Search

MRSI Systems is delighted to announce a new collaboration with Lumentum Operations LLC ("Lumentum", NASDAQ: LITE), a leading global photonic chip and module supplier for the automotive LiDAR

MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2022 Silver Honoree for the

At CIOE 2020 MRSI Systems will introduce a new product, MRSI-S-HVM high-speed, flexible 0.5 micrometer die bonder for silicon photonics, co-packaging.

MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2022 Silver Honoree for the

MRSI Systems宣布“DIE PLACEMENT HEAD WITH TURRET”(集成水平转塔之芯片贴装头)已获得中国专利授权。迈康尼全球技术部的业务部门-MRSI Systems宣布，中华人民共和国国家知识产权局(CNIPA)已于2021年7月30日授权MRSI Systems 申请的“DIE PLACEMENT HEAD WITH

MRSI Systems, part of the Mycronic Group is pleased to announce the appointment of Dr. Limin Zhou as the Senior Director of Strategic Marketing to expand MRSI’s market presence in China. He will

Mycronic Global Technologies Business Unit, MRSI Systems announces the recent issuance of utility patent titled “DIE PLACEMENT HEAD WITH TURRET” and numbered ZL 201680048482.5 (PCT/US2016/047135)

MRSI Systems (Mycronic Group) is pleased to announce the introduction of MRSI-H-HPLD+, the latest advancement in the MRSI-H/HVM-series product line. This new variant of the successful

MRSI (Mycronic Group) is exhibiting, sponsoring, and presenting at the Automotive LIDAR 2021 Virtual Conference and Exhibition from September 21-23rd, 2021, a leading event in the

BILLERICA, MA — January 31, 2014 — MRSI Systems, a developer and manufacturer of turnkey chip placement and dispensing systems, announced today it has completed a leveraged buyout of assets from

美国马萨诸塞州, August 14, 2017 – 全球领先的全自动、高精度、高速贴片和点胶系统制造商，MRSI Systems推出一款新型产品, MRSI-HVM3 高速贴片机，以支持光电子客户的大批量生产需求。目前，MRSI-HVM3 正在全面投产并发货至世界各地的客户。

North Billerica, MA, USA, March 20, 2017 — MRSI Systems, a leading provider of fully automated, high-speed, high-precision die bonding and epoxy dispensing systems, today announces the

BILLERICA, Mass., August 14, 2017 – MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, is launching a new High Speed

MRSI系统公司（Mycronic集团）推出MRSI－H3TO新型3微米高速贴片机，这是业界第一款可以真正满足多晶片和多流程的要求，可实现行业领先的贴片速度、卓越的灵活性以及为未来产品准备的3微米贴片精度。 MRSI－H3TO专为WDM与EML－TO或其他多晶片多流程TO－can光电器件量身打造，以支持即将普及的5G无线网络。

die-bonding MRSI Systems推出用于新应用的MRSI-HVM3P新产品 MRSI Systems（Mycronic集团）8月20日在美国马萨诸塞州扩展其业界领先的MRSI－HVM3高速贴片机机平台，推出MRSI－HVM3P新款机型，为有源光缆（AOC）、管盒（Gold－box）封装 以及 基板芯片（CoC）之外 的其他应用提供优化配置。

MRSI Systems（Mycronic集团）宣布在其位于深圳龙华的姐妹公司，深圳市轴心自控技术有限公司工厂建立一项新的演示能力。我们将根据客户的样品材料，安排并提供我们市场领先的MRSI－HVM3产品的本地演示以及芯片贴装应用。

Our die bonders are historically regarded the leaders in flexibility, and during the last two years, we have expanded our die bonding families. These high speed die bonders deliver

Visit MRSI Systems’ Booth (#577) to learn about our new die bonder product launches.

Gallium Nitride (GaN) materials have long been regarded as great alternatives and enhancements to GaAs and silicon-based counterparts for applications...

The 51st International Symposium on Microelectronics was held at the Pasadena Convention Center in Pasadena, California this month. This symposium is the premier event for microelectronic

MRSI Systems will be exhibiting at SPIE Photonics West, held at the Moscone Center in San Francisco, CA, USA from February 5-7, 2019.

These Die Bonding process pages explain the central role that die bonding continues to play in the photonics, sensors and semiconductor industries.

MRSI Systems exhibited at the Automotive LIDAR 2018 Expo and Conference in Detroit, Michigan last month. The conference focused not only on hardware solutions but software as well. The use of AI

MRSI exhibited at the Inaugural WPI/QCC Integrated Photonics Symposium, at WPI October 3, 2018, and Dr. Yi Qian, VP of Marketing, MRSI Systems participated in an industry panel including

Thank you to all of our existing customers and new customers who visited us at SPIE Photonics West. The turnout at the booth was filled with great discussions. The event was well attended with

The MRSI-175Ag Conductive Epoxy Dispenser handles the most demanding dispensing applications such as semiconductor packaging, Microwave & RF modules, multichip modules, optical modules,

die-bonding Mycronic technology essential in 5G development Die bonding systems are required for the groundbreaking digital transition Mycronic technology essential in 5G development 5G is

After over 40 years of a successful capital equipment sales career, Jon Medernach will be hanging up his hat and enjoying retirement at the end of the month. As we bid farewell to Jon, our North

MRSI Systems, Mycronic Group will be exhibiting at the 55th International Symposium on Microelectronics from October 4-5th in Boston Massachusetts at the Hynes Convention Center.

Various die bonding approaches have been, and still are, developed to meet the ever-evolving product requirements.