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Mycronic publishes Annual Report 2025

Mycronic AB (publ) today publishes its Annual Report 2025, which can be downloaded as a PDF from the report archive on the company’s website.

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Our press releases

Read the latest press releases from Mycronic. We shape the future of electronics with passion, collaboration and diversity. Learn more about our solutions, products and business.

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Remuneration committee

Remuneration committee Remuneration committee The Remuneration committee is appointed by the Board and consists of three Board members. The Committee is tasked with proposing the CEO’s salary,

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Remuneration to the CEO

Remuneration Remuneration to the CEO and other senior executives The principles for remuneration to the CEO and other senior executives are approved by the Annual General Meeting. The proposed

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Governance

Learn more about Mycronic’s corporate governance. Find out how we divide responsibilities and read our corporate governance reports and articles of association.

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Annual general meeting

Annual general meeting for Mycronic took place on the headquarter in Täby The annual general meeting (AGM) Annual general meeting The AGM is the Company’s highest decision-making body. All

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Committees

Committees Nomination committee Audit committee Remuneration committee Nomination committee The Audit committee is appointed by the Board and consists of three Board members. Remuneration

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Nomination committee

The Nomination committee represents the shareholders. Nomination committee The Nomination committee represents the shareholders and consists of four members. Its task, ahead of the AGM, is to

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Audit committee

Colleagues discussing in production Audit committee The Audit committee is appointed by the Board and consists of three Board members. The committee is tasked with ensuring the quality of

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Capital Markets Day 2022

Capital markets day 2022 Presentation and all videos from Mycronic's Capital markets day 2022  Mycronic's presentation on Capital markets day 2022 (pdf) Full version of Capital Markets

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Archive governance reports

Governance report archive the latest ten years. Archive governance reports 2022 Corporate governance report 2022 2021 Corporate governance report 2021 2020 Corporate governance report 2020 2019

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Communiqué from the Annual General Meeting and statutory meeting of the Board of Directors of Mycronic AB (publ)

The Annual General Meeting of Mycronic AB (publ) was held on May 7, 2025. The Annual General Meeting was carried out with the physical presence of shareholders and representatives. The

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Interim Report January-March 2025

Interim Report January-March 2025 First quarter Order intake amounted to SEK 2,058 (1,645) million, an increase of 25 percent Net sales increased 27 percent to SEK 2,142 (1,692) million. Based on

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Interim Report January-June 2025

Interim Report January-June 2025 Second quarter Order intake amounted to SEK 1,330 (2,125) million, a decline of 37 percent Net sales increased 35 percent to SEK 2,066 (1,527) million. Based on

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Mycronic receives order for three mask writers

Mycronic AB (publ) has received an order for three mask writers from an existing customer in Asia: one Prexision 8 Evo and two Prexision Lite 8 Evo. The order value is in the range of USD 48-52

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Invitation to the presentation of Mycronic’s Q2 2025

Analysts, investors and media are invited to the presentation of Mycronic’s Q2 2025. The presentation will be held on July 11, 2025, at 10:00 a.m. CEST. The report is published on July 11, 2025, at

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Multiple Die Eutectic Bonding

Eutectic bonding is used as an alternative to epoxy bonding. The choice of eutectic bonding is determined by the application and the technical requirements.

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How to Choose a Die Bonding System

Leading optoelectronic and semiconductor packaging companies require fully automated, ultra-precision die bonding systems

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Flexible Automation Solutions to Accelerate LiDAR Automotive Applications

LiDAR is an integrated optical detection and measurement system. Compared with typical radar, LiDAR can provide high-resolution distance, velocity, and geometric images, which were originally used

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MRSI Systems – IEEE Tech Insider Webinar: The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications

die-bonding MRSI Systems – IEEE Tech Insider Webinar: The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications Internet traffic has been growing at an

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MRSI Systems Presented at Massachusetts Integrated Photonics Manufacturing Supply Chain Meeting held at MIT in Conjunction with 2016 AIM Photonics / MIT Microphotonics Center Fall Meeting

On November 2, 2016, MRSI Systems participated in the Commercial and Business Opportunities panel discussions at Massachusetts (MA) Integrated Photonics Manufacturing Supply Chain Meeting at MIT.

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Visit MRSI Systems at the Optical Fiber Conference in San Diego

The Optical Fiber Conference (OFC) will be held at the San Diego Conference Center in San Diego, CA, USA from March 3-7, 2019. The exhibition is from March 5-7. Visit the MRSI Systems’ Booth #4541

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Dr. Limin Zhou Joins MRSI Systems – Strategic Marketing

Dr. Zhou joined MRSI Systems in 2019 as the Senior Director of Strategic Marketing. He is located in China to help develop new projects, customers, applications and markets. He also helps

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High Volume Manufacturing of Photonic Components and Modules

Increasing demand for data and bandwidth requires high volume manufacturing (HVM) of photonics devices. This expansion with double-digit growth rates...

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MRSI Systems Integrates In Situ Light Measurement for AOC into Die Bonder

BILLERICA, MA — April 22, 2015 — MRSI Systems, a developer and manufacturer of turnkey chip placement and dispensing systems, has integrated in situ light measurement for Active Optical Cable

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Visit MRSI Systems at SEMICON China 2019 in Shanghai

MRSI Systems is exhibiting at SEMICON China in Shanghai, March 20-22, 2019, at the Shanghai New International Expo Centre. Please stop by the CYCAD Century Science & Technology Booth #2567.

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MRSI钱毅博士:5G时代自动化贴片系统的发展趋势

5G时代的到来势不可挡,而这一趋势也不断对芯片的贴片、封装工艺提出新的要求。在此背景下, 作为全球光电器件自动化贴片封装设备的领军企业, MRSI Systems也适时推出了新产品、新技术。在今年9月的深圳光博会上,MRSI的产品管理和市场营销副总裁钱毅博士向OFweek光通讯网介绍了MRSI的产品、研发优势及未来的市场趋势。

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MRSI Systems Provides MRSI-M3 Die Bonding Assembly Work Cell to Fabrinet in Silicon Valley for Fast Prototyping and New Product Introduction

North Billerica, MA, USA, May 24, 2016 — MRSI Systems, a leading provider of fully automated, ultra-precision die bonding and epoxy dispensing systems, today announces supply of its flagship

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MRSI Systems Will Demonstrate New Product MRSI-HVM3 and Sponsor the 1st Laser Executive Forum at CIOE in Shenzhen, China, September 6-9, 2017

North Billerica, MA, August 25, 2017 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems will be exhibiting at the 19th

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MRSI Systems’ New Product MRSI-HVM3 Die Bonder Has Entered Volume Production Driven by Fast and Wide Customer Adoptions

NORTH BILLERICA, Mass., March 6, 2018 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems is pleased to announce that our