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Mycronic AB (publ) has received a replacement order for a Prexision 8 Evo from an existing customer, for delivery to Asia. The order value is in the range of USD 13-15 million. Delivery of the

die-bonding MRSI Mycronic IMAPS New England 2025 Join MRSI Mycronic at IMAPS New England in May! MRSI Mycronic will be exhibiting, sponsoring, and presenting at the IMAPS New England event on May

The MRSI-705 features an innovative design with a versatile thirteen-position tool bank for quick, automatic tool changes. Enhanced functionality is achieved with additional tool change banks,

In January 2025, MRSI Mycronic will sponsor and exhibit at the prestigious Chiplet Summit. This event gathers global leaders in semiconductor technology to discuss innovations in chiplet design

Join MRSI at the upcoming Compound Semiconductor Advanced Technology and Application Conference (CSC) taking place on May 22-23, 2024, in Suzhou, China.

At the recent IMAPS Conference in Arizona, co-planarity in die bonding was a key topic due to its importance in 2.5 and 3D chip stacking.

Achieving precise and reliable die bonding is crucial in numerous industries, especially when demanding a high degree of parallelism between bonding surfaces.

Handling delicate, large aspect ratio, and thin dies is essential across various applications, including RF Power, Optical, and MEMS. These devices have aspect ratios exceeding 45 to 1,

We are pleased to announce we are exhibiting with our distributor PREM at NEPCON Thailand, scheduled from June 18-21, 2025, at BITEC in Bangkok.

Plan now to visit our booth #5407 at SPIE Photonics West, January 28–30, 2025 in San Francisco, CA. Discover our latest technologies, including newly released active alignment solutions and the

摘要：（第三届）激光雷达前瞻技术展示交流会于2021年12月14日-12月15日在江苏苏州举办。MRSI Systems战略市场高级总监，周利民博士出席2021（第三届）激光雷达前瞻技术展示交流会并发表“车载激光雷达光器件封装的挑战与解决方案”的演讲。

On January 11, 2022, the Infostone 2022 Annual meeting and the 8th Heroes List awards ceremony were held. Infostone announced the 8th heroes company list, which is classified into four

OFC will be held at the San Diego Conference Center from March 6-10th, 2022 in San Diego, CA, USA. OFC is the largest global conference and exposition for optical communications.

MRSI Systems won the China Optoelectronics Expo Award (CIOE Award) for the latest MRSI-HVM 1.5 micron series of products. The MRSI-HVM with conveyor is an outstanding innovation, widely used in

2021 was a great year for our best-selling product, the MRSI-HVM 1.5 micron high-speed die bonder. This system meets the needs of many industries from telecom, datacom and medical devices

Join us in our booth at the Denver, Colorado IMS event this month to talk with us and build connections! We will be more than happy to discuss the current products our company has to offer.

MRSI is attending and sponsoring the 18th Annual IMAPS Device Packaging Conference and Exhibition.

MRSI Systems is exhibiting at the IEEE 72nd Electronics Components and Technology Conference from June 1-3, 2022 in San Diego, CA. Stop by the MRSI Booth #613 to learn how we can help solve your

The 2022 Electronics Components and Technology Conference in San Diego was a tremendous success. We would like to thank everyone who attended the conference and to those who stopped by our booth

Leading optoelectronic and semiconductor packaging companies require fully automated, ultra-precision die bonding systems

As consumers expect more power and more bandwidth from their devices, we see the Advanced Electronic Packaging industry under continuing pressure to cram more technology into smaller spaces. One

MRSI Systems has been a leading supplier to manufacturers of advanced optical packaging assembly for over 30 years. This has enabled MRSI to build unmatched expertise in the assembly technologies

Customers require an application-specific specialized die bonder for HVM of CoS that is able to deliver high speeds while maintaining flexibility.

When it comes to epoxy dispensing your vendor system must offer the ultimate flexible platform for demanding environments. The epoxy dispenser should meet the highest standards of reliability and

The Global deployment of 5G and the exponential growth of data centers is driving the demand for high-performance optical devices.

Mark your calendars for September 9-10, 2024, at the InterContinental Hotel of the Shenzhen World Exhibition and Convention Center in Shenzhen, China, which hosts the highly anticipated Infostone

Learn more about epoxy bleed from industry expert Tom Green. Here is the abstract of the white paper Silver Epoxy Turns Black After an Oxygen Plasma Clean Prior to Wire Bonding

MRSI Mycronic is exhibiting at the 57th International Symposium on Microelectronics from October 1-2, 2024, in Boston, MA. The event will take place at the Encore Boston Harbor from October 1-3,

MRSI is proud to be exhibiting and presenting at the 25th China International Optoelectronic Exposition this year in Shenzhen. Stop by our booth #10B79 to learn more about how MRSI products meet

Complex Hybrid Circuits are used in a variety of high reliability applications including military, aerospace, medical, and photonics. MRSI offers dispense and die bonding solutions specifically