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How one Silicon Valley company is accelerating the design-to-manufacturing cycle.

Every day, manufacturers who have adopted jet printing as a replacement for stencil printing confirm their operational, financial and commercial gains.

pcb-assembly Available in the beginning of 2024 Mycronic’s stencil printing and jet printing platforms combine to produce any board at any speed. Printing without limits Business is growing for

pcb-assembly How a new vision technology is bringing faster cycle times and higher resolution to 3D AOI Faster. Sharper. Smarter. With rapid electrification comes massive change. From electric

pcb-assembly Excellence in the workplace and strong partnerships DF Elettronica's success story Italy based DF Elettronica gives us insight to their business and what makes them stand out as

Die bonding is as old as the semiconductor industry itself. From the onset, integrated circuits or ICs were developed using four levels of interconnections.

On December 28, 2023, MRSI (Mycronic Group) received the “Infostone 2023 Optical Communication Most Competitive Equipment” award for the MRSI-705HF 5 micron high force die bonder at the First

The MRSI-705 features an innovative design with a versatile thirteen-position tool bank for quick, automatic tool changes. Enhanced functionality is achieved with additional tool change banks,

In January 2025, MRSI Mycronic will sponsor and exhibit at the prestigious Chiplet Summit. This event gathers global leaders in semiconductor technology to discuss innovations in chiplet design

At the IMAPS New England Symposium, MRSI will showcase our latest innovations.

Join MRSI at the upcoming Compound Semiconductor Advanced Technology and Application Conference (CSC) taking place on May 22-23, 2024, in Suzhou, China.

Achieving precise and reliable die bonding is crucial in numerous industries, especially when demanding a high degree of parallelism between bonding surfaces.

Handling delicate, large aspect ratio, and thin dies is essential across various applications, including RF Power, Optical, and MEMS. These devices have aspect ratios exceeding 45 to 1,

MRSI has recently launched the 705HF die bonder, which is designed to cater to the requirements of power devices and advanced chip packaging. The machine is equipped with a heated bond head that

MRSI’s latest article in Chip Scale Review discusses the similarities and differences between automotive light detection and ranging (LiDAR) and optical transceivers are compared.

摘要：（第三届）激光雷达前瞻技术展示交流会于2021年12月14日-12月15日在江苏苏州举办。MRSI Systems战略市场高级总监，周利民博士出席2021（第三届）激光雷达前瞻技术展示交流会并发表“车载激光雷达光器件封装的挑战与解决方案”的演讲。

On August 8, 2021, MRSI Systems(Mycronic Group) held the grand opening of its Product Demonstration Center in Shenzhen, China. The opening ceremony was accompanied with a speech by local

MRSI (Mycronic Group) is exhibiting at the 54th International Symposium on Microelectronics from October 11-14, 2021, in San Diego, California at the Town and Country Resort.

摘要：由中国国际光电博览会(CIOE)提议设立的”中国光电博览奖“，MRSI Systems携最新的MRSI-HVM 1.5微米系列产品参评，成功入围“中国光电博览奖”。MRSI-HVM-P项目属于高端光电子封装自动化技术领域，广泛用应于当下高密度高速率的数据中心光互联和骨干网络传输用的400G +光电器件，以及5G无线应用的复杂DFB / WDM / EML TO-can TOSA /

On January 11, 2022, the Infostone 2022 Annual meeting and the 8th Heroes List awards ceremony were held. Infostone announced the 8th heroes company list, which is classified into four

5G continues to drive the needs of the Datacom supply chain which presents challenges to photonic device manufacturers. In this article featured in Laser Focus World, MRSI highlights the

MRSI Systems won the China Optoelectronics Expo Award (CIOE Award) for the latest MRSI-HVM 1.5 micron series of products. The MRSI-HVM with conveyor is an outstanding innovation, widely used in

2021 was a great year for our best-selling product, the MRSI-HVM 1.5 micron high-speed die bonder. This system meets the needs of many industries from telecom, datacom and medical devices

Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI Systems presented “Integrated Photonics Devices Volume Manufacturing Challenges & Innovative Solutions” at the 20th Infostone

Meet with MRSI Systems in San Francisco

LiDAR is an integrated optical detection and measurement system. Compared with typical radar, LiDAR can provide high-resolution distance, velocity, and geometric images, which were originally used

die-bonding MRSI Systems – IEEE Tech Insider Webinar: The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications Internet traffic has been growing at an

On November 2, 2016, MRSI Systems participated in the Commercial and Business Opportunities panel discussions at Massachusetts (MA) Integrated Photonics Manufacturing Supply Chain Meeting at MIT.

The Optical Fiber Conference (OFC) will be held at the San Diego Conference Center in San Diego, CA, USA from March 3-7, 2019. The exhibition is from March 5-7. Visit the MRSI Systems’ Booth #4541

Dr. Zhou joined MRSI Systems in 2019 as the Senior Director of Strategic Marketing. He is located in China to help develop new projects, customers, applications and markets. He also helps