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Welcome to Mycronic’s Capital Markets Day in Stockholm on November 29 Mycronic invites institutional investors, equity analysts and media representatives to Mycronic’s Capital Markets Day on

Mycronic’s Nomination Committee appointed The Nomination Committee for Mycronic’s 2019 AGM has been appointed. In accordance with the AGM’s decision, Mycronic’s Nomination Committee shall consist

Asian customer to upgrade Prexision system Mycronic has landed an order to upgrade a system to a full-scale Prexision-10 with expanded functionality. The upgrade will be implemented on a

Mycronic doubled net sales with favorable profitability Mycronic’s net sales for the first half of 2017 increased 97 percent compared with last year. The underlying EBIT margin was 34 percent. ”A

Mycronicto highlight next-generation line automation and dispensing solutions at Productronica 2017 Täby, 9 November, 2017 – Mycronic AB (publ) will demonstrate its latest generation of

Mycronic has received amultiple SMT equipment order from US customer Täby, 21 July, 2017 – Mycronic AB (publ), has received an order for several SMT systems from a customer in the US. The

Mycronic acquires RoyoTech and Kognitec Täby, 11 February, 2016 - Mycronic AB (publ), has acquired 75 percent of RoyoTech Digitalelektronik GmbH and has an option to acquire the remaining 25

Mycronic receives order for a replacement mask writer Täby, 26 February, 2016 - Mycronic AB (publ), has received another order for a mask writer, built on the Prexision platform, replacing an

Mycronic receives order for an FPS mask writer with special configuration Täby, 27 November, 2017 - Mycronic AB (publ), has received order for a mask writer in the FPS series from a customer

Mycronic and Aegis renew partnership – FactoryLogix software to be embedded with MY700 Täby, 17 November, 2017 - The global SMT solutions provider Mycronic will, through a renewed

Mycronic nomination committee for AGM 2018 appointed The following persons have been appointed members of Mycronics’s nomination committee for the Annual General Meeting (AGM) in 2018: Henrik

MRSI系统公司（Mycronic集团）推出MRSI－H3LD新型3微米高速贴片机，专用于大功率半导体激光器中的芯片贴片，广泛应用于工业激光器、光纤放大、光源和传感器等先进光电子应用。

STOCKHOLM, Nov 9, 2018 — MRSI Systems (Mycronic Group) announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in the Longhua district,

MRSI is pleased to announce the presentation of its latest innovation, the MRSI-LEAP Die Bonder, at the China International Optoelectronic Expo (CIOE) in Shenzhen, taking place from September 10th

The International Microwave Symposium (IMS) is an annual conference for professionals in the microwave and RF industry.

The rapid adoption of artificial intelligence is driving advancements in optical interconnect technology, resulting in notable improvements in speed, power efficiency, and cost reduction. This

The MRSI-A-L machine is a versatile optical active alignment platform suitable for a wide range of applications, including lens, fiber and other optical components active alignment.

We are thrilled to announce our presence at SEMICON West in its dynamic new location—Phoenix, AZ. Experience firsthand the future of die bonding, active alignment, fluid and epoxy dispensing as

News die-bonding

The 2025 Optical Fiber Communications Conference and Exhibition (OFC) is back to solidify its status as the premier global event for optical networking and communications. 

MRSI Mycronic will be participating in several optical and device packaging exhibitions. We invite you to attend these upcoming events. We look forward to discussing our latest product

The MRSI-705 has established itself as a reliable tool in the aerospace, defense, and medical industries, playing a crucial role in mission-critical tasks due to its performance, adaptability,

The optical components industry demands highly precise and customized equipment for complex optical assembly processes. We have answered this need with our new active aligner - a high-performance

In the fast-paced world of photonics manufacturing, having the right tools can make all the difference. The MRSI-H1 is designed to meet the demands of high-volume production with its

die-bonding Epoxy Dispenser The Next Generation MRSI-175Ag Epoxy Dispenser is now available In the fast-paced world of advanced packaging and semiconductor manufacturing, precision and efficiency

MRSI Mycronic is proud to sponsor the 7th Annual Automotive LIDAR Conference, taking place online from November 20-21, 2024.

MRSI’s die bonding systems are designed to address the challenges of chip packaging with a focus on efficiency, precision, and productivity. These systems feature an advanced, patented

Last year, MRSI Systems launched the MRSI-705HF high force die bonder, a new version of the trusted MRSI-705 that is perfect for sintering and thermocompression bonding applications.

die-bonding MRSI-705 with wafer, conveyor Versatile package handling capabilities: dewar and beyond In today's fast-paced production environments, efficiency and versatility are key. The MRSI-705

Chief Judge of federal court in Boston knocks out Palomar’s claim of infringement for its “double pick” patent allegedly covering a manufacturing process; court rules that claimed method is “so