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MRSI to present at IFOC and attend CIOE in September in Shenzhen including live product demos
MRSI Systems will present at the 19th Infostone Optical Communications (IFOC) Conference, organized by Infostone Communication Consultant. The event will take place in Shenzhen, China from
MRSI Systems赢得长期诉讼, Palomar的 “Double Pick” 专利权被判无效
波士顿联邦法院首席法官驳回了Palomar对MRSI涉嫌涵盖制造过程的“double pick”专利侵权指控的主张;法院裁定声称的该方法“非常基础,已被人类了解数千年。”国际律师事务所Crowell&Moring LLP代表领先的精密制造商MRSI Systems;MRSI将向Palomar索取全额律师费。
MRSI receives Laser Focus World Innovators Award for HVM die bonder
MRSI Systems (Mycronic Group) a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2019 Silver Honoree for
MRSI Systems 热烈欢迎贺尉宗出任中国区销售总监
MRSI Systems(Mycronic Group)很高兴地宣布贺尉宗(Hendry He)担任我们的中国区销售总监。他将与现有的销售团队及销售代表一起工作,并作为中国区销售代表服务市场,工作地点为上海。Hendry在半导体设备方面拥有丰富的技术知识以及销售经验。结合Hendry对中国市场的庞大网络的掌握Hendry的加入将进一步提高我们对客户需求的响应能力。
MRSI Systems welcomes Hendry He as China Country Sales Director
MRSI Systems (Mycronic Group) is pleased to announce our new China Country Sales Director, Hendry He. He will be working alongside the existing sales team and representatives in the region and is
MRSI improves accuracy to 1.5 micrometers for MRSI-H/HVM-Series die bonders
MRSI Systems (Mycronic Group) is pleased to announce the latest advancement in the MRSI-H/HVM-series product line. Placement accuracy was tested using industry-standard glass die reference
MRSI钱毅博士:5G时代自动化贴片系统的发展趋势
5G时代的到来势不可挡,而这一趋势也不断对芯片的贴片、封装工艺提出新的要求。在此背景下, 作为全球光电器件自动化贴片封装设备的领军企业, MRSI Systems也适时推出了新产品、新技术。在今年9月的深圳光博会上,MRSI的产品管理和市场营销副总裁钱毅博士向OFweek光通讯网介绍了MRSI的产品、研发优势及未来的市场趋势。
MRSI Systems announces “One Stop Shop” die bonding solutions at CIOE and ECOC
STOCKHOLM, Aug. 30, 2018 — MRSI Systems (Mycronic Group) will be demonstrating our “One Stop Shop” capabilities at the 20th China International Optoelectronic Exposition (CIOE) at the Shenzhen
MRSI Launches New MRSI-H3LD Die Bonder Targeted at the High Power Diode Laser Market
MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3 micrometer high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used in advanced
Mycronic acquires MRSI Systems, LLC
Täby, 1 June, 2018 – Mycronic AB (publ), acquires 100 percent of MRSI Systems, LLC (MRSI), headquartered in North Billerica, Massachusetts, in the USA. The purchase price amounts to USD 40.7
MRSI Systems’ New Product MRSI-HVM3 Die Bonder Has Entered Volume Production Driven by Fast and Wide Customer Adoptions
NORTH BILLERICA, Mass., March 6, 2018 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems is pleased to announce that our
MRSI Systems Receives Funding from State of Massachusetts for Advanced Manufacturing Initiative
Billerica, Mass., Oct, 6, 2017 – MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, has been awarded new funding by the
MRSI Systems将在深圳中国国际光电博览会(CIOE)上展示新产品 MRSI-HVM3 并赞助第一届国际激光技术高端论坛
美国马萨诸塞州, August 25, 2017 – 全球领先的全自动、高精度、高速贴片和点胶系统制造商,MRSI
MRSI Systems Will Demonstrate New Product MRSI-HVM3 and Sponsor the 1st Laser Executive Forum at CIOE in Shenzhen, China, September 6-9, 2017
North Billerica, MA, August 25, 2017 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems will be exhibiting at the 19th
MRSI Systems Provides MRSI-M3 Die Bonding Assembly Work Cell to Fabrinet in Silicon Valley for Fast Prototyping and New Product Introduction
North Billerica, MA, USA, May 24, 2016 — MRSI Systems, a leading provider of fully automated, ultra-precision die bonding and epoxy dispensing systems, today announces supply of its flagship
MRSI Systems offers In-Line Eutectic for Direct Eutectic or Solder Reflow for GaAs & GaN
BILLERICA, MA — August 12, 2015 — MRSI Systems, a developer and manufacturer of turnkey die bonding and dispensing systems, announced today the introduction of a new automated in-line material
MRSI-M3 Three Micron Die Bonder with One Micron Option
BILLERICA, MA — February 2, 2015 — MRSI Systems, a developer and manufacturer of turnkey die bonding and dispensing systems, announced today the introduction of their most advanced system with
IBM Joint Development Agreement (JDA)
The emergence of two-and-a-half-dimensional (“2.5D”) and three-dimensional (“3D”) (collectively, “2.5D/3D”) integrated circuit packaging technology is creating another compelling opportunity for
Technical articles archive
Download articles from MRSI systems and read about how we are changing the die bonding industry.
MRSI Automation (Shenzhen) Co., Ltd.
MRSI Automation (Shenzhen) Co., Ltd. 101, Building B, Han's Innovation Tower 9018 Beihuan Avenue, Nanshan District 518057 Shenzhen Guangdong Province China +86 755 26414155 MRSI Automation
Mycronic Sweden HQ
Mycronic Sweden HQ Mycronic headquarter in the winter Mycronic AB Nytorpsvägen 9 Box 3141 183 03 Täby Sweden +46 8 638 52 00 +46 8 638 52 90 Google maps search Mycronic Taby Yes, please
Applied Plasma
Atmospheric Plasma Solutions for Critical Surface Preparation Powering the future of clean manufacturing Surfx, a Mycronic Group company, develops advanced atmospheric plasma systems that
Photonic Interconnects
Our machines and materials Software and Technology Always one photon ahead – with industry ready 3D nano-printing and a full solution portfolio for Photonic Integration Based on its globally
Vanguard Automation GmbH
Vanguard Automation GmbH Gablonzer Strasse 10 76185 Karlsruhe Germany +49 721 5966 063 – 0 https://maps.app.goo.gl/8C44wc9j6zrRtUgZ9
Telecom & Datacom
Telecom & Datacom Unlocking the Future of Data with Photonic Solutions In today’s hyper-connected world, the limitations of traditional electronic data transfer are becoming increasingly
3D Sensing
3D Sensing Tailored Packaging Solutions for 3D Sensing Devices 3D sensing devices demand unique packaging solutions due to the diverse and often non-standard requirements of different customers.
Strategy
Mycronic’s strategy is to be a market-leading solutions provider within selected niches of electronics production with a high degree of recurring revenue. Prioritizing innovation, brand building
History
Mycronic’s 40-year history is based on innovation, entrepreneurship and working closely with customers. In 2009, former Mycronic Laser Systems and MYCRONIC became a unified force.
Expertise & innovation
Expertise and innovation, the ability to create new products. Expertise and innovation Mycronic Group has a long history of innovation in many areas such as pattern generation, jet printing, die
Organization
Mycronic’s four decentralized divisions allow it to stay close to customers in Asia, Europe, and North America. Divisions include Pattern Generators; PCB Assembly Solutions; Assembly Solutions