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5 Micron Die Bonders
Learn more about MRSI's 5 micron die bonders.
AOC
Learn more about AOC from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.
Software training videos
MRSI is now offering an extensive library of software training videos for your MRSI die bonding and epoxy dispensing systems. Contact MRSI to learn more.
On-site training
MRSI offers a comprehensive set of training programs covering our family of products. Contact MRSI Systems to learn more about On-Site Training.
Prototyping and Training Services
We provide prototyping and small batch die bonding services for our customers to shorten your time to market.
The false call killer
pcb-assembly — a Q & A with Romain Roux and Nicolas Guillot on DeepReview and the power of AI-driven inspection The false call killer Some call it the “false call killer”: a new Automatic
Press-fit component inspection
Press-fit component inspection with Mycronic 3D AOI
News and press releases
News Press releases Our most recent news articles. Keep up to date with our most recent press releases. Our most recent news articles and press releases. PCB assembly news and press releases
News
pcb-assembly Our most recent news articles.
Mycronic introduces the MYPro A40: an evolutionary high-speed, high-flexibility pick-and-place platform
Mycronic, the leading Sweden-based electronics assembly solutions provider, is introducing its next-generation MYPro A40 pick-and-place solution, equipped with an all-new MX7 high-speed mounthead
Mycronic promises to eliminate majority of false calls with new deep learning system for 3D AOI
Mycronic, the leading Sweden-based electronics assembly solutions provider, has announced the launch of DeepReview, a new Automatic Defect Classification system that leverages the power of AI to
Mycronic High Flex changes division name to PCB Assembly Solutions
Mycronic AB (publ), the leading Sweden-based electronics assembly solutions provider, today announced that its division formerly known as High Flex will now operate under the name PCB Assembly
Mycronic to showcase its full-line solution at IPC APEX EXPO 2025
Mycronic, the leading Sweden-based electronics assembly solutions provider, continues to respond to growing customer demand by offering high-flexibility and high-productivity solutions.
Press releases
Press releases pcb-assembly Keep up to date with our most recent press releases.
Die bonding solutions
Fully automatic high accuracy die bonders that are capable of epoxy and eutectic die bonding are the lifeblood of the modern semiconductor industry.
About us
Under the MRSI brand, we leverage over 40 years of industry expertise in high-accuracy die bonders, active aligners, and fluid dispensers to deliver unparalleled reliability and precision for
History
Learn about MRSI Systems, a MA die bonding and epoxy dispensing system manufacturer in MA.
Mycronic Sweden HQ
Mycronic Sweden HQ Mycronic headquarter in the winter Mycronic AB Nytorpsvägen 9 Box 3141 183 03 Täby Sweden +46 8 638 52 00 +46 8 638 52 90 Mycronic Täby Yes, please contact me
Test Solution (Suzhou) Co. Ltd.
Test Solution (Suzhou) Co. Ltd. Mycronic atg Luther & Maelzer China, Suzhou Industrial Park Test Solution (Suzhou) Co. Ltd. Block 5 # 301, No.5 Xinghan Street Suzhou Industrial Park China +86
Optical Components & Transceivers
Learn more about Optical Components and Transceivers from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.
Video gallery
MRSI Systems Video Gallery - See the latest eutectic bonding, die bonding, epoxy stamping, and epoxy die attach videos.
News & events
News & events Events News Press releases Cases Technical articles archive Webinars Gallery Video gallery MRSI events Our future events & webinars. Our most recent news articles. Keep up to
TO-TOSA/ROSA
Learn more about TO-TOSA/ROSA from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.
Image gallery
Check out the MRSI Systems gallery for images and videos of MRSI die bonding and epoxy dispensing systems available from MRSI Systems in MA.
MRSI Systems 推出用于大批量生产光电子器件的高速贴片机
美国马萨诸塞州, August 14, 2017 – 全球领先的全自动、高精度、高速贴片和点胶系统制造商,MRSI Systems推出一款新型产品, MRSI-HVM3 高速贴片机,以支持光电子客户的大批量生产需求。目前,MRSI-HVM3 正在全面投产并发货至世界各地的客户。
MRSI Systems Delivered 3-Micron Die Bonder MRSI-M3 to AIM Photonics Academy’s Education and Practice Factory at MIT in Cambridge for Research and Education
North Billerica, MA, USA, March 20, 2017 — MRSI Systems, a leading provider of fully automated, high-speed, high-precision die bonding and epoxy dispensing systems, today announces the
MRSI为5G无线网络光电器件推出新型MRSI-H3TO贴片机产品
MRSI系统公司(Mycronic集团)推出MRSI-H3TO新型3微米高速贴片机,这是业界第一款可以真正满足多晶片和多流程的要求,可实现行业领先的贴片速度、卓越的灵活性以及为未来产品准备的3微米贴片精度。 MRSI-H3TO专为WDM与EML-TO或其他多晶片多流程TO-can光电器件量身打造,以支持即将普及的5G无线网络。
MRSI Systems推出用于新应用的MRSI-HVM3P新产品
die-bonding MRSI Systems推出用于新应用的MRSI-HVM3P新产品 MRSI Systems(Mycronic集团)8月20日在美国马萨诸塞州扩展其业界领先的MRSI-HVM3高速贴片机机平台,推出MRSI-HVM3P新款机型,为有源光缆(AOC)、管盒(Gold-box)封装 以及 基板芯片(CoC)之外 的其他应用提供优化配置。
MRSI Systems推出新型MRSI-H3LD高速贴片机
MRSI系统公司(Mycronic集团)推出MRSI-H3LD新型3微米高速贴片机,专用于大功率半导体激光器中的芯片贴片,广泛应用于工业激光器、光纤放大、光源和传感器等先进光电子应用。