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Student opportunities

Student and early careers opportunities Your ideas will grow with us Student and early careers opportunities There are different ways for us to cooperate if you are a student. Thesis work We are

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LCD displays

Take your photomask quality to the highest levels Large area LCD displays Challenge On average, the size of LCD displays has been growing one inch every year. Resolution has been increasing, and

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Mycronic Sweden HQ

Mycronic Sweden HQ Mycronic headquarter in the winter Mycronic AB Nytorpsvägen 9 Box 3141 183 03 Täby Sweden +46 8 638 52 00 +46 8 638 52 90 https://goo.gl/maps/LgbBNF1avoHRiD4i6 Yes,

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Press releases

photomask-equipment

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Partners

See MRSI Systems strategic partner companies from all over the world that help MRSI Systems provide unsurpassed products for our customers.

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Die bonding solutions

Fully automatic high accuracy die bonders that are capable of epoxy and eutectic die bonding are the lifeblood of the modern semiconductor industry.

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Testimonials

See what real MRSI Systems customers are saying about our Die Bonding and Epoxy Dispensing systems and how they have helped them succeed.

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Best Support Award from Bomin

bare-board-testning "Shaping the Future, Igniting New Journeys" atg Luther & Mealzer GmbH Awarded Bomin’s 2025 "Best Support Award" On May 24, 2025, the grand opening ceremony

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Excellent Partner Award from SCC

bare-board-testning Excellent Partner Award from SCC atg Luther & Maelzer's Chinese unit, Test Solutions (Suzhou) Co (TSL), was invited to the supplier meeting in Guangzhou by its customer

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Events

Events bare-board-testning

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1 Micron Die Bonders

Learn more about MRSI's 1 micron die bonders.

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High Precision Flip-chip Die Bonders

Learn more about MRSI's high precision flip chip die bonders.

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Thank you for contacting us regarding die bonding

Thank you for contacting us regarding die bonding

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MRSI Mycronic announces advanced high-speed 1µm die bonder MRSI-LEAP for ultra-high-volume manufacturing of AI optical module applications

MRSI Mycronic is proud to announce the launch of the MRSI-LEAP high-speed 1µm die bonder. This innovative equipment is designed for ultra-high-volume manufacturing of optical modules,

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MRSI opens a new Product Demo Center in China, will present at the Infostone Conference and attend CIOE with live demos

MRSI Systems (Mycronic Group) will exhibit at the 23rd China International Optoelectronic Exposition (CIOE) at the Shenzhen World Exhibition & Convention Center from September 16-18, 2021. MRSI

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MRSI中国新产品演示中心开业,将出席讯石研讨会,参加CIOE展会并提供现场演示

die-bonding MRSI中国新产品演示中心开业,将出席讯石研讨会,参加CIOE展会并提供现场演示 摘要:第23届中国国际光电博览会(CIOE)将于2021年9月16-18日在深圳国际会展中心举办。MRSI Systems (Mycronic Group)届时将携最新的MRSI-HVM带轨道双机头固晶机参展,MRSI将在展位#4B79进行现场演示。MRSI

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Challenges and Solutions in the Photonics Packaging Industry

This increased demand for photonics components is driven by the growth in optical networks. Learn more about Photonics Packaging by reading more from MRSI Systems!

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Die Bonding Solutions

Having a proven ultra-accurate die bonding system platform that is mechanically and thermally stable, with no cantilevered parts, are essential elements to achieve accurate device placement.

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Mycronic technology essential in 5G development

die-bonding Mycronic technology essential in 5G development Die bonding systems are required for the groundbreaking digital transition Mycronic technology essential in 5G development 5G is

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Die Bonding Process Pages – Highlights

Various die bonding approaches have been, and still are, developed to meet the ever-evolving product requirements.

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How Does MRSI Systems Manufacture to Customer’s Specification?

MRSI Systems thinks from the customer’s perspective and upholds strict protocols to ensure your desired configuration, has been built to proper specification. MRSI’s core value of acting like an

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Software Video Training Programs for Die Bonding and Epoxy Dispense Systems

These videos help you to discover advanced features of our MRSI machines, which will ensure your production line is optimized.

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Join MRSI at the 50th European Conference on Optical Communication

We are pleased to be exhibiting again this year at the 50th ECOC in Frankfurt am Main, Germany.

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Die bonding solution for Chip-on-Submount (CoS) – Excerpt from our LFW article

Excerpt from MRSI’s recent article emphasizes the CoS die bonding process requirements including geometric placement accuracy & void free eutectic bonding.

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Join MRSI at SPIE Photonics West in San Francisco

die-bonding Join MRSI at SPIE Photonics West in San Francisco Join MRSI at SPIE Photonics West in San Francisco Meet with MRSI Systems, Mycronic Group in San Francisco Booth #5405 MRSI will be

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Register for the Laser Focus World Webinar: Gen AI: Catalyst for Optical Module Innovation

die-bonding Register for the Laser Focus World Webinar: Gen AI: Catalyst for Optical Module Innovation Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Mycronic and General Manager

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专访MRSI SYSTEMS周利民:MRSI-HVM-p系列贴片机助力光通讯产业高速发展

摘要:9月16-18日,CIOE 2021期间,MRSI SYSTEMS携携最新的MRSI-HVM带轨道双机头固晶机精彩亮相。在4B79展台,讯石以现场视频直播方式走进MRSI SYSTEMS展台参观了正在进行演示的产品,MRSI SYSTEMS战略营销高级总监周利民博士向观众介绍本次参展的新产品。

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Interview with MRSI Systems Dr. Limin Zhou: MRSI Die Bonders support the fast growth of the optical communication market

During 2021 CIOE in Shenzhen, China, Infostone, interviewed Dr. Limin Zhou, Senior Strategic Marketing Director of MRSI Systems (Mycronic Group) to discuss MRSI’s latest product developments and

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MRSI to present at Automotive LIDAR 2021

MRSI (Mycronic Group) is exhibiting, sponsoring, and presenting at the Automotive LIDAR 2021 Virtual Conference and Exhibition from September 21-23rd, 2021. MRSI is presenting on Wednesday,

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MRSI presented at the 12th China International Nanotechnology Industry Expo

The 12th China International Nanotechnology Industry Expo was held in Suzhou, Jiangsu Province from October 27th to 29th, 2021. Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI