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Mycronic to unveil new MYSmart series for dispensing and coating at Productronica 2017

Mycronic to unveil new MYSmart series for dispensing and coating at Productronica 2017 Täby, 9 November, 2017 – Mycronic AB (publ) will launch its new MYSmart series, a complete portfolio of

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Mycronic launches a new mask writer for the semiconductor industry

Mycronic launches a new mask writer for the semiconductor industry Mycronic AB (publ) launches SLX, a new laser-based mask writer for the semiconductor industry. The introduction of the SLX also

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Mycronic receives two GLOBAL Technology Awards 2019

Global SMT & Packaging has awarded Mycronic two GLOBAL Technology Awards for being one of the industry’s leading innovators. The awards are granted Mycronic’s solder paste add-on and repair

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Mycronic has received a multiple order within the MYPro series

Mycronic has received a multiple order within the MYPro series Täby, 6 September, 2017 – Mycronic AB (publ), has received an order for several systems of the MYPro series from DF Ellettronica

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Mycronic receives order for advanced maskwriter

Mycronic receives order for advanced maskwriter Mycronic has received an order for a Prexision-800 from a customer in Asia. The system is configured with limited functionality and is scheduled

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Mycronic appoints Nomination Committee

Mycronic appoints Nomination Committee The Nomination Committee for Mycronic’s 2021 Annual General Meeting has been appointed in accordance with the instructions for the Nomination Committee as

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MRSI Systems赢得长期诉讼, Palomar的 “Double Pick” 专利权被判无效

波士顿联邦法院首席法官驳回了Palomar对MRSI涉嫌涵盖制造过程的“double pick”专利侵权指控的主张;法院裁定声称的该方法“非常基础,已被人类了解数千年。”国际律师事务所Crowell&Moring LLP代表领先的精密制造商MRSI Systems;MRSI将向Palomar索取全额律师费。

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MRSI improves accuracy to 1.5 micrometers for MRSI-H/HVM-Series die bonders

MRSI Systems (Mycronic Group) is pleased to announce the latest advancement in the MRSI-H/HVM-series product line. Placement accuracy was tested using industry-standard glass die reference

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MRSI to exhibit with live demonstrations and present at LASER World of PHOTONICS CHINA

die-bonding MRSI to exhibit with live demonstrations and present at LASER World of PHOTONICS CHINA We are pleased to announce that MRSI, Mycronic Group will be exhibiting at LASER World of

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MRSI launches new die bonders with improved accuracy

die-bonding MRSI launches new die bonders with improved accuracy MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and

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Press releases

Find the MRSI Systems Press Releases Archives here. Here you will be able to access all of the documents at which you may need to take a look.

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MRSI Systems 荣获“2021 Laser Focus World创新大奖”

2021年9月27日,由 Laser Focus World 主办的“2021年度创新大奖”评选落下帷幕,MRSI Systems(Mycronic Group)凭借MRSI-H-TO 1.5微米贴片机系列产品荣膺银奖,该奖项为生产设备类的最高奖。

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Mycronic acquires MRSI Systems, LLC

Täby, 1 June, 2018 – Mycronic AB (publ), acquires 100 percent of MRSI Systems, LLC (MRSI), headquartered in North Billerica, Massachusetts, in the USA. The purchase price amounts to USD 40.7

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MRSI Systems announces “One Stop Shop” die bonding solutions at CIOE and ECOC

STOCKHOLM, Aug. 30, 2018 — MRSI Systems (Mycronic Group) will be demonstrating our “One Stop Shop” capabilities at the 20th China International Optoelectronic Exposition (CIOE) at the Shenzhen

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MRSI Mycronic to present at Automotive LIDAR 2023

Join us at the 6th annual Automotive LIDAR conference and exhibition from October 3-5, 2023. This conference is the only event in the world exclusively focused on automotive LIDAR technologies

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Advancing Microelectronics: MRSI Mycronic’s Presence at IMAPS New England

At the IMAPS New England Symposium, MRSI will showcase our latest innovations.

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Mastering the Art of Handling Delicate High Aspect Ratio Dies: Challenges and Solutions

Handling delicate, large aspect ratio, and thin dies is essential across various applications, including RF Power, Optical, and MEMS. These devices have aspect ratios exceeding 45 to 1,

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Silver Epoxy Turns Black After an Oxygen Plasma Clean Prior to Wire Bonding – But so What?

Learn more about epoxy bleed from industry expert Tom Green. Here is the abstract of the white paper Silver Epoxy Turns Black After an Oxygen Plasma Clean Prior to Wire Bonding

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The Japanese version of MRSI’s article “Die-bonder innovations target HPLD manufacturing challenges” is now available

MRSI’s article in Laser Focus World’s February 2020 Issue “Die-bonder innovations target HPLD manufacturing challenges” discusses the die bonding challenges of High-power laser diodes (HPLDs)

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Join MRSI Mycronic at the China International Optoelectronic Exposition (CIOE)

MRSI is proud to be exhibiting and presenting at the 25th China International Optoelectronic Exposition this year in Shenzhen. Stop by our booth #10B79 to learn more about how MRSI products meet

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MRSI to sponsor and present at IMAPS New England this May

die-bonding MRSI to sponsor and present at IMAPS New England this May MRSI Systems is delighted to announce another opportunity to see us this spring. We will be a featured Platinum Sponsor along

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Join MRSI at ECOC 2023 – The European Conference on Optical Communication

MRSI is excited to announce we will be exhibiting at the 49th exhibition of ECOC in Glasgow, Scotland from October 2-4, 2023.

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MRSI Mycronic to Present at Automotive LIDAR 2022

Join us at the 5th annual Automotive LIDAR conference and exhibition from September 20-22nd. Automotive LIDAR is the only conference to be primarily focused on automotive LIDAR technologies and

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Dr. Limin Zhou to present at the CHIP China Conference

Dr. Limin Zhou, General Manager, MRSI Automation (Shenzhen) Co., Ltd., Senior Director of Strategic Marketing, MRSI Systems will present “Discussion on New Challenges and Solutions of Chip

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MRSI to present at LaserFocusCon 2022

We are pleased to announce that MRSI will be exhibiting at this year’s LaserFocusCon in Suzhou, China on August 30th. Dr. Limin Zhou, Senior Director, Strategic Marketing, MRSI Systems, Mycronic

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MRSI to present and attend 4th LiDAR Tech 2022

MRSI will attend the 4th LiDAR Tech Forum taking place from November 16-18, 2022 in Suzhou, China. This event will focus on market trends, technological breakthroughs, and practical applications

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What is the Future of Optoelectronics Packaging?

Innovation in wireless technology leads to faster and smarter networks. 5G and the Internet of Things (IoT) have the capacity to connect everyone & devices.

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Manufacturing Automation Case Study – Flexible High-Speed Die Bonding Automation Platform

The following excerpt from MRSI Systems latest article published in Laser Focus World Magazine demonstrates how the latest advanced automated die bonding systems are transforming the world of

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Challenges in High-Volume Manufacturing for Die Attach Systems

Increasing demand for high-volume manufacturing accelerates the continuing adaptation of full automation in advanced eutectic packaging.