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Nomination committee
The Nomination committee represents the shareholders. Nomination committee The Nomination committee represents the shareholders and consists of four members. Its task, ahead of the AGM, is to
Our press releases
Read the latest press releases from Mycronic. We shape the future of electronics with passion, collaboration and diversity. Learn more about our solutions, products and business.
Audit committee
Colleagues discussing in production Audit committee The Audit committee is appointed by the Board and consists of three Board members. The committee is tasked with ensuring the quality of
Archive governance reports
Governance report archive the latest ten years. Archive governance reports 2022 Corporate governance report 2022 2021 Corporate governance report 2021 2020 Corporate governance report 2020 2019
Year-end Report January–December 2024
Year-end Report January–December 2024 Fourth quarter Order intake amounted to SEK 2,381 (1,448) million, an increase of 64 percent Net sales increased 5 percent to SEK 2,059 (1,968) million. Based
Mycronic receives first order for a Prexision 8000 Evo
Mycronic AB (publ) has received the first order for a Prexision 8000 Evo from an existing customer, for delivery to Asia. The order replaces a previously received order for a Prexision 8 Evo,
Mycronic receives order for an MMX metrology system
Mycronic AB (publ) has received an order for an MMX metrology system from an existing customer in Asia. The order value is in the range of USD 2,5-3,5 million. Delivery of the system is planned
Global Technologies makes acquisition in France
Mycronic’s Global Technologies division has acquired Hprobe, a company headquartered in Grenoble, France, which has developed a unique technology for high-speed magnetic testing of
Mycronic receives order for an SLX mask writer
Mycronic AB (publ) has received an order for an SLX mask writer from an existing customer in Asia. The order value is in the range of USD 6-8 million. Delivery of the system is planned for the
Mycronic receives order for a Prexision Lite 8 Evo
Mycronic AB (publ) has received a replacement order for a Prexision Lite 8 Evo from an existing customer in Asia. The order value is in the range of USD 8-10 million. Delivery of the system is
Epoxy Die Bonding of Ultra Small Ceramic Capacitors
As consumers expect more power and more bandwidth from their devices, we see the Advanced Electronic Packaging industry under continuing pressure to cram more technology into smaller spaces. One
Optoelectronics Packaging
MRSI Systems has been a leading supplier to manufacturers of advanced optical packaging assembly for over 30 years. This has enabled MRSI to build unmatched expertise in the assembly technologies
Epoxy Deposition – Requirement for High-Volume Manufacturing (HVM) of Chip-on-Submount (CoS)
Customers require an application-specific specialized die bonder for HVM of CoS that is able to deliver high speeds while maintaining flexibility.
How to Choose an Epoxy Dispenser
When it comes to epoxy dispensing your vendor system must offer the ultimate flexible platform for demanding environments. The epoxy dispenser should meet the highest standards of reliability and
MRSI-A-L Active Aligner Wins Infostone 2024 Award for "Most Competitive Optical Communication Product"
On December 6, 2024, Infostone successfully held its 2024 Annual Summary and the 11th Heroes List Award live conference. Awards presented included "The Most Competitive Products of Optical
MRSI’s heated head die bonder targets High-Density Photonic Devices
The Global deployment of 5G and the exponential growth of data centers is driving the demand for high-performance optical devices.
MRSI-LEAP Ultra-High-Speed Die Bonders: Revolutionizing High-Volume Manufacturing
Ultra-high-speed die bonding technology is pivotal in modern manufacturing, particularly for optical modules production. The MRSI-LEAP Ultra-High-Speed Die Bonders exemplify this advancement,
Dr. Limin Zhou to present at the 22nd Infostone Optical Communication and Market Technology Conference (IFOC 2024)
Mark your calendars for September 9-10, 2024, at the InterContinental Hotel of the Shenzhen World Exhibition and Convention Center in Shenzhen, China, which hosts the highly anticipated Infostone
MRSI to present at the 21st Infostone Optical Communication Market and Technology Conference
MRSI will be presenting at the Infostone Optical Communication Market and Technology Conference which will be held at the Hyatt Regency Shenzhen Airport Hotel in Shenzhen, China from September
Join MRSI Mycronic at the China International Optoelectronic Exposition (CIOE)
MRSI is proud to be exhibiting and presenting at the 25th China International Optoelectronic Exposition this year in Shenzhen. Stop by our booth #10B79 to learn more about how MRSI products meet
Technical articles archive
Download articles from MRSI systems and read about how we are changing the die bonding industry.
Photonic Interconnects
Our machines and materials Software and Technology Always one photon ahead – with industry ready 3D nano-printing and a full solution portfolio for Photonic Integration Based on its globally
VPT Components and MRSI Systems jointly address manufacturing challenges
Learn more about how VPT Components and MRSI Systems jointly address manufacturing challenges.
Mycronic Sweden HQ
Mycronic Sweden HQ Mycronic headquarter in the winter Mycronic AB Nytorpsvägen 9 Box 3141 183 03 Täby Sweden +46 8 638 52 00 +46 8 638 52 90 Google maps search Mycronic Taby Yes, please
MRSI Automation (Shenzhen) Co., Ltd.
MRSI Automation (Shenzhen) Co., Ltd. 101, Block A, Huahan Innovation Park Langshan Road 518057 Shenzhen China +86 755 26414155 MRSI Automation 101 Huahan Innovation Park, Langshan Road, Shenzhen,
Challenges in High-Volume Manufacturing for Die Attach Systems
Increasing demand for high-volume manufacturing accelerates the continuing adaptation of full automation in advanced eutectic packaging.
4 Recent Topics in Advanced Packaging
Innovation and new market factors are driving advanced packaging. In this post, we highlight some of the trending topics propelling advanced packaging.
Case Study – The Latest Die Bonding Solutions for Photonics Manufacturing
This case study explains how MRSI achieved high throughput for high volume high mix production with flexible high volume high precision using their latest die bonding systems.
MRSI Systems Participated in MIT Microphotonics Center / AIM Photonics Spring Technical Meeting in Cambridge
In March 2017, MRSI Systems participated in The MIT Microphotonics Center and AIM Photonics Spring Meeting for Integrated Photonics Manufacturing Meeting.
2017 Optical Fiber Communication Conference and Exhibition (OFC) Highlights
die-bonding 2017 Optical Fiber Communication Conference and Exhibition (OFC) Highlights MRSI Systems is a frequent participant at OFC. OFC gave us an opportunity to meet with our customers and