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MRSI Systems (Mycronic Group) is pleased to announce our new China Country Sales Director, Hendry He. He will be working alongside the existing sales team and representatives in the region and is

die-bonding Laser Focus World Innovators Award 2023 MRSI Systems wins Silver Honoree for Laser Focus World Innovators Award 2023 MRSI Systems, a part of Mycronic Group, a leading manufacturer of

MRSI Systems(Mycronic Group)目前已经在中国深圳正式创建了新的产品演示中心，该产品演示中心落成于深圳市南山区朗山路华瀚创新园。

die-bonding MRSI receives Laser Focus World Silver Award for MRSI-H-HPLD Die Bonder MRSI receives Laser Focus World Silver Award for MRSI-H-HPLD Die Bonder MRSI Systems (Mycronic Group), a

The emergence of two-and-a-half-dimensional (“2.5D”) and three-dimensional (“3D”) (collectively, “2.5D/3D”) integrated circuit packaging technology is creating another compelling opportunity for

2021年9月27日，由 Laser Focus World 主办的“2021年度创新大奖”评选落下帷幕，MRSI Systems(Mycronic Group)凭借MRSI-H-TO 1.5微米贴片机系列产品荣膺银奖，该奖项为生产设备类的最高奖。

MRSI Systems will present at the 19th Infostone Optical Communications (IFOC) Conference, organized by Infostone Communication Consultant. The event will take place in Shenzhen, China from

MRSI Systems很高兴地宣布与Lumentum达成新合作("Lumentum"，纳斯达克代码:LITE)，Lumentum是汽车行业光子芯片和光模块的全球领导者。此次合作有望为该行业带来创新的激光雷达解决方案。

摘要：MRSI Systems, Mycronic Group的MRSI-S-HVM亚微米贴片机荣获“2020年度光通信最具竞争力产品”奖，代表了MRSI-S-HVM亚微米贴片机?获得行业专家评审团的一致认可与高度评价。

MRSI Systems (Mycronic Group) is pleased to announce the latest advancement in the MRSI-H/HVM-series product line. Placement accuracy was tested using industry-standard glass die reference

MRSI Systems（Mycronic Group）很高兴地宣布贺尉宗(Hendry He)担任我们的中国区销售总监。他将与现有的销售团队及销售代表一起工作，并作为中国区销售代表服务市场，工作地点为上海。Hendry在半导体设备方面拥有丰富的技术知识以及销售经验。结合Hendry对中国市场的庞大网络的掌握Hendry的加入将进一步提高我们对客户需求的响应能力。

MRSI Systems (Mycronic Group) a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2019 Silver Honoree for

die-bonding MRSI to exhibit with live demonstrations and present at LASER World of PHOTONICS CHINA We are pleased to announce that MRSI, Mycronic Group will be exhibiting at LASER World of

die-bonding MRSI launches new die bonders with improved accuracy MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and

MRSI Systems (Mycronic Group) has opened the doors to their new “Product Demo Center” in Shenzhen, China. The new demo center is in the Huahan Innovation Office Park in the Nanshan District of

MRSI will be presenting at the Infostone Optical Communication Market and Technology Conference which will be held at the Hyatt Regency Shenzhen Airport Hotel in Shenzhen, China from September

MRSI has produced immersive software training videos to optimize your company’s experience with our cutting-edge die bonding and epoxy dispensing systems. MRSI wants the acquisition of our

The International Microwave Symposium (IMS) is an annual conference that brings together the brightest minds in the microwave and RF industry. This year's event will take place in San Diego, CA,

Jack Inocencio, the Sr. Manager of Applications and Service, extended some conducive knowledge on why MRSI System’s products will accelerate photonics manufacturers’ efficiency and

die-bonding MRSI to sponsor and present at IMAPS New England this May MRSI Systems is delighted to announce another opportunity to see us this spring. We will be a featured Platinum Sponsor along

MRSI is excited to announce we will be exhibiting at the 49th exhibition of ECOC in Glasgow, Scotland from October 2-4, 2023.

Dr. Limin Zhou, General Manager, MRSI Automation (Shenzhen) Co., Ltd., Senior Director of Strategic Marketing, MRSI Systems will present “Discussion on New Challenges and Solutions of Chip

The MRSI-705 5-micron flip-chip die bonder has the largest installed base in photonics packaging, microwave modules, RF power amplifiers, infrared sensors, and medical devices.

Our launch of our free software training outlined the cadence of how 1 training video would be released a week. Since then, we are proud to announce we have released five new videos with more to

Epoxy die bonding, sometimes referred to as epoxy die attach, is the most widely used die bonding technique in semiconductor assembly.

Learn more about MRSI Systems Applications including Microelectronics, Microwave & RF as well as Photonics and Sensors.

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On December 6, 2024, Infostone successfully held its 2024 Annual Summary and the 11th Heroes List Award live conference. Awards presented included "The Most Competitive Products of Optical

Ultra-high-speed die bonding technology is pivotal in modern manufacturing, particularly for optical modules production. The MRSI-LEAP Ultra-High-Speed Die Bonders exemplify this advancement,