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Mycronic publishes the 2017 Annual and Sustainability Report

Mycronic publishes the 2017 Annual and Sustainability Report Täby, 9 April, 2018 - Mycronic AB (publ) today publishes the 2017 Annual and Sustainability Report. The Annual and Sustainability

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Welcome to Mycronic’s Capital Markets Day in Stockholm on November 29

Welcome to Mycronic’s Capital Markets Day in Stockholm on November 29 Mycronic invites institutional investors, equity analysts and media representatives to Mycronic’s Capital Markets Day on

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Mycronic’s Nomination Committee appointed

Mycronic’s Nomination Committee appointed The Nomination Committee for Mycronic’s 2019 AGM has been appointed. In accordance with the AGM’s decision, Mycronic’s Nomination Committee shall consist

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Asian customer to upgrade Prexision system

Asian customer to upgrade Prexision system Mycronic has landed an order to upgrade a system to a full-scale Prexision-10 with expanded functionality. The upgrade will be implemented on a

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Mycronic, interim report January-June 2017

Mycronic doubled net sales with favorable profitability Mycronic’s net sales for the first half of 2017 increased 97 percent compared with last year. The underlying EBIT margin was 34 percent. ”A

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Mycronicto highlight next-generation line automation and dispensing solutions at Productronica 2017

Mycronicto highlight next-generation line automation and dispensing solutions at Productronica 2017 Täby, 9 November, 2017 – Mycronic AB (publ) will demonstrate its latest generation of

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Dr. Yi Qian, MRSI Systems: Automated Die Bonding Trends in the 5G Era

The arrival of 5G marks a new era for the manufacturing supply chain. This transformation presents new challenges for die bonding and packaging processes. As a leader in the automated packaging

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Die Bonding Solutions

Having a proven ultra-accurate die bonding system platform that is mechanically and thermally stable, with no cantilevered parts, are essential elements to achieve accurate device placement.

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Visit MRSI Systems Demonstration Center in Shenzhen – Mycronic Facility(2)

ICCSZ讯 近日,全自动,高速,高精度,灵活多功能的贴片系统的领先制造商MRSI Systems在中国深圳南山绿创云谷大厦的Mycronic展示中心正式开放。在MRSI Systems战略营销高级总监周利民博士的带领下,讯石人员参观了演示中心全貌并了解MRSI Systems的现状及MRSI-HVM3贴片设备的应用。

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专访MRSI SYSTEMS周利民:MRSI-HVM-p系列贴片机助力光通讯产业高速发展

摘要:9月16-18日,CIOE 2021期间,MRSI SYSTEMS携携最新的MRSI-HVM带轨道双机头固晶机精彩亮相。在4B79展台,讯石以现场视频直播方式走进MRSI SYSTEMS展台参观了正在进行演示的产品,MRSI SYSTEMS战略营销高级总监周利民博士向观众介绍本次参展的新产品。

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Interview with MRSI Systems Dr. Limin Zhou: MRSI Die Bonders support the fast growth of the optical communication market

During 2021 CIOE in Shenzhen, China, Infostone, interviewed Dr. Limin Zhou, Senior Strategic Marketing Director of MRSI Systems (Mycronic Group) to discuss MRSI’s latest product developments and

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MRSI is Presenting at ICCSZ OC Market and Technology Seminar and Offering Die Bonder Demonstrations at CIOE

MRSI Systems and CYCAD Century Science and Technology will partner at the 21st China International Optoelectronic Exposition (CIOE). Product demos will be offered at Cycad’s booth #1C86. The show

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MRSI Systems World Class Customer Support – Jack Inocencio

Jack was recently promoted to Customer Service Manager, reflecting a long and successful career with MRSI solving customer challenges. In his 10 year career with the company, Jack has accumulated

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Challenges and Solutions for Bonding Ultra-Small Ceramic End-Terminated Capacitors

Electronic components and packages continue the trend of miniaturization which drives demand for cost-effective assembly solutions for smaller components and packages. This is happening in end

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Join MRSI Systems at SEMICON West 2019

MRSI Systems is exhibiting at SEMICON West (Booth #6163) from July 9-11th in San Francisco, CA at the Moscone Center.

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International Microwave Symposium 2019

die-bonding International Microwave Symposium 2019 MRSI Systems is exhibiting at IMS (Booth #686). The world’s largest Microwave and RF industry event is being held in Boston, MA this year at the

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Challenges and Solutions in the Photonics Packaging Industry

This increased demand for photonics components is driven by the growth in optical networks. Learn more about Photonics Packaging by reading more from MRSI Systems!

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Visit MRSI Systems Demonstration Center in Shenzhen – Mycronic Facility

MRSI Systems, a leading manufacturer of fully automatic, high-speed, high-precision, flexible and multi-functional die bonding systems, demonstration capability was officially opened at the

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MRSI Systems – “One Stop Shop” Fully Automated Die Bonding Solutions

Our die bonders are historically regarded the leaders in flexibility, and during the last two years, we have expanded our die bonding families. These high speed die bonders deliver

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Challenges in Die Bonding of Gallium Nitride High Power Devices

Gallium Nitride (GaN) materials have long been regarded as great alternatives and enhancements to GaAs and silicon-based counterparts for applications...

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Highlights of the Microelectronics Symposium

The 51st International Symposium on Microelectronics was held at the Pasadena Convention Center in Pasadena, California this month. This symposium is the premier event for microelectronic

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MRSI Systems is Exhibiting and Sponsoring SPIE Photonics West 2019

MRSI Systems will be exhibiting at SPIE Photonics West, held at the Moscone Center in San Francisco, CA, USA from February 5-7, 2019.

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Automotive LIDAR Conference 2018: AI & Autonomous Vehicles

MRSI Systems exhibited at the Automotive LIDAR 2018 Expo and Conference in Detroit, Michigan last month. The conference focused not only on hardware solutions but software as well. The use of AI

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MRSI Systems Participates in Local Photonics & Advanced Manufacturing Symposiums

MRSI exhibited at the Inaugural WPI/QCC Integrated Photonics Symposium, at WPI October 3, 2018, and Dr. Yi Qian, VP of Marketing, MRSI Systems participated in an industry panel including

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Great Week at SPIE Photonics West 2019

Thank you to all of our existing customers and new customers who visited us at SPIE Photonics West. The turnout at the booth was filled with great discussions. The event was well attended with

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Executive management team

Executive management team About executive management Contact Investor Relations Mycronic executive management team consists of seven persons including the CEO. Executive management team Anders

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Board of directors

Board members About board of directors Contact Investor Relations Interior view from Mycronic HQ Board of directors Patrik TIgerschiöld, Chairman of the Mycronic board Arun Bansal, independent

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Archive annual meetings

Archive annual meetings Annual General Meeting, May 8 2024, Täby Digital registration for the Annual General Meeting, click here. Digital post voting form, click here. Notice to Annual

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News & events

Stay updated on the latest news and events from Mycronic, a global company that advances electronics technology with innovative solutions and a diverse work culture.

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Capital markets day

During Mycronic’s Capital Markets Day you can learn more about our group strategy, financial and sustainability targets, product areas and global technologies.