, aerospace, and electronics. Our systems are trusted where reliability matters most — from life-saving medical implants to automotive electronics and advanced semiconductor packaging. Today, as part of Mycronic, Surfx is extending its global reach and accelerating new developments in atmospheric plasma technology.
Learn more about Surfx at www.surfxtechnologies.com
Where Surfx makes the difference
- Semiconductor & Packaging – Surface activation and mold cleaning for higher yields and stronger interconnects.
- Electronic Assembly – Flux removal, surface cleaning, and activation to ensure reliable soldering and coating adhesion.
- Medical Devices – Biocompatible bonding and coating adhesion on polymers, metals, and composites.
- Advanced Manufacturing – Reliable surface prep for aerospace, automotive, and next-gen electronics.
Flexible tools for modern production
From research labs to high-volume lines, Surfx plasma systems deliver consistent, high-quality results with a small footprint and simple integration. This versatility ensures manufacturers can scale plasma treatment from prototype to production without compromising performance.
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Explore our business line Applied Plasma
Atomflo™-INT for integration of plasma treatment into other manufacturing tools
The Atomflo™-INT plasma system is configured for integration into new or existing process equipment. External rack-mounted controllers support 1 or 2 plasma heads imbedded inside the primary machine. Communication over Ethernet IP provides complete process control and data logging. The INT complies with all US, EU, and SEMI EH&S standards. Our integrated plasma system provides the most advanced surface treatment technology inside your equipment.
STA-10 for high-volume manufacturing of semiconductor packages
The STA-10iL automated plasma system is designed to clean and activate substrates for improved bonding. It is the ideal plasma system for electronics manufacturing and semiconductor packaging. The STA-10iL comes standard with in-line conveyance for high-speed, high-volume production. An optional drawer can be installed for high-mix, low-volume production.
STW-10 for plasma processing 300 mm wafers and dies on tape frames
The STW-10 automated plasma system is designed for front-end semiconductor processing. It is well suited for activating silicon surfaces prior to hybrid bonding. The STW-10 accepts FOUP’s containing 300 mm wafers, or cassettes with dies on tape frames. The maximum throughput is 60 wafers per hour.