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Bruno Afonso joins MRSI – Sales
Bruno Afonso has joined MRSI as the Sales Director, EMEA. He is located in Switzerland and earned his BA in Industrial Engineering and his Master Degree in Electrical Engineering from Universidade
Join MRSI at the International Microwave Symposium
The world’s largest Microwave and RF industry event is being held virtually this year.
Mycronic share
Learn about share performance, dividends, share capital, largest shareholders, share distribution and insiders. See the latest price, change, volume and historical data for Mycronic’s share.
Key area: Innovation for sustainability
Through innovation, we can accelerate the transition of the electronics industry towards a more sustainable future. For Mycronic, sustainable innovation is about developing products that help our
Purpose & vision
The Mycronic brand and company purpose is to “bring electronics to life”. The vision is “to be the most trusted partner to the creators of tomorrow’s electronics.”
Thank you for contacting us!
Thank you for contacting us! We read every message and typical respond within 48 hours if a reply is required. Do you want to know more about us? You can read our current news, press releases,
MRSI Systems Wins Years-Long Litigation Against Palomar Technologies By Invalidating Palomar’s “Double Pick” Patent
Chief Judge of federal court in Boston knocks out Palomar’s claim of infringement for its “double pick” patent allegedly covering a manufacturing process; court rules that claimed method is “so
MRSI Systems Launches High Speed Die Bonder for Photonics High Volume Manufacturing
BILLERICA, Mass., August 14, 2017 – MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, is launching a new High Speed
MRSI Systems推出新型MRSI-H3LD高速贴片机
MRSI系统公司(Mycronic集团)推出MRSI-H3LD新型3微米高速贴片机,专用于大功率半导体激光器中的芯片贴片,广泛应用于工业激光器、光纤放大、光源和传感器等先进光电子应用。
MRSI Systems Launches MRSI-HVM3P for New Applications Extending the MRSI-HVM3 Die Bonder Family
BILLERICA, Massachusetts, Aug. 29, 2018 — MRSI Systems (Mycronic Group), is expanding its leading high speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer
MRSI Announces HVM3 Die Bonding Demonstration Capability in Shenzhen China
STOCKHOLM, Nov 9, 2018 — MRSI Systems (Mycronic Group) announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in the Longhua district,
Join us at the upcoming events!
MRSI Mycronic will be participating in several optical and device packaging exhibitions. We invite you to attend these upcoming events. We look forward to discussing our latest product
MRSI Mycronic to Present at the 7th Annual Automotive LIDAR Conference
MRSI Mycronic is proud to sponsor the 7th Annual Automotive LIDAR Conference, taking place online from November 20-21, 2024.
Dr. Limin Zhou to present at the Semiconductor Advanced Technology Innovation Development and Opportunities Conference
The rapid adoption of artificial intelligence is driving advancements in optical interconnect technology, resulting in notable improvements in speed, power efficiency, and cost reduction. This
Innovation Continues on MRSI-705HF
Last year, MRSI Systems launched the MRSI-705HF high force die bonder, a new version of the trusted MRSI-705 that is perfect for sintering and thermocompression bonding applications.
MRSI-175Ag – A flexible epoxy dispensing solution
The MRSI-175Ag Conductive Epoxy Dispenser handles the most demanding dispensing applications such as semiconductor packaging, Microwave & RF modules, multichip modules, optical modules,
Meet the MRSI-705: Your Essential Tool for Precision and Reliability in Critical Applications
The MRSI-705 has established itself as a reliable tool in the aerospace, defense, and medical industries, playing a crucial role in mission-critical tasks due to its performance, adaptability,
Software Video Training Programs for Die Bonding and Epoxy Dispense Systems
These videos help you to discover advanced features of our MRSI machines, which will ensure your production line is optimized.
Exploring Automotive LiDAR Packaging Trends
In the November/December 2023 issue of Chip Scale Review, MRSI delves into the fascinating world of automotive light detection and ranging (LiDAR) technology. This article explores the parallels
Join MRSI at the China International Optoelectronic Conference (CIOE)
At the exhibition, MRSI will provide live product demos of the recently launched MRSI-H-HPLD+, a new variant of the successful MRSI-H-HPLD that is tailored for high-power laser die attachment
Advancing automation: unleashing the power of the automatic tool changing turret
In the world of chip packaging and advanced die bonding, the pursuit of efficiency, accuracy, and productivity is a continuous endeavor. MRSI’s die bonding systems offer a cutting-edge patented
MRSI New Solution: Tape Holder
If you are looking to pick from tape and do not have a tape and real feature on your machine, then we have a solution for you. The two inch metal tape holder can accommodate four two-inch strips
Watch MRSI’s Software Training Videos
die-bonding Watch MRSI’s Software Training Videos MRSI has released a comprehensive set of software training videos that are designed to help users get the most out of their MRSI Machines. These
MRSI to present and attend Auto Lidar Tech 2023
MRSI will attend the 5th Auto Lidar Tech Forum from Jun 5-7th in Suzhou, China. This event will focus on the market trends, technological breakthroughs, and practical applications of LIDAR
Die Bonder
Choosing a die bonder is important, and we advise considering all options before making a purchase. With MRSI Systems, you can find exactly what you need.
International Microwave Symposium 2018
MRSI Systems is exhibiting at IMS (Booth #448)—the world’s largest Microwave and RF industry event in Philadelphia, PA at the Pennsylvania Convention Center June 10-15, 2018.
Case Study – Leading Photonic Component Manufacturer Selects MRSI Systems to Produce Photonic Components Faster
The demand for data and bandwidth continues to expand, resulting in the requirement for high volume manufacturing of photonics devices at unprecedented levels.
Featured Article Laser Focus World: Challenges for photonics manufacturing in the new data center era
MRSI’s latest article in Laser Focus World’s August Issue Challenges for photonics manufacturing in the new data center era, discusses the high volume and high mix nature of photonics
Contact us
Contact MRSI Systems in Massachusetts for product information, technical support and more. Contact MRSI Systems today for more information!
Board of directors
Board members About board of directors Contact Investor Relations Interior view from Mycronic HQ Board of directors Patrik TIgerschiöld, Chairman of the Mycronic board Arun Bansal, independent