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Mycronic’s largest component storage system capable of storing 2,468 reels in less than 2 m². The same height as the MYTower 6 and MYTower 6+, but is equipped with a new storage technology

Your business is built to produce. MYCare keeps you ahead of the curve. Mycronic MYCare services offers multiple levels of technical support, preventive maintenance, and service to suit your

The MYTower 6+ is the same height as the MYTower 6, with the key difference being the ability to store 15′′ reels in all magazines within the storage system.

MYPro Create Multi-machine programming for electronics manufacturers A single interface and workflow MYPro Create makes multi-machine programming a lot smoother and paves the way for future

Mycronic SLX series.  Gear up to meet today’s fast-paced semiconductor industry. 

To ensure high end display photomask quality up to generation 11.

A9a A9a Description Specification Brochures Services Contact The fully automated A9a, 8-head, double-sided, high-speed, high-accuracy granite based flying probe test system features

For detailed Data Sheets please contact Sales. The MRSI-S-HVM submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging

For detailed Data Sheets please contact Sales. The MRSI-LEAP high-speed die bonder boasts a range of innovative features that make it an essential tool for high-volume manufacturing.

For detailed Data Sheets please contact Sales. The MRSI-H1 family provides proven superior flexibility for true multi-die, multi-process, multi-product high volume high mix production.

For detailed Data Sheets please contact Sales. The MRSI-705 5-Micron Flip-Chip Die Bonder sets the mark for high-precision, high-speed component assembly within a flexible, configurable platform.

A9 plus A9 plus Description Specification Brochures Services Contact The A9 Plus is utilizing the same technology as the A9 and is in addition equipped with 4 high-resolution cameras (3µm/pixel)

S3-8 S3-8 Description Brochures Specification Services Contact S3-8 is the double-sided model of the single-sided S3 System. The S3-8 has 8 test heads and 2 high-resolution cameras, one on the

S3 S3 Description Specification Brochures Services The S3 is able to test 10 µm structures while achieving 100 measurements per second. The machine, therefore, provides the customer with an

LM1000 LM1000 Description Brochures Specification Services Contact The LM1000 is a highly precise compact and fully automated step tester for the electrical test of HDI bare boards in mass

A9a plus A9a plus Description Specification Brochures Services Contact The A9a plus is utilizing the same technology as the A9a and is in addition equipped with a temperature control unit and 4

A7-16 Pro A7-16 Pro Description Brochures Specification Services Contact The A7 Pro is also available with 16 test heads and with a large test area of 24" x 39.4". Teh A7-16 Pro benefitting

GenI - Generative AOI programming With Gen I™ your team gains: The industry’s fastest programming — eliminate specialized AOI programming for every new product. Faster NPIs — accelerate

High-performance 3D AOI for high-productivity production.

All the power of the MYPro I series 3D AOI in dual lane configuration.

All the power of the MYPro I series 3D AOI for heavyweight board inspection.

High-performance 3D AOI for high-productivity production.