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Precision printing. High-speed jet printer and solder paste PCB printing, surface mount soldering dispenser for a wide range of assembly fluids.

Welcome to Mycronic Solder paste inspection Automated optical inspection PI series 3D SPI. Perfect solder joints made simple. Accurate solder paste inspection with unprecedented simplicity. I

pcb-assembly Ten key SMT trends you need to know The ten trends to keep an eye out for; automation, big data, AI, robotics, two global ecosystems, shorter production cycles, the full line's

pcb-assembly Controlled paset deposition How to achieve zero stencil defects Through Mycronic’s fully integrated 3D solder paste inspection and jet printing solution, you can automatically

Press releases pcb-assembly Keep up to date with our most recent press releases.

pcb-assembly Our most recent news articles.

Product areas PCB assembly Photomask equipment Dispensing and coating Bare board testing Die bonding Photonic Interconnects PCB assembly by Mycronic Photomask equipment Soft touch blade probe The

Stellenanzeigen Lagerist (m/w/d) in Voll- oder Teilzeit (mind. 30 Std./Woche), für unseren neuen Standort Wertheim-Reinhardshof

bare-board-testning Excellent Partner Award from SCC atg Luther & Maelzer's Chinese unit, Test Solutions (Suzhou) Co (TSL), was invited to the supplier meeting in Guangzhou by its customer

Test Solution (Suzhou) Co. Ltd. Mycronic atg Luther & Maelzer China, Suzhou Industrial Park Test Solution (Suzhou) Co. Ltd. Block 5 # 301, No.5 Xinghan Street Suzhou Industrial Park China +86

Interim Report January-September 2023 Third quarter Order intake was SEK 1,467 (1,609) million, a decrease of 9 percent Net sales increased 5 percent to SEK 1,274 (1,214) million. Based on

Year-end Report January-December 2023 Fourth quarter Order intake amounted to SEK 1,448 (2,529) million, a decrease of 43 percent Net sales increased 31 percent to SEK 1,968 (1,497) million. Based

Mycronic AB (publ) has received an order for an SLX mask writer from a new customer in Asia. The order value is in the range of USD 5-7 million. Delivery of the system is planned for the third

Certificates At Mycronic we are committed to working in a systematic, consistent, and efficient way to achieve our goals and create value for our customers and stakeholders. We are constantly

Consensus estimates The consensus estimates are provided by Modular Finance and are based on forecasts from analysts following Mycronic. The analysts’ opinions, forecasts, and estimates regarding

Contact Investor Relations Sven Chetkovich Director Investor Relations E-mail: helloir@mycronic.com Phone: +46 70 558 39 19

AGM elects the company's auditors. Auditor The AGM elects the company's auditors. At the 2023 AGM, the auditing company Ernst & Young AB was re-elected as auditor for the period up until

Advanced heterogeneous integration for 3-D IC packaging, e.g., chiplet, and optoelectronics packaging requires high-precision die bonders that can perform many different processes, such as

Mycronic Global Technologies Business Unit, MRSI Systems announces the recent issuance of utility patent titled “DIE PLACEMENT HEAD WITH TURRET” and numbered ZL 201680048482.5 (PCT/US2016/047135)

STOCKHOLM, Aug 29, 2018 — MRSI Systems (Mycronic Group) is launching the MRSI-H3TO, a new 3 micrometer high speed die bonder which will be the first of its kind to address the multi-die and

Designing and manufacturing electronic components destined for defense applications entails navigating a landscape of exacting standards. These standards demand unparalleled reliability, minimal

The MRSI-H1 family of 1-micron flip-chip die bonders stands out as an advanced ultra-precision solution.

MRSI Systems, Mycronic Group will be exhibiting at the 56th International Symposium on Microelectronics from October 3-4th, 2023 in San Diego, CA. This year's Symposium will feature 5

News die-bonding

The 12th China International Nanotechnology Industry Expo was held in Suzhou, Jiangsu Province from October 27th to 29th, 2021. Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI

MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2022 Silver Honoree for the

MRSI Systems, Mycronic Group will be exhibiting at the 55th International Symposium on Microelectronics from October 4-5th in Boston Massachusetts at the Hynes Convention Center.

MRSI’s fully automated die bonding solutions help RF power amplifier device manufacturers to address manufacturing requirements and challenges. To learn more about how MRSI’s solutions support

摘要：MRSI Systems战略市场高级总监，周利民博士受邀参加光收发器和硅基光电子论坛并将带来主题为“光收发器和硅基光电子量产的挑战及解决方案”的演讲。

SEMICON West, the premier event for the semiconductor industry, is set to take place on July 11-13th, 2023 in San Francisco, CA.