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Complex Hybrid Circuits are used in a variety of high reliability applications including military, aerospace, medical, and photonics. MRSI offers dispense and die bonding solutions specifically

LiDAR is an integrated optical detection and measurement system. Compared with typical radar, LiDAR can provide high-resolution distance, velocity, and geometric images, which were originally used

The following excerpt from MRSI Systems latest article published in Laser Focus World Magazine demonstrates how the latest advanced automated die bonding systems are transforming the world of

Customers require an application-specific specialized die bonder for HVM of CoS that is able to deliver high speeds while maintaining flexibility.

die-bonding MRSI Systems – IEEE Tech Insider Webinar: The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications Internet traffic has been growing at an

This excerpt from MRSI Systems featured article in Laser Focus World highlights the photonics industry challenges of data center applications and how the photonics industry can respond:

MRSI Systems will be demonstrating our “One Stop Shop” capabilities at the 20th China International Optoelectronic Exposition (CIOE) at the Shenzhen Convention and Exhibition Center with our

MRSI Systems is exhibiting at the 51st International Symposium on Microelectronics from October 8-11, 2018 in Pasadena, California at the Pasadena Convention Center.

On November 2, 2016, MRSI Systems participated in the Commercial and Business Opportunities panel discussions at Massachusetts (MA) Integrated Photonics Manufacturing Supply Chain Meeting at MIT.

Increasing demand for data and bandwidth requires high volume manufacturing (HVM) of photonics devices. This expansion with double-digit growth rates...

3D Sensing Tailored Packaging Solutions for 3D Sensing Devices 3D sensing devices demand unique packaging solutions due to the diverse and often non-standard requirements of different customers.

Sustainability Our commitment and goals Our sustainability impact Key area: Innovation for sustainability Key area: Engineers through diversity Key area: Climate impact Responsible business

Our commitment to a sustainable electronics industry Our sustainability commitment and goals Mycronic strives to accelerate the transition to a sustainable electronics industry. Electronics have

We promote diversity in a broader sense for younger generations to choose engineering careers. Key area: Future engineers through diversity A diverse and inclusive workplace, where everyone feels

Mycronic’s strategy is to be a market-leading solutions provider within selected niches of electronics production with a high degree of recurring revenue. Prioritizing innovation, brand building

Mycronic’s four decentralized divisions allow it to stay close to customers in Asia, Europe, and North America. Divisions include Pattern Generators; PCB Assembly Solutions; Assembly Solutions

Expertise and innovation, the ability to create new products. Expertise and innovation Mycronic Group has a long history of innovation in many areas such as pattern generation, jet printing, die

Mycronic’s 40-year history is based on innovation, entrepreneurship and working closely with customers. In 2009, former Mycronic Laser Systems and MYCRONIC became a unified force.

Innovation in wireless technology leads to faster and smarter networks. 5G and the Internet of Things (IoT) have the capacity to connect everyone & devices.

Eutectic bonding is used as an alternative to epoxy bonding. The choice of eutectic bonding is determined by the application and the technical requirements.

Leading optoelectronic and semiconductor packaging companies require fully automated, ultra-precision die bonding systems

During the summer, China Fiber Optics Online (CFOL), interviewed Dr. Limin Zhou, Senior Strategic Marketing Director of MRSI Mycronic to discuss MRSI’s latest product development and some of the

As consumers expect more power and more bandwidth from their devices, we see the Advanced Electronic Packaging industry under continuing pressure to cram more technology into smaller spaces. One

Increasing demand for high-volume manufacturing accelerates the continuing adaptation of full automation in advanced eutectic packaging.

Innovation and new market factors are driving advanced packaging. In this post, we highlight some of the trending topics propelling advanced packaging.

In March 2017, MRSI Systems participated in The MIT Microphotonics Center and AIM Photonics Spring Meeting for Integrated Photonics Manufacturing Meeting.

Ezer Espares has over 25 years of experience in semiconductor packaging, testing, and equipment support, including installations and customer support.

MRSI Systems is exhibiting at the 67th ECTC focused on the global microelectronics packaging industry.

Interim Report January-June 2025 Second quarter Order intake amounted to SEK 1,330 (2,125) million, a decline of 37 percent Net sales increased 35 percent to SEK 2,066 (1,527) million. Based on

Interim Report January-September 2025 Third quarter Order intake amounted to SEK 2,431 (1,459) million, an increase of 67 percent Net sales declined 4 percent to SEK 1,709 (1,780) million. Based