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MRSI钱毅博士:5G时代自动化贴片系统的发展趋势

5G时代的到来势不可挡,而这一趋势也不断对芯片的贴片、封装工艺提出新的要求。在此背景下, 作为全球光电器件自动化贴片封装设备的领军企业, MRSI Systems也适时推出了新产品、新技术。在今年9月的深圳光博会上,MRSI的产品管理和市场营销副总裁钱毅博士向OFweek光通讯网介绍了MRSI的产品、研发优势及未来的市场趋势。

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MRSI Systems赢得长期诉讼, Palomar的 “Double Pick” 专利权被判无效

波士顿联邦法院首席法官驳回了Palomar对MRSI涉嫌涵盖制造过程的“double pick”专利侵权指控的主张;法院裁定声称的该方法“非常基础,已被人类了解数千年。”国际律师事务所Crowell&Moring LLP代表领先的精密制造商MRSI Systems;MRSI将向Palomar索取全额律师费。

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MRSI to present at IFOC and attend CIOE in September in Shenzhen including live product demos

MRSI Systems will present at the 19th Infostone Optical Communications (IFOC) Conference, organized by Infostone Communication Consultant. The event will take place in Shenzhen, China from

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MRSI-S-HVM亚微米贴片机荣获“讯石2020年度光通信最具竞争力产品”

摘要:MRSI Systems, Mycronic Group的MRSI-S-HVM亚微米贴片机荣获“2020年度光通信最具竞争力产品”奖,代表了MRSI-S-HVM亚微米贴片机?获得行业专家评审团的一致认可与高度评价。

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MRSI improves accuracy to 1.5 micrometers for MRSI-H/HVM-Series die bonders

MRSI Systems (Mycronic Group) is pleased to announce the latest advancement in the MRSI-H/HVM-series product line. Placement accuracy was tested using industry-standard glass die reference

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MRSI Systems 热烈欢迎贺尉宗出任中国区销售总监

MRSI Systems(Mycronic Group)很高兴地宣布贺尉宗(Hendry He)担任我们的中国区销售总监。他将与现有的销售团队及销售代表一起工作,并作为中国区销售代表服务市场,工作地点为上海。Hendry在半导体设备方面拥有丰富的技术知识以及销售经验。结合Hendry对中国市场的庞大网络的掌握Hendry的加入将进一步提高我们对客户需求的响应能力。

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MRSI Systems welcomes Hendry He as China Country Sales Director

MRSI Systems (Mycronic Group) is pleased to announce our new China Country Sales Director, Hendry He. He will be working alongside the existing sales team and representatives in the region and is

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MRSI receives Laser Focus World Innovators Award for HVM die bonder

MRSI Systems (Mycronic Group) a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2019 Silver Honoree for

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MRSI Mycronic Opens New Demo Center in Shenzhen, China

MRSI Systems (Mycronic Group) has opened the doors to their new “Product Demo Center” in Shenzhen, China. The new demo center is in the Huahan Innovation Office Park in the Nanshan District of

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MRSI Systems Provides MRSI-M3 Die Bonding Assembly Work Cell to Fabrinet in Silicon Valley for Fast Prototyping and New Product Introduction

North Billerica, MA, USA, May 24, 2016 — MRSI Systems, a leading provider of fully automated, ultra-precision die bonding and epoxy dispensing systems, today announces supply of its flagship

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MRSI Systems Will Demonstrate New Product MRSI-HVM3 and Sponsor the 1st Laser Executive Forum at CIOE in Shenzhen, China, September 6-9, 2017

North Billerica, MA, August 25, 2017 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems will be exhibiting at the 19th

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MRSI Systems’ New Product MRSI-HVM3 Die Bonder Has Entered Volume Production Driven by Fast and Wide Customer Adoptions

NORTH BILLERICA, Mass., March 6, 2018 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems is pleased to announce that our

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MRSI Systems将在深圳中国国际光电博览会(CIOE)上展示新产品 MRSI-HVM3 并赞助第一届国际激光技术高端论坛

美国马萨诸塞州, August 25, 2017 – 全球领先的全自动、高精度、高速贴片和点胶系统制造商,MRSI

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Mycronic acquires MRSI Systems, LLC

Täby, 1 June, 2018 – Mycronic AB (publ), acquires 100 percent of MRSI Systems, LLC (MRSI), headquartered in North Billerica, Massachusetts, in the USA. The purchase price amounts to USD 40.7

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MRSI Systems Receives Funding from State of Massachusetts for Advanced Manufacturing Initiative

Billerica, Mass., Oct, 6, 2017 – MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, has been awarded new funding by the

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MRSI Systems offers In-Line Eutectic for Direct Eutectic or Solder Reflow for GaAs & GaN

BILLERICA, MA — August 12, 2015 — MRSI Systems, a developer and manufacturer of turnkey die bonding and dispensing systems, announced today the introduction of a new automated in-line material

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MRSI Systems announces “One Stop Shop” die bonding solutions at CIOE and ECOC

STOCKHOLM, Aug. 30, 2018 — MRSI Systems (Mycronic Group) will be demonstrating our “One Stop Shop” capabilities at the 20th China International Optoelectronic Exposition (CIOE) at the Shenzhen

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MRSI Launches New MRSI-H3LD Die Bonder Targeted at the High Power Diode Laser Market

MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3 micrometer high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used in advanced

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Technical articles archive

Download articles from MRSI systems and read about how we are changing the die bonding industry.

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Applied Plasma

Atmospheric Plasma Solutions for Critical Surface Preparation Powering the future of clean manufacturing Surfx, a Mycronic Group company, develops advanced atmospheric plasma systems that

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MRSI-M3 Three Micron Die Bonder with One Micron Option

BILLERICA, MA — February 2, 2015 — MRSI Systems, a developer and manufacturer of turnkey die bonding and dispensing systems, announced today the introduction of their most advanced system with

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Crossway Technologies

Mycronic's MY700 is the only technology that offers jet capacity of 1M points per hour.

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MYWizard Convert service package

Upgrade seamlessly from Vision3D to MYWizard with MYWizard Convert. Preserve your inspection data, enhance reliability, and unlock AI-powered automation for smarter, more efficient workflows

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DELTA Service Production

pcb-assembly From rapid prototyping to ramp-up production: inside DSP’s integrated SMT setup How DELTA Service Production accelerates growth with integrated Mycronic technology As customer

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New advances in machine learning

pcb-assembly Frequently asked questions about AI is raising the bar in inspection technology New advances in machine learning In the SMT industry, we’re seeing how AI and machine learning are

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Smarter growth in the SMT factory

What happens when business is growing, components are shrinking, and both staff and production space remain the same? A visit to Allelektronik shows that the answer lies in the thoughtful

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Mycronic to showcase more versatile, high-productivity assembly solutions at IPC APEX EXPO 2024

Mycronic, the leading Sweden-based electronics assembly solutions provider, will continue to respond to growing customer demand for high-flexibility, high-productivity solutions for zero-defect

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At APEX, Mycronic highlights new development in manufacturing, led by GenI

Mycronic is a leading Sweden-based electronics assembly solutions provider and invites visitors to explore their next innovations and discover the factory of the future at APEX 2026, Anaheim,

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A game changer in high-speed jet printing

Fast, flexible jet printing with dual-head MY700 tech.

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Stretching the limits of wearable electronics

pcb-assembly Stretching the limits of wearable electronics Deep in the snow-capped mountains of Sweden, the national cross-country ski team will soon not only be pushing their limits in the