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AI is not artificial - it’s real and powerful. Discover how Mycronic leverages AI to improve forecasting, inspection and maintenance in manufacturing.

Edge computing brings data storage and processing closer to the source of data. Learn how Mycronic supports edge computing with flexible systems and specialized solutions.

Mycronic joins United Nations Global Compact Mycronic joins United Nations Global Compact Sustainability is a key element of Mycronic’s business strategy and we are continuously working to

Join Mycronic in celebrating a legacy of over 50 years of innovation. Discover how we have impacted society and the electronics industry.

Mycronic welcomes Huan Cheng Xin to the Group Mycronic welcomes Huan Cheng Xin to the Group On November 1, 2021, a closing ceremony was held between Mycronic and Huan Cheng Xin Precision

Join our webinars and discover how Mycronic innovates in the electronics industry. Learn more about our latest trends, products, and solutions.

Keep track on our event calendar. We visit trade shows and host events. Learn more and see event dates, locations and information here.

Deliver extremely precise paste volume measurement on even the smallest pads with PI series 3D SPI. Easy and smart auto-programming functions that ensure high-quality inspection within line takt

Mycronic service network spans the globe, with service engineers present in more than 50 countries who are specially trained and certified.

What happens when business is growing, components are shrinking, and both staff and production space remain the same? A visit to Allelektronik shows that the answer lies in the thoughtful

How intelligent material handling can win customers and grow your business

Accelerating material throughput with automated storage

As an innovative European contract manufacturer, DF Elettronica is determined to continually push the limits of automation. Whether it’s inspection, traceability, material transport or process

pcb-assembly How smarter human–machine collaboration is making your people more valuable than ever Empowering people through automation Even with all your resources running at full capacity,

Fast, flexible jet printing with dual-head MY700 tech.

pcb-assembly And this time, it’s vertical The connectivity continues Over the past year, Hermes compatibility has been added to a number of Mycronic’s SMT solutions. The next step is to extend

pcb-assembly Stretching the limits of wearable electronics Deep in the snow-capped mountains of Sweden, the national cross-country ski team will soon not only be pushing their limits in the

For a savvy production manager, it’s always possible to get the right troubleshooting data from your pick-and-place machine – if you have plenty of time and effort to spare. Thanks to MYCenter

pcb-assembly - that can monitor your heart rate Feather-light band-aid sensor SINTEC, AN EU-FINANCED PROJECT FOCUSED ON DEVELOPING SOFT STRETCHABLE ELECTRONICS, CAN NOW PRESENT ITS LATEST

pcb-assembly Frequently asked questions about AI is raising the bar in inspection technology New advances in machine learning In the SMT industry, we’re seeing how AI and machine learning are

Mycronic, the leading Sweden-based electronics assembly solutions provider, will continue to respond to growing customer demand for high-flexibility, high-productivity solutions for zero-defect

Mycronic, the leading Sweden-based electronics assembly solutions provider, will continue to respond to growing customer demand for high-flexibility, high-productivity solutions for zero-defect

More process data. Faster innovation cycles. Smarter factory systems. Change is coming. Is your factory prepared? Our products Our services Our news MYNews magazine Our products are designed to

A magazine from Mycronic MYNews MYNews is a magazine from Mycronic that provides readers with information about the latest products, technologies, and trends in the PCB assembly industry. It

Eutectic bonding is used as an alternative to epoxy bonding. The choice of eutectic bonding is determined by the application and the technical requirements.

Leading optoelectronic and semiconductor packaging companies require fully automated, ultra-precision die bonding systems

As consumers expect more power and more bandwidth from their devices, we see the Advanced Electronic Packaging industry under continuing pressure to cram more technology into smaller spaces. One

MRSI Systems has been a leading supplier to manufacturers of advanced optical packaging assembly for over 30 years. This has enabled MRSI to build unmatched expertise in the assembly technologies

Customers require an application-specific specialized die bonder for HVM of CoS that is able to deliver high speeds while maintaining flexibility.

When it comes to epoxy dispensing your vendor system must offer the ultimate flexible platform for demanding environments. The epoxy dispenser should meet the highest standards of reliability and