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die-bonding CN zh-Hans Shanghai New International Expo Centre (SNIEC) Laser World of Photonics China LASER World of PHOTONICS CHINA 2025 Asia’s largest trade fair for the photonics industry in

die-bonding US en San Francisco, CA USA Photonics West 2025 Photonics West 2025 Photonics West is the world’s premier event for lasers, biomedical optics, biophotonics, quantum, and

die-bonding DE en Frankfurt, Germany ECOC 2024 50th European Conference on Optical Communication The ECOC Exhibition is the key meeting place for everyone in the fibre optic communication

die-bonding US en Online Automotive LIDAR 2024 7th Annual Conference and Exhibition. MRSI Mycronic will be presenting. International Microwave Symposium

die-bonding US en Santa Clara, CA USA Chiplet Summit 2025 Chiplet Summit 2025 MRSI Mycronic is sponsoring the Chiplet Summit at the Santa Clara Convention Center. Booth #314

bare-board-testning CN en at National Exhibition & Convention Centre, Shanghai CPCA 2025

bare-board-testning JP en at Tokyo International Exhibition Center, Tokyo JPCA 2025

bare-board-testning DE de at Munich Productronica 2025

die-bonding US en Online Laser Focus World Webinar – Gen AI: Catalyst for Optical Module Innovation Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI Mycronic and General Manager of

die-bonding CN zh-Hans Shanghai, China Laser World of Photonics China LASER World of PHOTONICS CHINA Asia’s largest trade fair for the photonics industry. Shanghai New International Expo Center.

die-bonding US en San Diego, CA, USA IMAPS San Diego 2023 IMAPS San Diego 2023 The International Symposium on Microelectronics IMAPS is focused on microelectronics and packaging supply chain

die-bonding US en Santa Clara, CA USA Chiplet Summit 2024 Chiplet Summit 2024 MRSI is sponsoring the Second Annual Chiplet Summit at the Santa Clara Convention Center. It is the only event

die-bonding CN zh-Hans Shanghai New International Expo Center Laser World of Photonics China LASER World of PHOTONICS CHINA Asia’s largest trade fair for the photonics industry. MRSI Booth

die-bonding US en San Francisco, CA USA SEMICON West 2024 SEMICON West includes the extended microelectronics industry supply chain. MRSI Booth: South Hall #764

die-bonding SG en Marina Bay Sands Singapore Asia Photonics Expo 2024 Asia Photonics Expo 2024 MRSI will exhibit at the Asia Photonics Expo 2024. Booth: EF-23

LIDAR Tech

die-bonding US en Fountain Hills, AZ, USA IMAPS DPC 2024 IMAPS DPC 2024 The 20th Annual Device Packaging Conference (DPC 2024) is an event organized by the International Microelectronics Assembly

die-bonding CN en Shenzhen, China IFOC Logo 2023 IFOC Location: Shenzhen, China. Dr. Limin Zhou to present “Automotive Lidar Package & Assembly Technology Evolution Trend“

die-bonding US en Washington, DC, USA International Microwave Symposium International Microwave Symposium IMS is focused on the microwave industry. MRSI Booth: #1649 Walter E. Washington

die-bonding CN en Shenzhen, China CIOE Logo 2023 CIOE CIOE is the world’s largest optoelectronics event. Location: Shenzhen World Convention & Exhibition Center Shenzhen, China. Booth: #10B79

die-bonding US en San Francisco, CA USA Photonics West 2024 Photonics West 2024 Photonics West is the world’s premier event for lasers, biomedical optics, biophotonics, quantum, and

die-bonding US en Online Event Automotive LIDAR 2023 Automotive LIDAR 2023 Dr. Irving Wang, Director of Marketing, MRSI Systems, Mycronic Group, will present “High-Volume Assembly of Photonics

die-bonding US en Boxborough, MA, USA IMAPS New England International Microelectronics Assembly and Packaging Society (IMAPS) New England 49th Symposium & Expo.

die-bonding US en San Diego, CA International Microwave Symposium IMS is focused on the microwave industry. MRSI Booth: #2243 International Microwave Symposium

die-bonding US en Boxborough, MA, USA IMAPS logo IMAPS New England International Microelectronics Assembly and Packaging Society (IMAPS) New England 50th Symposium & Expo.

die-bonding GB en Glasgow, Scotland ECOC 2023 ECOC 2023 The ECOC Exhibition is the key meeting place for everyone in the fibre optic communication technology industry. Booth: #703

die-bonding US en MRSI Systems – IEEE Tech Insider Webinar: The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications Internet traffic has been growing at an

bare-board-testning KR en Hall 2~4, Songdo Convensia, Incheon, Korea KPCA Show 2023 KPCA Show 2023 Organized by Korea Electronics Packaging and Circuits Association (KPCA) Managed by  KY

bare-board-testning CN en Shenzhen World Convention & Exhibition Center (Baoan), Shenzhen / China HKPCA Show 2023 All-day event Location: Shenzhen World Convention & Exhibition Center

bare-board-testning CN en at National Exhibition & Convention Centre, Shanghai CPCA 2024