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Wafer-Level Packaging Symposium 2025
die-bonding US en San Francisco, CA, USA Wafer-Level Packaging Symposium Wafer-Level Packaging Symposium 2025 The Wafer-Level Packaging Symposium will be held in San Francisco, CA from February
IMAPS Device Packaging Conference 2025
die-bonding US en Phoenix, AZ, USA IMAPS Device Packaging 2025 IMAPS Device Packaging 2025 The 21st Annual Device Packaging Conference (DPC 2025) will be held in Phoenix, Arizona, on March 3-6,
Asia Photonics Expo 2025
die-bonding SG en Marina Bay Sands Singapore Asia Photonics Expo 2025 Asia Photonics Expo 2025 MRSI Mycronic will exhibit at the Asia Photonics Expo 2025. Stand No.: B111
IMAPS Boston 2024
die-bonding US en Boston, MA, USA IMAPS Boston 2024 International Microelectronics Assembly and Packaging Society (IMAPS) Boston 2024 The International Symposium on Microelectronics is focused on
China International Optoelectronic Conference 2024
die-bonding CN en Shenzhen, China CIOE Conference CIOE Conference Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems, Mycronic Group, and General Manager of MRSI Automation (
CIOE – China International Optoelectronic Expo 2024
die-bonding CN en Shenzhen, China CIOE Logo 2024 China International Optoelectronic Exposition (CIOE) 2024 CIOE is the world’s largest optoelectronics event. Location: Shenzhen World Convention
EPIC (European Photonics Industry Consortium) TechWatch at CIOE
die-bonding CN en Shenzhen, China EPIC (European Photonics Industry Consortium) TechWatch at CIOE On September 11th, 2024, Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems,
Compound Semiconductor Conference
die-bonding US en Suzhou, China Compound Semiconductor Conference Banner Compound Semiconductor Conference Dr. Limin Zhou to present “A New Engine for the Development of Photonics Industry –
SEMICON West
die-bonding US en San Francisco, CA USA SEMICON West includes the extended microelectronics industry supply chain. Booth: South Hall #762
OFC 2024
die-bonding US en San Diego, CA USA Optical Fiber Communication Conference® and Exposition 2024 Optical Fiber Communication Conference® and Exposition MRSI Booth #1800
China International Optoelectronic Expo Conference
die-bonding CN en Shenzhen, China CIOE Conference CIOE Conference Location: Shenzhen, China Dr. Limin Zhou will present “The Evolution and Trends of Optoelectronic Chip Packaging in the AI Era”
Massachusetts Manufacturing Mash-Up
die-bonding US en Gillette Stadium, Foxborough, MA Massachusetts Manufacturing Mash-Up Join us at the 2024 Massachusetts Manufacturing Mash-Up.
MRSI Systems – ATC Auto Lidar Webinar
die-bonding CN zh-Hans MRSI Systems – ATC Auto Lidar Webinar On March 17th, 2022, Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic group) and General Manager of