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Optical Fiber Conference and Exposition (OFC) 2018 – San Diego
The exhibition is from March 13th-March 15th. Visit the MRSI Systems’ Booth #4444 at OFC 2018. Enjoy a free “Exhibits Plus Pass” Compliments of MRSI Systems.
Visit MRSI Systems at Productronica 2017 in Munich, Germany
die-bonding Visit MRSI Systems at Productronica 2017 in Munich, Germany Productronica is the world’s leading international trade fair for innovative electronics production. The
MRSI Systems is Exhibiting at SPIE Photonics West
SPIE Photonics West will be held at the Moscone Center in San Francisco, CA from Jan 27-Feb 1. This is the flagship event for companies in the photonics.
MRSI Systems’ Exceptional Customer Support
die-bonding MRSI Systems’ Exceptional Customer Support After the sale, the real test of a quality business is what happens next. What happens if I have a problem? Can you reach a human being
MRSI Systems’ Customer Support – Peter Cronin
Customers appreciate the extensive product knowledge that the team has and that they are able to talk to a person that knows them and their machine.
IMS 2019 Boston
die-bonding IMS 2019 Boston The International Microwave Symposium was held at the Pennsylvania Convention Center in Philadelphia last month. The event was well attended with over 8,400
International Microelectronics Assembly and Packaging Society (IMAPS) Symposium 2017
The 50th Annual International Symposium on Microelectronics will be held October 9-12, 2017, in Raleigh, North Carolina. MRSI Systems will be exhibiting.
Policies
We will always act ethically, respect human rights and comply with rules, regulations, requirements and standards applicable to us. Learn about how we act.
Key area: Climate impact
Mycronic strives to achieve the goals of the Paris Climate Agreement. Key area: Climate impact We have set science-based targets to reduce our greenhouse gas emissions in alignment with the Paris
Responsible business practices
Our business is conducted responsibly by following robust, clearly defined routines and by promoting a responsible business culture. Responsible business practices Mycronic strives to ensure that
Supplier Code of Conduct for Service Providers and non-critical Suppliers
ID: 80566 | Version: 3 | Published: May 08, 2025 Mycronic group Supplier Code of Conduct for Service providers and non-critical Suppliers The purpose of this Supplier Code of Conduct for Service
WEEE
WEEE-Marking Mycronic AB supplies products Business to Business. All qualifying products are marked with the crossed-out wheelie bin to encourage proper recycling of our products. Recycling
Distributor Code of Conduct
ID: 80225 | Version: 5 | Published: September 11, 2024 Mycronic Group Distributor Code of Conduct The purpose of this Distributor Code of Conduct (“DCoC”) is to outline the minimum ethical
Supplier Code of Conduct
ID: 80370 | Version: 4 | Published: May 08, 2025 Mycronic group Supplier Code of Conduct The purpose of this Supplier Code of Conduct (“SCoC”) is to outline the minimum ethical standards and
Code of Conduct
Mycronic Group Code of Conduct ID: 80381 | Version: 6 | Published: May 15, 2025 | Approved at board meeting 2025-05-07 Mycronic Group Code of Conduct The Mycronic Group Code of Conduct represents
Quality & environmental policy
ID: 80018 | Version: 2 | Published: 2024-05-02 Mycronic group quality and environmental policy Mycronic’s vision is to be the most trusted partner to the creators of tomorrow’s electronics. We
Interview with MRSI: Accuracy is improved to 1.5 microns to meet the 5G and 400G high-speed interconnection era of optical device automated placement solution system
During the summer, China Fiber Optics Online (CFOL), interviewed Dr. Limin Zhou, Senior Strategic Marketing Director of MRSI Mycronic to discuss MRSI’s latest product development and some of the
Building Complex Hybrid Circuits-Advanced Packaging
Complex Hybrid Circuits are used in a variety of high reliability applications including military, aerospace, medical, and photonics. MRSI offers dispense and die bonding solutions specifically
Challenges in High-Volume Manufacturing for Die Attach Systems
Increasing demand for high-volume manufacturing accelerates the continuing adaptation of full automation in advanced eutectic packaging.
VPT Components and MRSI Systems jointly address manufacturing challenges
Learn more about how VPT Components and MRSI Systems jointly address manufacturing challenges.
4 Recent Topics in Advanced Packaging
Innovation and new market factors are driving advanced packaging. In this post, we highlight some of the trending topics propelling advanced packaging.
Case Study – The Latest Die Bonding Solutions for Photonics Manufacturing
This case study explains how MRSI achieved high throughput for high volume high mix production with flexible high volume high precision using their latest die bonding systems.
MRSI Systems Participated in MIT Microphotonics Center / AIM Photonics Spring Technical Meeting in Cambridge
In March 2017, MRSI Systems participated in The MIT Microphotonics Center and AIM Photonics Spring Meeting for Integrated Photonics Manufacturing Meeting.
2017 Optical Fiber Communication Conference and Exhibition (OFC) Highlights
die-bonding 2017 Optical Fiber Communication Conference and Exhibition (OFC) Highlights MRSI Systems is a frequent participant at OFC. OFC gave us an opportunity to meet with our customers and
MRSI Systems Customer Support Team – Ezer Espares
Ezer Espares has over 25 years of experience in semiconductor packaging, testing, and equipment support, including installations and customer support.
ECTC – The 67th Electronic Components and Technology Conference
MRSI Systems is exhibiting at the 67th ECTC focused on the global microelectronics packaging industry.
MRSI Systems Launches New Software Video Training Programs
MRSI is now offering an extensive library of software training videos for your MRSI die bonding and epoxy dispense systems.
MRSI Systems’ Dr. Yi Qian: The Latest Solution for Automated Manufacturing of Optoelectronic Devices in the 5G Era
The 21st China International Optoelectronic Expo (CIOE) was held at the Shenzhen Convention and Exhibition Center from September 4-7th, 2019. As the world leader in optoelectronic device
MRSI Systems Announces “One Stop Shop” Die Bonding Solutions & Participation at CIOE and ECOC
MRSI Systems will be demonstrating our “One Stop Shop” capabilities at the 20th China International Optoelectronic Exposition (CIOE) at the Shenzhen Convention and Exhibition Center with our
MRSI Shenzhen Demo Center grand opening ceremony
On August 8, 2021, MRSI Systems(Mycronic Group) held the grand opening of its Product Demonstration Center in Shenzhen, China. The opening ceremony was accompanied with a speech by local