Search
Mycronic receives order for two Prexision MMS
Mycronic AB (publ) has received a replacement order for two Prexision MMS from an existing customer, for delivery to Asia. The order value is in the range of USD 12-14 million. Delivery of one
High Volume division makes acquisition in Germany
Mycronic has acquired Modus High-Tech Electronics GmbH, a Dusseldorf-based provider of automated optical inspection systems for electronics volume production.
Invitation to presentation of Mycronic’s Q3 2024
Analysts, investors and media are invited to the presentation of Mycronic’s Q3 2024. The presentation will be held on October 24, 2024, at 10:00 a.m. CEST. The report is published on October 24,
Investors
Explore Mycronic’s investor relations page. Download our latest financial reports, presentations and learn more about our governance, upcoming events and find our contact information.
Policies
We will always act ethically, respect human rights and comply with rules, regulations, requirements and standards applicable to us. Learn about how we act.
Our sustainability commitment and goals
Our commitment to a sustainable electronics industry Our sustainability commitment and goals Mycronic strives to accelerate the transition to a sustainable electronics industry. Electronics have
Annual general meeting
Annual general meeting for Mycronic took place on the headquarter in Täby The annual general meeting (AGM) Annual general meeting The AGM is the Company’s highest decision-making body. All
Committees
Committees Nomination committee Audit committee Remuneration committee Nomination committee The Audit committee is appointed by the Board and consists of three Board members. Remuneration
Contact Investor Relations
Contact Investor Relations Contact Investor Relations If you have any queries regarding investments in Mycronic, please contact us.
Nomination committee
The Nomination committee represents the shareholders. Nomination committee The Nomination committee represents the shareholders and consists of four members. Its task, ahead of the AGM, is to
Our press releases
Read the latest press releases from Mycronic. We shape the future of electronics with passion, collaboration and diversity. Learn more about our solutions, products and business.
Audit committee
Colleagues discussing in production Audit committee The Audit committee is appointed by the Board and consists of three Board members. The committee is tasked with ensuring the quality of
Archive governance reports
Governance report archive the latest ten years. Archive governance reports 2022 Corporate governance report 2022 2021 Corporate governance report 2021 2020 Corporate governance report 2020 2019
MRSI Mycronic | MRSI-LEAP High-Speed Die Bonder Receives "Optical Communication Innovation Product Award" at CFCF2025
MRSI Mycronic received the "Optical Communication Innovation Product Award" at the CFCF2025 Optical Connectivity Conference. Our MRSI-LEAP High-Speed die bonder was recognized for its precision
Dr. Limin Zhou to present at the 23rd Infostone Optical Communication and Market Technology Conference (IFOC 2025)
The annual Infostone Optical Communication and Market Technology Conference (IFOC 2025) is scheduled for September 8-9, 2025, at the InterContinental Hotel within the Shenzhen World Exhibition
Driving the Future: Dr. Limin Zhou to Present on AI-Driven Optical Module Packaging at the Innovation Conference on CPO (Co-Packaged Optics) and Heterogeneous Integration Technology
The Innovation Conference on CPO and Heterogeneous Integration Technology will take place September 4-6, 2025, in Wuxi, China. During the conference, Dr. Limin Zhou will discuss recent and
Join us in Denmark!
MRSI is thrilled to announce our participation at the ECOC Exhibition in Copenhagen, Denmark, taking place from September 29 to October 1, 2025. As a global leader in advanced packaging solutions,
Join Us at the IMAPS Symposium
MRSI is pleased to announce our participation as an exhibitor at the upcoming 58th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and
MRSI to present at the 21st Infostone Optical Communication Market and Technology Conference
MRSI will be presenting at the Infostone Optical Communication Market and Technology Conference which will be held at the Hyatt Regency Shenzhen Airport Hotel in Shenzhen, China from September
MRSI Systems is excited to launch our free software training video program!
MRSI has produced immersive software training videos to optimize your company’s experience with our cutting-edge die bonding and epoxy dispensing systems. MRSI wants the acquisition of our
MRSI-705HF 5 micron high force die bonder won the award for “Infostone 2023 Optical Communication Most Competitive Equipment
On December 28, 2023, MRSI (Mycronic Group) received the “Infostone 2023 Optical Communication Most Competitive Equipment” award for the MRSI-705HF 5 micron high force die bonder at the First
MRSI Support for Application Specific Pickup Tip Designs
The MRSI-705 features an innovative design with a versatile thirteen-position tool bank for quick, automatic tool changes. Enhanced functionality is achieved with additional tool change banks,
Join MRSI at IMS in San Diego
The International Microwave Symposium (IMS) is an annual conference that brings together the brightest minds in the microwave and RF industry. This year's event will take place in San Diego, CA,
Two ways our MRSI Systems Machines offer efficiency and productivity to our customers
Jack Inocencio, the Sr. Manager of Applications and Service, extended some conducive knowledge on why MRSI System’s products will accelerate photonics manufacturers’ efficiency and
MRSI to sponsor and present at IMAPS New England this May
die-bonding MRSI to sponsor and present at IMAPS New England this May MRSI Systems is delighted to announce another opportunity to see us this spring. We will be a featured Platinum Sponsor along
Dr. Limin Zhou to present at the CHIP China Conference
Dr. Limin Zhou, General Manager, MRSI Automation (Shenzhen) Co., Ltd., Senior Director of Strategic Marketing, MRSI Systems will present “Discussion on New Challenges and Solutions of Chip
Learn why the MRSI-705 is an industry leader in flexibility and reliability
The MRSI-705 5-micron flip-chip die bonder has the largest installed base in photonics packaging, microwave modules, RF power amplifiers, infrared sensors, and medical devices.
An update on our free software training video program
Our launch of our free software training outlined the cadence of how 1 training video would be released a week. Since then, we are proud to announce we have released five new videos with more to
MRSI Mycronic to present at Automotive LIDAR 2023
Join us at the 6th annual Automotive LIDAR conference and exhibition from October 3-5, 2023. This conference is the only event in the world exclusively focused on automotive LIDAR technologies
Advancing Microelectronics: MRSI Mycronic’s Presence at IMAPS New England
At the IMAPS New England Symposium, MRSI will showcase our latest innovations.