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Advancing Microelectronics: MRSI Mycronic’s Presence at IMAPS New England

At the IMAPS New England Symposium, MRSI will showcase our latest innovations.

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MRSI to sponsor and present at IMAPS New England this May

die-bonding MRSI to sponsor and present at IMAPS New England this May MRSI Systems is delighted to announce another opportunity to see us this spring. We will be a featured Platinum Sponsor along

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Join MRSI at ECOC 2023 – The European Conference on Optical Communication

MRSI is excited to announce we will be exhibiting at the 49th exhibition of ECOC in Glasgow, Scotland from October 2-4, 2023.

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Mastering the Art of Handling Delicate High Aspect Ratio Dies: Challenges and Solutions

Handling delicate, large aspect ratio, and thin dies is essential across various applications, including RF Power, Optical, and MEMS. These devices have aspect ratios exceeding 45 to 1,

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Dr. Limin Zhou to present at the CHIP China Conference

Dr. Limin Zhou, General Manager, MRSI Automation (Shenzhen) Co., Ltd., Senior Director of Strategic Marketing, MRSI Systems will present “Discussion on New Challenges and Solutions of Chip

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MRSI to Exhibit at NEPCON Thailand

We are pleased to announce we are exhibiting with our distributor PREM at NEPCON Thailand, scheduled from June 18-21, 2025, at BITEC in Bangkok.

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MRSI to Sponsor and Exhibit at the International Microelectronics Assembly and Packaging Society (IMAPS) Symposium

MRSI (Mycronic Group) is exhibiting at the 54th International Symposium on Microelectronics from October 11-14, 2021, in San Diego, California at the Town and Country Resort.

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MRSI will exhibit and present at the Automotive LIDAR 2020 Virtual Conference and Exhibition

MRSI Mycronic is exhibiting at the Automotive LIDAR 2020 Conference and Virtual Exhibition from September 22-24th, 2020. See the conference agenda for more details. Visit the MRSI virtual booth

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Silver Epoxy Turns Black After an Oxygen Plasma Clean Prior to Wire Bonding – But so What?

Learn more about epoxy bleed from industry expert Tom Green. Here is the abstract of the white paper Silver Epoxy Turns Black After an Oxygen Plasma Clean Prior to Wire Bonding

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The Japanese version of MRSI’s article “Die-bonder innovations target HPLD manufacturing challenges” is now available

MRSI’s article in Laser Focus World’s February 2020 Issue “Die-bonder innovations target HPLD manufacturing challenges” discusses the die bonding challenges of High-power laser diodes (HPLDs)

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Join MRSI Mycronic at the China International Optoelectronic Exposition (CIOE)

MRSI is proud to be exhibiting and presenting at the 25th China International Optoelectronic Exposition this year in Shenzhen. Stop by our booth #10B79 to learn more about how MRSI products meet

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MRSI Mycronic to Present at Automotive LIDAR 2022

Join us at the 5th annual Automotive LIDAR conference and exhibition from September 20-22nd. Automotive LIDAR is the only conference to be primarily focused on automotive LIDAR technologies and

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MRSI to present at LaserFocusCon 2022

We are pleased to announce that MRSI will be exhibiting at this year’s LaserFocusCon in Suzhou, China on August 30th. Dr. Limin Zhou, Senior Director, Strategic Marketing, MRSI Systems, Mycronic

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MRSI to present and attend 4th LiDAR Tech 2022

MRSI will attend the 4th LiDAR Tech Forum taking place from November 16-18, 2022 in Suzhou, China. This event will focus on market trends, technological breakthroughs, and practical applications

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ECTC San Diego 2022 Highlights

The 2022 Electronics Components and Technology Conference in San Diego was a tremendous success. We would like to thank everyone who attended the conference and to those who stopped by our booth

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Smarter growth in the SMT factory

What happens when business is growing, components are shrinking, and both staff and production space remain the same? A visit to Allelektronik shows that the answer lies in the thoughtful

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Mycronic to showcase more versatile, high-productivity assembly solutions at IPC APEX EXPO 2024

Mycronic, the leading Sweden-based electronics assembly solutions provider, will continue to respond to growing customer demand for high-flexibility, high-productivity solutions for zero-defect

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In-line dispensing

In-line dispensing MYD10/10i MYD50 MY700JD MYSmart in-line dispensing valves Brochure MYD The compact MYD10 enables highly advanced non-contact jetting for enhanced dispensing uniformity,

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A game changer in high-speed jet printing

Fast, flexible jet printing with dual-head MY700 tech.

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Excellence in the workplace and strong partnerships: DF Elettronica's success story

pcb-assembly Excellence in the workplace and strong partnerships DF Elettronica's success story Italy based DF Elettronica gives us insight to their business and what makes them stand out as

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RF Power Amplifier & Microwave Device

Learn more about RF Power Amplifiers and Microwave Device from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 4o years.

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Microwave & RF

Microwave and RF packages from MRSI Systems who has been a leading supplier of High Frequency, Ultra High Frequency components for over 40 years.

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Gallery

Gallery Video gallery Image gallery MRSI Die Bonding Video MRSI Patented Turret MRSI Die Bonding Gallery

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What is the Future of Optoelectronics Packaging?

Innovation in wireless technology leads to faster and smarter networks. 5G and the Internet of Things (IoT) have the capacity to connect everyone & devices.

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Photonic Interconnects

Our machines and materials Software and Technology Always one photon ahead – with industry ready 3D nano-printing and a full solution portfolio for Photonic Integration Based on its globally

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Manufacturing Automation Case Study – Flexible High-Speed Die Bonding Automation Platform

The following excerpt from MRSI Systems latest article published in Laser Focus World Magazine demonstrates how the latest advanced automated die bonding systems are transforming the world of

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Challenges in High-Volume Manufacturing for Die Attach Systems

Increasing demand for high-volume manufacturing accelerates the continuing adaptation of full automation in advanced eutectic packaging.

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VPT Components and MRSI Systems jointly address manufacturing challenges

Learn more about how VPT Components and MRSI Systems jointly address manufacturing challenges.

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Investors

Explore Mycronic’s investor relations page. Download our latest financial reports, presentations and learn more about our governance, upcoming events and find our contact information.

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Policies

We will always act ethically, respect human rights and comply with rules, regulations, requirements and standards applicable to us. Learn about how we act.